Nextron Has Ready Solutions for Intel’s New Generation Sapphire Rapids CPU of Eagle Stream Platform
Compared to water cooling solutions, air cooling heatsinks are more cost-efficient for HPC systems.
As an expert in chassis heat dissipation design, Nextron has ready solutions for Intel’s new generation Sapphire Rapids CPU of Eagle Stream platform.
The solution is designed under Intel Xeon thermal guideline. High conductivity materials such as copper and aluminum are selected for 3x D6mm heat pipes. Heatsink fins are densely allocated while maximizing airflow through the fins.
In addition to the outstanding heat dissipation ability, the design is highly customizable according to individual needs.
Feature
· For 2022 Intel next generation platform as Eagle Stream
· New design and high thermal performance
- Excellent heat conductivity base (Copper + Aluminum + D6mm Heat-pipe by 3pcs)
- High density of fin stack for cooling area
- TDP up to 205 Watts
Technical Characteristics
· Application CPU: Sapphire Rapids-SP
· Application CPU Socket: LGA 4677-1
· HS Dimension: 118 x 78 x 24.7mm
· Base Thickness: 4.5mm
· Base Material: Aluminum / Copper Block / D6 mm Heat Pipe x 3pcs
·Fin Material: Aluminum
· Fin Thickness and Q’ty: T = 0.3mm / 48pcs
· HS Mass: 274g
Heat Sink Performance Chart
The mock-up sample testing data by thermal wind tunnel:
· φ: 0.208 °C/W ∆P: 0.32Inch-H2O @12CFM for 170W
· φ: 0.158 °C/W ∆P: 0.64Inch-H2O @20CFM for 205W
Application
· Rack Server
· Blade Server
· Storage Server
· Data Server
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本文由翊翊所思转载自Nextron，原文标题为:Intel Sapphire Rapids LGA4677 Thermal Solution，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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产品型号
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品类
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工作温度范围（°C）
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湿气敏感性等级
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安规/环境规范(Certification/Environmental specifications)
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应用等级(Application Level)
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NX5ABBB70X01AA
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连接器
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-55°C to 125°C
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2a
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ROHS
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E级
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