【应用】用于汽车ADAS系统摄像头模组的THERM-A-GAP GEL 25NS导热凝胶,导热系数2.5W/m·K
在半导体行业,通过缩小元件尺寸并增加电路板密度,从而实现更高的功能,这已成为目前的发展趋势,汽车ADAS系统中的摄像头模组中的半导体图像传感器和芯片就是这样典型的例子。而如何解决元件的散热问题,也是制造商面临的挑战。
在多功能摄像头视觉系统的设计中,某家全球汽车摄像头系统制造商在嵌入式芯片散热的位置附近放置了一个带有印刷电路板的摄像头传感器模组。由于相机镜头靠近 PCB,存在有机硅污染的隐患,从而对散热所必需的热界面材料的规格提出了更高的要求:所需的热材料必须是非硅基材料,并符合油漆润湿损害物质 (PWIS) 汽车标准。虽然有可用的非硅胶散热垫,但由于相机组件的大批量生产,散热垫不是一个可行的选择,因为只有可分配的热材料才能满足生产要求。
设计要求
• 高度贴合且压缩力低的可分配材料
• 非硅基粘合剂,可消除工厂和组装有机硅污染
• 无需后固化的材料,可加快制造过程
• 易于分配到目标区域
• 必须对光学相机可见
• 导热系数至少为 2 W/m·K
• 长期可靠性和耐用性
解决方案
PARKER CHOMERICS的应用工程师使用汽车摄像头模组的模型来确定设计规范内所需的理想材料性能和硬度。通过有限元分析 (FEA) 模拟以预测热材料在安装到目标位置期间和之后的反作用力,以确保在组装期间和之后不会对 PCB/IC 造成变形和/或损坏。根据客户的要求,Parker Chomerics导热凝胶THERM-A-GAP GEL 25NS完全满足甚至超过了客户的要求。
THERM-A-GAP GEL 25NS分配到基材上的一般样式
结论
Parker Chomerics的THERM-A-GAP GEL 25NS导热凝胶是用于相机模组的最佳热界面材料。它是一种非硅基单组分交联全固化热界面材料,具有最小热阻和高组分可靠性。其流速为15 g/min,也非常适用于吞吐量至关重要的大容量自动化装配线。该材料的导热系数为2.5 W/m·K,颜色为黄色,可通过装配线上的光学摄像头识别。全球汽车客户对他们选择的THERM-A-GAP GEL 25NS非常满意,并感谢Parker Chomerics在其项目取得成功过程中在工程和服务上所提供的帮助。
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本文由JWM翻译自Parker Chomerics,版权归世强硬创平台所有,非经授权,任何媒体、网站或个人不得转载,授权转载时须注明“来源:世强硬创平台”。
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PARKER CHOMERICS提供以下技术参数的导热凝胶选型,导热系数包含0.7~7.5W/m·K,热膨胀系数150~400ppm/K,介电强度180~220Vac/mil,符合ROHS标准,多种颜色可选
产品型号
|
品类
|
Color
|
Binder
|
Flow Rate, grams/min - 30cc syringe with no tip at
|
Specific Gravity
|
Typical Minimum Bondine Thickness, in (mm)
|
Thermal Conductivity, W/m-K
|
Heat Capacity, J/g-K
|
Coefficient of Thermal Expansion, ppm/K
|
Operating Temperature Range, ℃
|
Dielectric Strength, Vac/mil (kVac/mm)
|
Volume Resistivity, ohm-cm
|
Dielectric Constant @ 1,000 kHz
|
Dissipation Factor @ 1,000 kHz
|
Flammability Rating
|
RoHS Compliant
|
Outgassing,% TML (% CVCM)
|
Shelf Life, months from date of manufacture
|
Storage Conditions, ℃ @50% Relative Humidity
|
T630
|
导热凝胶
|
White
|
Silicone
|
10 @0.130"orifice
|
2
|
0.004 (0.10)
|
0.7
|
1.1
|
350
|
-55 to 200
|
200 (8)
|
10¹⁴
|
5.5
|
0.01
|
V-0
|
Yes
|
0.55 (0.14)
|
18
|
10 to 32
|
选型表 - PARKER CHOMERICS 立即选型
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