Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization and Failure Analysis

2021-11-06 ​Smiths Interconnect
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Smiths Interconnect announces its new Galileo test socket for Area Array and Peripheral Package Test.
 
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.

 

Galileo Test Socket

“A good portion of customers have products with critical time-to-market (TTM) goals. When speed is what they need, Galileo test socket provides an accurate, at-speed and cost-competitive test solution. Given the efficiency it provides, we have named the product after the Italian physicist and engineer, Galileo who made a significant contribution to speed and velocity studies”, said Bruce Valentine, Vice President and General Manager of the Semiconductor Test Business Unit at Smiths Interconnect.
 
Using a unique “universal” elastomer contact assembly, Galileo supports almost any standard package pinout, on any pitch (or multiple pitches) at >0.35mm, in any configuration, with no extra tooling charges. A single socket can be re-used across multiple pitches and pad/ball placement. In addition, no contact alignment or registration holes are required in the PCB, enabling quick and easy board integration.
 
Galileo elastomeric test socket offers the following features:

·Extremely short electrical paths to deliver excellent signal integrity

·Low inductance, high bandwidth >40GHz

·High Current Carrying Capacity

·Very high thermal conductivity

·Field-replaceable contact set with minimal tooling and technical expertise required

·3D printing technology for quick-turn socket body manufacture

·Pre-stocked elastomer sheets enabling very short lead-times

·Solder-down performance for applications where signal integrity loss is not an option

授权代理商:世强先进(深圳)科技股份有限公司
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本文由Batman转载自​Smiths Interconnect,原文标题为:Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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