Waermtimo’s High-Strength Thermal Pads Help LED Projectors Dissipate Heat More Effectively

时间： 2023-09-18 来源：Waermtimo News

代理服务

技术支持

采购服务

thermal pad,thermally conductive silicon film,WT5902,WT5912

LED (Light Emitting Diode) technology applied in the field of display and lighting has been very mature. With the advancement of technology, this technology has been applied to projectors, and more experienced manufacturers have combined this technology with DLP (Digital Light Processing) The perfect combination of technology makes the LED projector portable and compact, and because of its low power consumption and heat generation, it is widely used in life and personal business.

The optical element is the core part of the imaging display in the LED projector. The main components that are easy to generate heat and are affected by the heat are the light bulb the LCD panel and the nearby optical devices. The projection imaging technology of the projector requires a high light source output. Due to the small size of the device and the concentrated heat, 75% of the projector's power is dissipated in a very small space. If the temperature is too high, the devitrification of the quartz on the inner wall of the LED bulb will occur, which will cause white spots, cause the local area temperature to rise abnormally, and further expand, and then the brightness will rapidly decay. For other optical components, once the temperature exceeds the range, the optical components will be damaged. Therefore, the effectiveness of heat dissipation will directly affect the life of the LED projector.

How to quickly transfer the heat generated by the LED projector to the air? This requires a reasonable thermal design. General LED projectors are not only designed with large-area heat dissipation holes in the housing but also equipped with pure copper heat sinks for efficient heat dissipation. However, this does not maximize the heat dissipation effect, because the heat sink and the chip cannot be perfectly bonded, and the air in the gap between the two is a poor conductor of heat. Therefore, a thermally conductive silicon film is required to achieve heat conduction.

Solution

WT5912 series thermal pad

Model: WT5912-H20-55, WT5912-H25-40

Waermtimo researched and developed TIM's new high-strength thermal pad, which is a thermal conductive sheet with high mechanical strength, elongation rate> 300%, high toughness, thermal shock, and effective damping at the same time, and can be reworked many times. Continuously, it can tightly integrate irregular or complex surfaces, has excellent interface filling, and can be used repeatedly. Temperature resistance range -50 ~ 200 ℃, applicable to a wide range of power equipment, automotive electronics, communication equipment, network terminals, storage devices, handheld, wearable, and mobile terminal products between the internal chip and the radiator, this type of thermal pad can be used to solve the problem of heat conduction and heat dissipation. At the same time, it can also be applied to the housing of some electronic products, which have the functions of heat dissipation, insulation, dust resistance, and water resistance.

WT5902 series thermal pad

Model: WT5902-D40-40, WT5902-D45-40

Thermal conductivity range: 4W, 5W, 6W, 7W, 8W

WT5902 series thermal pads can solve the problem of tolerance changes in product structure design and can be reused. It is a good vertical heat transfer material between the heat source (CPU or electronic chipset) and the heat sink. Has good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, is easy to use, and is easy to remove. It is widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage devices, consumer electronics, and other fields.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由玄子转载自Waermtimo News，原文标题为:How can LED projectors dissipate heat more effectively?，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

平台合作

提交评论

全部评论（0）

暂无评论

Waermtimo Offers High-strength Thermal Conductive Pad and Thermal Pad for High-speed Optical Module Heat Dissipation

To solve the heat dissipation problem of the optical module, the heat dissipation panel must meet the two conditions of heat conduction and heat dissipation. The heat dissipation of chip components mainly uses high thermal conductive materials with a certain degree of flexibility.

2023-08-27 - 器件选型代理服务技术支持采购服务

Waermtimo’s New WT5912 Series Thermal Pad with High Mechanical Strength and Elongation Rate over 300% Can be Used for iPadPro Heat Dissipation

As tablet PCs become thinner and slimmer, they need to use passive cooling, so a thermal pad can be seen on the processor for heat conduction. The thermal pad has a certain ductility, can fill the gap, and has elasticity, which can play the function of shock absorption and component protection.

2023-09-23 - 器件选型代理服务技术支持采购服务

Waermtimo WT5902 and WT5921 Series High Thermal Conductive Materials Suitable for VR Glasses Heat Conduction

Important components are densely distributed on the motherboards of the somatosensory devices, like VR glasses or VR headsets. High thermal conductive materials suitable for heat conduction and evacuation of VR glasses include Waermtimo WT5902 series thermal pad and WT5921 series thermal gel.

2023-09-16 - 器件选型代理服务技术支持采购服务

鸿富诚（HFC）热界面材料/屏蔽材料/吸波材料选型指南

公司介绍 Company Profile 热界面材料介绍 Thermal Interface Material Introduction 导热硅胶垫片 Thermal Pad 各向异性导热垫片 Anisotropic Thermal Pad 导热凝胶 Thermal Gel 导电泡棉 FOF Gasket 石墨泡棉 Graphite Foam 半包型导电泡棉 Half-wrapped Gasket SMT导电泡棉 SMT Gasket 全方位导电泡棉 XYZ Conductive Foam 导电PE Conductive PE 导电毛丝 Conductive FOA 导电布胶带 Conductive Fabric Tape 铜/铝箔胶带 Copper/Atuminum Foil Tape 吸波材料 Wave-absorbing Material 导热吸波材料 Thermal Conductive Absorbing Material

鸿富诚 - SINGLE-COMPONENT THERMAL GEL,SMT导电泡棉,WAVE-ABSORBING MATERIAL,导热硅胶,THERMAL INTERFACE MATERIAL,导热硅胶垫片,铝箔胶带,导电布,导电毛丝,FOF垫圈,SHIELDING MATERIAL,ANISOTROPIC THERMAL PAD,导热吸收材料,导电泡棉,吸波材料,铜/铝箔胶带,全方位导电泡棉,WAVE ABSORBING MATERIAL,铜箔胶带,各向异性热垫,FOF GASKET,导电织物胶带,热界面材料,导电布胶带,半包垫片,COPPER FOIL TAPE,导热吸波材料,导热垫片,CONDUCTIVE PE,COPPER/ALUMINUM FOIL TAPE,THERMAL GEL,半包型导电泡棉,单组分热凝胶,双组份导热凝胶,XYZ CONDUCTIVE FOAM,双组分热凝胶,石墨泡棉,GRAPHITE FOAM,导热垫,导电FOA,TWO-COMPONENT THERMAL GEL,THERMAL CONDUCTIVE ABSORBING MATERIAL,网通应用高导热材料,CONDUCTIVE FABRIC TAPE,XYZ导电泡沫,CONDUCTIVE FOA,热凝胶,HALF-WRAPPED GASKET,导电聚乙烯,各向导性导热垫片,ALUMINUM FOIL TAPE,石墨泡沫,各向异性导热垫片,屏蔽材料,SMT GASKET,导电PE,COPPER/ATUMINUM FOIL TAPE,导热凝胶,单组份导热凝胶,SMT垫片,THERMAL PAD,H800-LY,HFS-15,HFS-18,H100,HFC-MC,H300,HFC-SMT,H500,H700,H350-SOFT,H100RS,H300-RB,HTG-150DK,HFC-MC系列,HTG-150D,HFC-GB系列,SMFB系列,H200RS,HFC-MFZ系列,HFC-AM,H1200,H250,HFC-GR系列,HTG-1000,HTG-100DK,H1000,HFS-20,H1000-SOFT,H150RS,HFC-A18000,SMFB,H250RS,HTG-600,HTG-500SF,HTG-800,SMFA,HTG-200,HFC-AM系列,HFC-MF,H300MAS,HFC-MT,SMT,H500-RB,HTG-200D,HFC-A系列,HFC-A25000,H150A15,H500-LY,HTG-800D,H100A15,HFS-30,HFC-AM5000,H200,H400,H600,H200-SOFT,H800,H300-SOFT,H100-SOFT,HFC-MF系列,HFC-AM1000,H200MAS,HFC-A5000,SMFA系列,H300-HC,HTG-300SF,HFC-MFZ,H150,HFC-GR,HTDG-250,H150-LY,H700-SOFT,H600-LY,H300-LY,HFC-A,H300-HR,H300-DR,SMT系列,HTG-300,HFC-GB,H200-LD,HTG-500,H150-LD,COMMUNICATION EQUIPMENT,通讯设备,直流接地,MOBILE PHONES,射频,HEAT SINK,5G MOBILE PHONE,摄像头,散热模块,光电子产业,OPTICAL PRECISION EQUIPMENT,THERMOELECTRIC COOLING DEVICES,AUTOMOTIVE,EMI电子元件,RFID标签,电源电阻器,MONITORING SYSTEM,RFID ANTI-METAL READER,TEMPERATURE REGULATOR,CHIP MODULES,散热片,芯片模组,元件,半导体案例,卫星,CASE,VR 设备,DC GROUNDING,无线通信设备,CHASSIS,射频接地电磁干扰,RF GROUNDING,RFID抗金属读写器,WIRELESS CHARGE PRODUCTS,监控系统,散热器,RF,POWER RESISTOR,新能源产业,手持移动电子设备,射频互联射频干扰屏蔽垫片,新能源行业,可穿戴设备,军事领域,BASE STATION ANTENNA DEVICE,RFID TAG,BETWEEN THE CHIP AND THE MODULE,SEMICONDUCTOR CASES,ELECTRO MAGNETIC SCREEN,电子消费品,手机,NEAR FIELD PAYMENT,高性能CPU,SATELLITE,在芯片和模块之间,显示卡处理器,LED LIGHT SOURCE,LED灯具,ELECTRONIC DEVICES,工业路由器,芯片与散热模块之间,电子产品,COMPUTERS,ELECTRONIC AND ELECTRICAL PRODUCTS,EMC ELECTRONIC COMPONENTS,RFID抗金属电子标签,NETCOM INDUSTRY,CHIP,高频模块,OPTOELECTRONICS INDUSTRY,HANDHOLD MOBILE ELECTRONIC DEVICE,消费领域,电磁屏,近场支付,平板,AUTOMOTIVE ELECTRONICS,芯片,显卡处理器,VR EQUIPMENT,软性电路板,RADAR,电脑,COMPONENT,5G BS,PADS,5G基站,手持移动电子装置,装配表面,汽车电子,OPTICAL INSTRUMENTS,DC,柔性线路板,电子电器产品,MAGNETIC SCREEN,汽车,FABRICATIONS,MICROELECTRONIC DEVICES,HIGH-PROPERTY CPU,GPU,EMI COMPONENT,WIRELESS CHARGING,无线通讯设备,无线充电产品,直流接地消除静电,外壳,RF INTERFERENCE SHIELDING GASKET,无线充电,CAMERA,MILITARY FIELDS,光模块产品,5G BASE STATION,元件对印刷电路板接地,磁屏,INDUSTRIAL ROUTER,5G手机,网通产品,HEAT DISSIPATION MODULE,电子设备,RFID ANTI-METAL ELECTRONIC TAG,LUMINOUS BODIES,汽车电池包,WIRELESS COMMUNICATION EQUIPMENT,家电行业,NETCOM PRODUCTS,雷达,FPC,底座,射频干扰屏蔽垫片,光学精密设备,NETCOM PRODUCTS •家电行业HOUSEHOLD APPLIANCE INDUSTRY,HIGH FREQUENCY MODULE,LED灯,LED LAMPS和发光体,微电子器件,LED LAMPS,直流,热电冷却装置,外壳对印刷电路板接地,AR设备,HOUSEHOLD APPLIANCE INDUSTRY,LED光源,基站天线装置,高性能中央处理器,BETWEEN CHIP AND HEAT DISSIPATION MODULE,温度调节器,AUTOMOBILE BATTERY PACK,消费者,CONSUMER,WEARABLE EQUIPMENT,EMC电子元件,OPTICAL MODULE PRODUCTS,射频接地,光电行业,NEW ENERGY INDUSTRY,半导体块,AR EQUIPMENT,通信设备,CONSUMER SECTORS,光学仪器,芯片模块,汽车电池组,网通行业,ELECTRONIC PRODUCTS,VR设备,发光体

2022/2/28 - 选型指南代理服务技术支持采购服务

沃尔提莫（Waermtimo）碳纤维导热片/导热硅胶/导热灌封胶选型指南

碳纤导热导热性硅胶产品系列高端导热灌封胶

沃尔提莫 - 碳纤维导热片,导热性硅胶,高端导热灌封胶,常规导热矽垫片,导热硅胶,导热凝胶,导热胶泥,导热硅脂,导热润滑膏,导热灌封硅橡胶,超薄碳纤维导热垫片,双组份导热灌封胶,碳纤维导热垫片,导热灌封胶,导热灌封硅利康,导热灌封硅胶,常规导热硅垫片,高导热硅垫片,WT5921-30,WT5921-20,WT5935C高瓦系列,WT5921-35,WT5912,WT5902,WT5921,WT5932,WT5932-30P,WT 5921-86,WT5912系列,WT5932-30D,WT5922-501AB,WT5902系列,WT5932 系列,WT5921-15AB,WT5921-25AB,WT5935C,投影机,通讯设备,电子组件,手机,IGBT集成模块,智能家电,电机控制单元模块,驱动器模块,车载电子,特种电源模块,碳化硅模块,大功率变流模块,功率芯片,大功率变流/逆变模块,工业级IPM模块,MOSFET集成模块,LED集成模块,新能源车之电池模组,电热零件,高频变压器,电源模块,高压直流电源模块,路由器,可控硅模块,虚拟现实,游戏机,连接器,LED,平板电脑,二极管模块,电路板,大功率变流逆变模块,AR,汽车电子控制模块,航天电子,散热器,电源供应器,通讯电源模块,散热材料,XR,功率电子模块封装,VR,传感器,计算机

2022/5/6 - 选型指南代理服务技术支持采购服务

Choosing the Right Thermal Pad: Thermal Conductivity ＆ Hardness Explained

Selecting the right thermal pad is essential for effective thermal management in electronic devices. Two critical performance factors to consider are thermal conductivity and hardness. In this article, Sheen will explore how these properties influence thermal pad performance and device longevity.

2024-12-17 - 技术探讨代理服务技术支持采购服务

金菱通达（GLPOLY）热对策材料选型指南

Company Profile Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel Thermal Pad Thermal Silicone Pad & Silicone Thermal Fiberglass/Film EMI absorber/Absorption Gel Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound Silicone/Non-Silicone Thermal grease Silicone Thermal Tape Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad

金菱通达 - 低密度导热硅凝胶垫,NON-SILICONE THERMAL TAPE,NON-SILICONE THERMAL GREASE,LOW DENSITY THERMAL GAP PAD FOR EV BMS,ELECTROSTATIC DISCHARGE THERMAL SILICONE PAD,热间隙垫,硅酮热膜,减振硅胶垫,硅橡胶热垫,NON-SILICONE THERMAL FIBERGLASS,非硅酮热玻璃纤维,无硅密封剂,热腻子凝胶,PRINTABLE PCM THERMAL LNTERFACE MATERIAL,热界面相变材料,导热电磁干扰吸收软垫,SILICONE THERMAL FIBERGLASS,无应力硅酮热腻子凝胶,脉冲编码调制系统,EML吸收器,非硅酮热敏带,EMI ABSORBER,石墨热辐射垫,热EMI吸收凝胶,用于电动汽车BMS的低密度热间隙衬垫,THERMALLY CONDUCTIVE INSULATOR,非硅酮热垫,THERMALLY CONDUCTIVE EMI ABSORBER,双组分热界面密封剂,静电放电散热硅胶垫,THERMAL CONDUCTIVE SILICONE GEL PAD,SILICONE RUBBER THERMAL PAD,导热粘合剂,THERMAL FIBERGLASS,THERMAL INTERFACE PHASE CHANGE MATERIALS,PRINTABLE PCM THERMAL INTERFACE MATERIAL,ELECTROSTATIC DISCHARGE THERMAL GAP PAD,可印刷PCM热界面材料,GRAPHITE THERMAL RADIATION PAD,非硅酮热润滑脂,非硅酮腻子凝胶,THERMAL EMI ABSORPTION GEL,THERMAL PUTTY GEL,NON-SILICONE THERMAL PAD,SILICONE RUBBERTHERMAL PAD,SILICONE THERMAL PUTTY PAD,两部分液体热间隙垫,硅酮热垫,导热绝缘体,两部分可分配热垫,硅热玻璃纤维,SILICONE FREE SEALING COMPOUND,硅酮热腻子垫,STRESSLESS SILICONE THERMAL PUTTY GEL,THERMAL GREASE,NON-SILICONE THERMAL GREASE,SILICONE THERMAL PAD,PHASE CHANGE MATERIALS,静电放电热间隙垫,SILICONE THERMAL FILM,热界面润滑脂,EML ABSORBER,热玻璃纤维,SILICONE THERMAL TAPE,热导率EML吸收体PCM,THERMAL CONDUCTIVITY EMI ABSORBER SOFT PAD,TWO-PART THERMAL INTERFACE SEALING COMPOUND,导热硅凝胶垫,THERMAL GAP PAD,硅酮热敏带,THERMALLY CONDUCTIVE ADHESIVE,PCMS,非硅酮密封剂,VIBRATION DAMPENING SILICONE PAD,硅热凝胶,SILICONE PUTTY PAD,THERMAL CONDUCTIVITY EMI ABSORBER,非硅酮型,硅热润滑脂,NON-SILICONE SEALING COMPOUND,导热EMI吸收材料,TWO-PART DISPENSABLE THERMAL PAD,TWO-PART LIQUID THERMAL GAP PAD,THERMAL LNTERFACE GREASE,散热膏,THERMAL INTERFACE GREASE,NON-SILICONE PUTTY GEL,硅酮腻子垫,THERMAL CONDUCTIVITY EML ABSORBER PCM,NON-SILICONE TYPE,相变材料,导热EMI吸收凝胶,SILICONE THERMAL GREASE,THERMALLY CONDUCTIVE EMI ABSORPTION GEL,SILICONE THERMAL GEL,LOW DENSITY THERMALLY CONDUCTIVITY SILICONE GEL PAD,XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10,电机控制,MOTOR CONTROLS,空中飞行,OPTICAL PRODUCTS,HEAT SINK,军事的,摄像头,DIGITAL DISK DRIVES,北桥集成电路,医学电子学,MEDICAL ELECTRONICS,DC-DC CONVERTERS,高压装置,NEW ENERGY VEHICLES,AEROSPACE,散热片,COMPUTER,HIGH FREQUENCY IC CHIP,CAMERA,存储设备,手机应用,AIR FLIGHT,GRAPHIC CARDS,POWER SUPPLIES,光学产品,LED LIGHT,PERIPHERALS,HIGH PERFORMANCE COMPUTER PROCESSORS GRAPHIC CARDS,HAND-SET APPLICATIONS,POWER CONVERSION,TELECOMMUNICATIONS,工业控制设备,LED LIGHTING,POWER SEMICONDUCTORS,CELLULAR PHONES,FPC,军工设备,MILITARY EQUIPMENT,HIGH PERFORMANCE COMPUTER PROCESSORS,CONSUMER ELECTRONICS,射频模块,LED灯,CONSUMER ELECTRONICS,手机,HIGH VOLTAGE UNITS,SEMICONDUCTOR,消费电子,RF MODULE,航空航天,功率半导体,无线通讯,光纤模块,UAV,TELECOMMUNICATIONS,COMPUTER,医疗器件,DC-DC转换器,数字磁盘驱动器,高性能计算机处理器,STORAGE DEVICE,FIBER OPTICS MODULES,MILITARY,MEDICAL DEVICES,AUTOMOTIVE SYSTEMS,半导体,医疗设备,MEDICAL EQUIPMENT,AUTOMOTIVE ELECTRONICS,新能源汽车,LED,COMPUTER CPU,计算机中央处理器,功率转换,TELECOMMUNICATIONS CAMERA,LED照明,图形卡,外围设备,INDUSTRIAL CONTROL EQUIPMENT,电脑,NORTH BRIDGE IC,发光二极管,电源,汽车系统,高频集成电路芯片,汽车电子,柔性线路板,无人飞机

2017/2/23 - 选型指南代理服务技术支持采购服务

沃尔提莫导热垫片、碳纤导热垫片选型表

10W、15W、25W、35W碳纤导热垫片，耐温范围-50℃~150℃

产品型号	品类	导热系数(W/(m·K))	厚度（mm）	密度(g/cm³）	击穿电压 (kV/mm)	体积电阻率(Ω·cm)	耐温范围（℃）	硬度 (ShoreOO)	尺寸（mm）	客制选项
WT5902-40-40-100*100-0.5T	导热垫片	4W/(m·K)	0.5mm	3.25g/cm³	5kV/mm	1.0×1010Ω·cm	-50℃-150℃	40	1001000.5mm	单面处理，单面增粘

选型表 - 沃尔提莫立即选型

Maximizing Device Performance: How to Choose the Right Thermal Pad

This article explains what thermal pads are, their key features, and how to choose the best one for your needs.

2024-12-17 - 技术探讨代理服务技术支持采购服务

深圳沃爾提莫電子材料有限公司产品介绍

沃尔提莫 - 高端導熱灌封膠,導熱性硅膠,導熱性硅膠墊片,超薄熱墊片,导热凝胶,導熱潤滑膏,導熱灌封硅橡膠,導熱硅墊片,導熱凝膠,導熱硅膠,常規導熱硅墊片,氮化硼導熱硅墊片材料,氮化硼導熱硅墊片,導熱硅脂,液態金屬導熱硅脂,高性能導熱墊片材料,高導熱率碳纖維導熱墊片,導熱灌封硅利康,高導熱硅墊片,導熱灌封硅膠,導熱材料,導熱硅墊片材料,單組分硅橡膠,導熱灌封膠,WT5921-30,WT5921-86,WT5921-20,WT5921-35,WT5931-N100,WT5912,WT5902,WT5921,WT5932,WT5932-30P,WT5932系列,WT5912系列,WT5932-30D,WT 5932-125,WT5902系列,WT5921-15AB,WT 5932-210,WT 5932,WT5921-25AB,WT5935C,WT 5932-150,WT 5932-280,電子器件,網路設備,筆記本,手持電子器件,電熱零件,汽車電子冷卻發熱元件,功率芯片,不间断电源,汽車電子,UPS,消費類電子產品,投影機,遊戲機,通訊,鐳射,數據處理器,汽車照明(LED),AR,二極體模塊,微電子消費品,機架,功率電子模塊,高壓直流電源模塊,电信,消費類電子,醫療設備,功率半導體模組,工控機,POWER SUPPLY,LED 集成模塊,可控硅模塊,電子產品,新能源汽車,臺式機,大功率變流模塊,AUTOMOTIVE ELECTRONICS,半導體大功率模塊,模組電源,車載電子,感測器,特種電源,中央处理器,新能源,IGBT 集成模塊,電機控制單元模組,电脑,5G基站,電機控制單元,手機,電腦產品,汽车电子,MCU,伺服器,半導體記憶體件,CPU,電池模組,智能家電,通用變頻器,車載攝像頭,通訊系統,驅動器模組,通訊電源模塊,DSC,MONITORING SECURITY,微電子,通訊產品,安防監控系統,GPU通訊,DSP,鐳射HUD 光源,通訊設備,路由器,特種電源模塊,汽車電子控制模組,電子組件,平板電腦,CONSUMER ELECTRONICS,電源模塊,监控安防,VR,工業級 IPM 模塊,消費電子,消费电子,大功率逆變模塊,特種行業,IGBT,IGBT 模組,電腦,電源產品,監控安防系統,碳化硅模塊,電路板,電源,虚拟现实,LED,圖像處理器,MOSFET 集成模塊,高頻變壓器,TELECOM,連接器,散熱器,服務器,COMPUTER,电源,汽車導航

2022/8/30 - 商品及供应商介绍代理服务技术支持采购服务

THERM-A-GAP™ MCS30 Thermally Conductive Gap Filler Pad

THERM-A-GAP™ MCS30 是一款软质、低重量损失且完全固化的热界面材料。它具有优异的热稳定性和长期物理与热可靠性，适用于需要低压缩力的应用。该产品具有良好的电绝缘性，适用于多种电子设备。

PARKER CHOMERICS - HIGHLY CONFORMABLE/LOW SILICONE EXTRACTABLE THERMAL PAD,导热间隙填料垫,高适形/低硅可萃取热垫,THERMALLY CONDUCTIVE GAP FILLER PAD,69-11-20687-MCS30X,MCS30,THERM-A-GAP™ MCS30,69-11-20684-MCS30X,69-11-20685-MCS30X,69-11-20698-MCS30X,69-11-20686-MCS30X,69-11-20672-MCS30X,69-11-20991-MCS30X,69-11-20675-MCS30X,69-11-27072-MCS30X,MCS 30,69-11-21259-MCS30X,69-11-27102-MCS30X,69-11-20913-MCS30X,DESKTOP COMPUTERS, LAPTOPS, SERVERS,电信设备,台式电脑、笔记本电脑、服务器,消费电子,MEMORY MODULES,AUTOMOTIVE ELECTRONICS,TELECOMMUNICATIONS EQUIPMENT,内存模块,汽车电子,CONSUMER ELECTRONICS

September 2015 - 数据手册代理服务技术支持采购服务

Thermal Putty vs Thermal Pad: Which Is Right for You?

When it comes to managing heat in electronic devices, selecting the right thermal interface material (TIM) is crucial for ensuring optimal performance and longevity. Among the popular TIM options, thermal putty and thermal pads are widely used. This article explores the key differences to help you choose the best solution for your needs.

2024-12-04 - 技术探讨代理服务技术支持采购服务