Waermtimo’s New WT5912 Series Thermal Pad with High Mechanical Strength and Elongation Rate over 300% Can be Used for iPadPro Heat Dissipation

时间： 2023-09-23 来源：Waermtimo News

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The new electronic products come out on the market every fall apart from the iPhone series, just the iPad series.

IPad is the intermediate product between smartphones and notebook computers, with more and more powerful functions, chase, and play games, and even the drawing function added in the last two years, it has expanded work and entertainment performance.

Let's take a look at the internal structure. How many black technologies are there?

The electronic mask layer of the motherboard

The role of this thin layer is not only to protect the motherboard, but also to hide the cable connector, and also to fix the motherboard on the iPad Pro back case.

Its motherboard is located in the center of the interior, and the display cable is also connected in the center. The components on the motherboard are relatively dense, with processors, 2 memories, flash memory, gyroscope and accelerometer combination, Wi-Fi modules, controllers, and audio codecs, etc.

As tablet PCs become thinner and slimmer, they need to use passive cooling, so a thermal pad can be seen on the processor for heat conduction. The thermal pad has a certain ductility, can fill the gap, and has elasticity, which can play the function of shock absorption and component protection.

What kind of thermal pad can be used on tablets?

Recommended models

WT5912 series thermal pad

Model: WT5912-H20-55, WT5912-H25-40

Waermtimo researched and developed TIM's new high-strength thermal pad, which is a thermally conductive sheet with high mechanical strength, elongation rate> 300%, high toughness, thermal conduction, and shock absorption at the same time. It can not be fractured and can tightly integrate irregular or complex surfaces, has excellent interface filling, and can be used repeatedly. Temperature resistance range -50 ~ 200℃, applicable to a wide range of power equipment, automotive electronics, communication equipment, network terminals, storage devices, handheld, wearable, and mobile terminal products between the internal chip and the radiator. This series pad can be used to solve the problem of heat conduction and heat dissipation. At the same time, it can also be applied to the housing of some electronic products, which have the functions of heat dissipation, insulation, dust resistance, and water resistance.

WT5902 series thermal pad

Model: WT5902-D40-40, WT5902-D45-40

Thermal conductivity range: 4W, 5W, 6W, 7W, 8W

WT5902 series thermal pads can solve the problem of tolerance changes when designing the product structure and can be reused. They are vertical heat transfer materials between the heat source (CPU or electronic chipset) and the heat sink. Have good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, are easy to use, and are easy to remove. They are widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage devices, consumer electronics, and other fields.

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本文由玄子转载自Waermtimo News，原文标题为:How does ipadPro dissipate heat?，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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Ziitek（兆科）导热材料选型指南

目录- 公司介绍 TIC系列低熔点导热界面材料 TIF系列热传导间隙填充材料 TIG系列导热膏 TIS系列导热绝缘材料 TIR系列超高导热导电材料 TIA系列导热双面胶 TCP™100系列导热工程塑料 Z-Paster100无硅导热片 TIF™100导热泥/导热粘土 TIE/TIS™导热灌封粘合剂（导热灌封胶） Kheat™发热材料导热界面材料应用介绍模切产品

型号- Z-PASTER100-30-02E,TIS680-15AB,TIR300-CU SERIES,TIR600-06 SERIES,TIE280-12AB,TIA600FG,TIC800A,TCP300-18-06B,TIR300CU,TIS580-12,Z-PASTER100-15-02E,TIS580-10,TIF500,TIF100-35,TIF300 SERIES,TIC800G,TIF100,TIF100-30,TIF300,TIF600GP SERIES,TIC800B,TIG780-50,TIG780-10,TIF100-25,TIS680-28AB,TIG780-52,TIF100-15-10F SERIES,TIS100B,TIA800FG,TIS100G,TIF200 SERIES,TIA800,TIS100P,TCP100-50-01A,TIF100-32-05S SERIES,TIG780-18,TIF100-20,TIF100-02S SERIES,TIS680-10AB,TIE380-25,TIC800P SERIES,TIF100-30-10F SERIES,TIF600GP,TIS100Y,TC800G SERIES,TIF100-02S,TIF100-15,TCP200-18-06A,TCP200-25-06A,TIF100-12U SERIES,TIF800 SERIES,TIF100-05E SERIES,TIF100-05F SERIES,TIF700GP,TIR300,TIA800AL,TIS800K,TIF600,TIG780-25,TIF800,TIF200,TIF100-20-10F SERIES,TIF100-50,TIF400,TIC800P,TIF700GP SERIES,TIF400 SERIES,TCP300-12-06B,TIR300 SERIES,TIS800 SERIES,TIE280-25AB,TIA800 SERIES,TIS580-13,Z-PASTER100-20-02E,TIS680 SERIES,TIR600-06,TCP100-40-02A,TIS580 SERIES,TIS800,TIS800K SERIES,TIE380-45,TIC800A SERIES,TIC800G SERIES,TIC800K SERIES,TIF500S,TIG780-38

2018/5/8 - ZIITEK - 选型指南代理服务技术支持批量订货

沃尔提莫（Waermtimo）是国家高科技新技术企业，为全球客户提供高导热系数、较低热阻、较高性价比导热材料产品，致力于为管理和控制电子整机、器件、模组和线路板的发热，研发各种新型复合材料及解决方案，并将新技术、新材料落地于自主知识产权的产品设计和生产中。

高端导热灌封胶碳纤导热材料导热硅胶导热凝胶导热垫片

代理服务线上商城技术资料

What is Thermal Pad?

Thermal pads are essential components in modern electronic devices, designed to facilitate efficient heat transfer from heat-generating components to heat sinks or other cooling solutions. Understanding what thermal pads are and their importance can help you choose the right material for your specific application.

2024-08-03 - 技术探讨代理服务技术支持批量订货

沃尔提莫导热垫片、碳纤导热垫片选型表

10W、15W、25W、35W碳纤导热垫片，耐温范围-50℃~150℃

产品型号	品类	导热系数(W/(m·K))	厚度（mm）	密度(g/cm³）	击穿电压 (kV/mm)	体积电阻率(Ω·cm)	耐温范围（℃）	硬度 (ShoreOO)	尺寸（mm）	客制选项
WT5902-40-40-100*100-0.5T	导热垫片	4W/(m·K)	0.5mm	3.25g/cm³	5kV/mm	1.0×1010Ω·cm	-50℃-150℃	40	1001000.5mm	单面处理，单面增粘

选型表 - 沃尔提莫立即选型

汉华（Hanhua）导热界面材料选型指南

型号- HI,HT90,HL10,HL,HP10,HP,HS,HT,HI系列,KCH30,THSB30,KHGC系列,THSI10,HT80,HI25,THSB25,THSB20,KGF系列,HG70,HI30,KHG80,HL30,KGF100,KGF060,HP30,THSI系列,KHGC50,KGC35,HS10,KGS040A,KCH15,THSB10,HC20,KGT55,KG,HC25,KHGC60,KGS系列,HL20,KGS025A,KGC,HL25,HP20,HP25,HAZ20,KGF,KCH20,KGC系列,KCH25,HAZ10,KGS,HT100,KGT,KGF080,HC10,HAZ,KHG60,HC系列,KGC15,HS30,HG系列,KHG,HAZ30,HS35,HAZ25,KGT35,HB20,HAZ系列,HG40,HB25,KG35,KHGC80,KG15,KGT系列,KGC25,HS20,HS25,HL系列,HP系列,HB10,HT系列,HC30,KGT45,KG25,HI10,HT70,HS50,HB系列,KGS032A,THSI30,KHG系列,HG60,KHGC,HI20,KGS017A,THSB,HS40,HT60,KHG50,KG系列,THSI,KCH,KGT20,HS系列,HB30,THSI25,HB,HC,HG50,THSI20,THSB系列,HG

2020/10/21 - 汉华 - 选型指南代理服务技术支持批量订货

A Brief Description of Thermally Conductive Materials - Carbon Fiber Thermal Pads

The popularization and research of 5G communication technology enables people to feel the experience of high-speed surfing in the network world, and also promotes the development of some 5G-related industries, such as unmanned driving, VR/AR, cloud computing, etc., 5G communication technology In addition to bringing people a pleasant network experience, it also has the problem of heat dissipation that needs to be solved.

2024-07-25 - 技术探讨代理服务技术支持批量订货