Real Chip-level Multi Sourcing - The Multi-sourced Power Modules Featuring IGBT M7 for Motion Control Applications
VINCOTECH‘s range of multi-sourced power modules for motion control applications just got bigger with a set of products featuring IGBT M7 chips. Featuring sixpack and PIM topologies these product families not only offer superior performance but also multiple sourcing for the highest supply chain safety for the customers. With an ultra-thin wafer processing technology and optimized cell design, the IGBT M7 technology achieves a superior low VCEsat, reducing the static losses by 20%. In combination with the RFC (Relaxed Field of Cathode) diodes and the suppress snap-off recovery, it is far easier for engineers to optimize the EMC behavior of the inverter and cut overall system costs. The IGBT M7 chips are housed in the industry standard packages flow and MiniSKiiP®. These modules are designed in a first step for 1200 V with a power range that covers 5A – 200A for flexible, scalable inverter designs for the motion control market.
Main Benefits
Multiple sourcing for enhanced supply chain security
Improved efficiency with 20% lower Vcesat than the competition
Superior EMC to help drive down system costs
Extended power range for easily scalable inverter designs
Schematics of PIM and sixpack topology with IGBT M7
Available additions with IGBT M7
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本文由洛希转载自Vincotech News,原文标题为:MORE CHOICE - GREATER SECURITY - New modules featuring IGBT M7,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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