VIncotech’s Mid-power VINcoPACK E3 in A Low-profile Package for Motion Control and UPS Applications

时间： 2023-11-13 来源：Vincotech News

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A low-profile package for motion control and UPS applications

VINCOTECH now has extended the industry-standard low-profile package for mid-power inverters by a sixpack configuration. Engineered mainly for industrial drives, solar power, and UPS applications, the VINcoPACK E3 raises the performance bar with its superior efficiency and reliability. Following the VINcoDUAL E3, the 1200V sixpack power modules VINcoPACK E3 features SLC (SoLid Cover) technology, which combines an insulated metal baseplate and direct potting resin to achieve both high thermal and high power cycling capability. This module is also equipped with the latest low-loss IGBT M7 chips and achieves high power density. The VINco E3 line contains the half-bridge VINcoDUAL E3, this sixpack VINcoPACK E3, and PIM configuration are due to follow.

Main benefits

Extended module lifetime based on the SLC- and IMB Technology
Increased power density featuring the IGBT M7 chip technology
Multiple chip sourcing ensures the highest supply chain safety
Cost competitive w/o expensive base plate component

Features

Industry-standard, low-profile package
Built-in NTC
Scalable product platform

Target applications

Industrial drives
Solar
UPS

VINcoPACK E3 schematic

Low-profile package for mid-power applications

VINcoPACK E3 overview

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本文由洛希转载自Vincotech News，原文标题为:VINCOTECH’S NEW MID-POWER VINcoPACK E3 OUT NOW，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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