TDK Honored at Sensors Converge 2023 with Two Coveted Industry Awards

2023-09-20 TDK InvenSense News

Reading Points

  • TDK U.S.A Corporation’s CEO Jim Tran was named Executive of the Year

  • InvenSense SmartBug™ 2.0 was named the Data Acquisition & Analytics Category winner


June 22, 2023——TDK Corporation announced two award wins during this year’s Best of Sensors Awards at Sensors Converge 2023, including a leadership award for Jim Tran, CEO of TDK U.S.A Corporation, being named Executive of the Year. This year’s winners were recognized at the Best Of Sensors Awards reception, held June 21, 2023, at the Santa Clara Convention Center.


An accomplished technology and wireless communications executive, Mr. Tran has served as TDK U.S.A Corporation’s CEO since August 2021. Domestic growth, acquisitions (most recently of Qeexo, a new TDK Group company that automates end-to-end machine learning), partnerships, and expansion in funding and product portfolios have highlighted his time at the company.

Mr. Tran’s honor was accompanied by another product award win for TDK.


The InvenSense SmartBug™ 2.0 was named the Data Acquisition & Analytics Category winner. The all-in-one multi-sensor wireless solution features various new features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug, released in 2019. The latest version of SmartBug also introduced machine learning as a key feature.


For over two decades, the Best of Sensors Awards has shone a spotlight on the best and most innovative products, technologies, teams, and people in the sensors industry. Presented by Sensors Converge and Fierce Electronics, the goal of the awards program is to honor and promote wide recognition of the industry’s most transformative technologies and teams. 

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GreenWaves Technologies Produced a Prototype of a New Wireless Modem for the IoT

It is implementing the GreenWaves LPWAN wireless modem dedicated to the high data rate LPWAN applications. This model includes a NUCLEO development board, a XILINX Zynq-7000 FPGA development board and an ATREB215-XPRO evaluation board instantiating an ATMEL AT86RF215 analog front-end.

2024-08-11 -  产品 代理服务 技术支持 采购服务

TDK Extends Battery Life of Kaadas Smart Door Lock with SmartSonic™ Ultra-low-power Time-of-Flight Sensors CH201

TDK announces the successful integrations of the InvenSense CH201 ultrasonic Time-of-Flight sensors into the Kaadas K9-F smart door lock, enabling its face recognition functionality to automatically unlock for recognized users, which was recently launched into the consumer market.

2023-05-30 -  应用方案 代理服务 技术支持 采购服务

ROHM Develops the Industry‘s Smallest CMOS Op Amp Optimized for Smartphones and Compact IoT Devices

ROHM has developed an ultra-compact 1.8V - 5V, rail-to-rail CMOS operational amplifier - the TLR377GYZ. It is optimized for amplifying signals from sensors such as temperature, pressure, flow rate, used in smartphones, small IoT devices, and similar applications.

2024-08-03 -  产品 代理服务 技术支持 采购服务

TDK Announces Availability of SmartBug™ 2.0 – An All-in-one Smarter Multi-sensor Wireless Module with ICM-45686-S BalancedGyro™ IMU Platform

TDK Corporation announces market availability of the InvenSense SmartBug 2.0, an all-in-one multi-sensor wireless solution with new features for consumer and IoT applications. SmartBug 2.0 is a smart remote data-collection module for IoT, developed after the success of the original SmartBug in 2019.

2023-07-03 -  原厂动态 代理服务 技术支持 采购服务

TELE IoT Sensor Meets 3D Reality

We all know about all sensors and electrical motors, pumps, gear boxes and drives getting connected to the cloud more and more. But many operators and maintenance members are desperately trying to tie a simple online dashboard or graph into what’s happening in the real world.

2024-08-02 -  原厂动态 代理服务 技术支持 采购服务
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