【元件】 微容科技推出内埋型片式多层陶瓷电容器,成功攻克端头设计和加工工艺难点,实现系列化研发和量产
随着智能与互联技术的深入发展,低损耗、高密度的电子部件选用与布局成了重要的技术课题,以半导体来创建包含多个IC和被动元件集成封装的SIP(System in Package)成了现代电子领域的关键创新。该技术已广泛应用于各个行业,包括消费电子、汽车、航空航天和医疗设备。
除了模块化的集成方式,SIP技术对元器件的要求也不同,其中元器件贴装的工艺是典型差异之一,对此,微容科技特别推出MLCC解决方案——内埋型片式多层陶瓷电容器。
微容科技内埋型片式多层陶瓷电容器介绍
片式多层陶瓷电容器(MLCC),是各类电子产品中最通用的元件之一,因为主要用于PCB表面贴装,MLCC端头的电极最外层一般为锡镀层。内埋型片式多层陶瓷电容器(铜端子MLCC)与常规MLCC不同的是,其端头焊接层为铜镀层,且外电极端头尺寸相较常规MLCC更大。
此材料与结构有利于在内埋时端头和胶的固定粘贴,以缩短或减少连接点、导线、焊盘和导通孔,节省空间,提升产品的集成度和灵活性。
内埋型片式多层陶瓷电容器技术难点
内埋型片式多层陶瓷电容器满足125℃应用场合,由于薄型尺寸、端头大小、厚度、材料及结构有别于常规MLCC,产品的技术难点主要集中在端头设计和加工工艺上。
内埋型片式多层陶瓷电容器对整个截面铜层厚度和宽度有严格的要求,以保证有足够厚度的铜层确保瓷体与PCB之间有足够的间隙,以便注胶填充在端电极和瓷体之间;而足够的铜层宽度,也为端头与PCB提供了足够的接触面积,确保产品位置不移动。
微容科技作为国内产销量最大的MLCC制造原厂,有着行业顶尖的项目研发团队。经过项目组的潜心钻研,攻克了内埋型片式多层陶瓷电容器制程工序中的各项关键控制点,并优化配备设计工艺检测硬软件设备仪器,完成了对内埋型片式多层陶瓷电容器系列化的研发和量产。
高端化和定制化是微容科技重要的企业战略和服务宗旨;高端的产品与专业的服务是微容科技扎根市场的基石。欢迎各电子行业同仁提出各类需求并与微容科技共同探讨,持续提升价值,推进高质量发展。
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本文由玉鹤甘茗转载自微容科技公众号,原文标题为:微容科技特殊应用解决方案——内埋型片式多层陶瓷电容器(铜端子MLCC),本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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A104K0402X7R500NB*车载型片式多层陶瓷电容器产品规格书
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车规级A系列片式多层陶瓷电容器
型号- 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
宇阳科技X6S/X6T MLCC产品,具有容值较高、工作温度高的特点,保障显卡的平稳运行
随着人工智能、深度学习和虚拟现实等领域的快速发展,电子产品向高性能、高可靠性、高集成度的方向发展,对MLCC产品的性能要求也越来越高,高温高容的产品也就拥有了更多的市场应用,传统MLCC的温度和容量已无法满足当今的需求,而X6S/X6T产品具有容值较高、工作温度高的特点,更符合市场需求。
【元件】微容新推高谐振频率点、低ESL的片式三端子电容式滤波器,可减少50-60%的MLCC使用数量,节省约40%贴装空间
微容科技的MLCF产品,其外形结构有四个外端电极,能大大缩短电路在内电极中的流通路径,且有并联ESL的效果,在高频电路中的整体ESL更低,从而使得元件整体阻抗更低,更适用于高速信号电路,能起到EMI滤波器的静噪作用。
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可定制UV胶的粘度范围:150~25000cps,粘接材料:金属,塑料PCB,玻璃,陶瓷等;固化方式:UV固化;双固化,产品通过ISO9001:2008及ISO14000等认证。
最小起订量: 1支 提交需求>
可加工PCB板层数:0-60层,板材类型:高频板/高速板/高频混压板/盲埋孔板/HDI板/无卤素板/厚铜板/刚柔结合板;最大加工尺寸:622*1200MM;板厚:0.05-8.0MM;铜厚:0.33-30OZ;
最小起订量: 1 提交需求>
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