New Breed of Hypercars Turns to ATP High-Performance e.MMC for Data Storage

2023-10-31 ATP Featured Stories

Their sheer power thunders not only on the track but also on the streets. They run at outrageous speeds and their sleek designs are impressive. They are called supercars – a breed of automobiles offering the best performance, bleeding-edge technologies, and revolutionary design. The top 1% of supercars are aptly called hypercars, making them a cut above the best of the best.


Rimac Automobili’s C_Two is a fully electric hypercar that runs on a 1,914-horsepower engine, which can accelerate from 0 to 60 mph within 1.85 seconds and runs at a top speed of 412 kph (258 mph). A fusion of sophisticated style and unrivaled performance, the C_Two is a testament to Rimac’s passion for steering the electric revolution. Rimac describes itself as a “technology powerhouse” that is “Making the Future Exciting.” What began as a hobby in a garage in 2007 is now a global name in the design, development, and manufacture of pure electric hypercars, which started with the production of Concept_One.


The C_Two: A beauty to behold and a beast on the track and the streets. It is fueled by Rimac Automobili’s intense drive for perfection and the passion to steer the electric revolution. 

Wherever it runs, the Rimac C-Two is fully capable of delivering peak performance even amidst numerous difficulties such as harsh weather conditions, extreme shock and vibration, sudden temperature shifts, and power challenges.


Built from the Ground Up

Hypercars rely on electronic control systems that require reliable data storage media for their boot codes, infotainment, applications, and other digital content. For C_Two and its subsystems, Rimac has partnered with ATP Electronics, a veteran in the industrial memory and storage market with 10 years of automotive experience and nearly 30 years of manufacturing expertise.


As a true manufacturer like Rimac, ATP maintains complete control of its supply chains and takes charge of the manufacturing process starting from the smallest, most essential building block of its flash-based products: the ICs or integrated circuits. ATP’s quality journey takes place within its own fab—from IC validation, NAND wafer management, package-level validation, NAND flash screening, design validation, and testing, all the way up to the pilot run and ultimately, mass production. This gives ATP the advantage of flexibility and adaptability, offering standard as well as customizable solutions depending on the requirements of the customer. ATP products comply with the most rigid international criteria for quality and automotive-specific standards. They deliver extreme endurance and reliability in a robust package. Longevity support is also offered to ensure maximum return on investment as well as to optimize the total cost of ownership.


Accelerating the Future

Aside from its widely popular hypercars, Rimac is a full solutions provider delivering high-performance components that are designed, developed, and produced totally in-house. Its technological innovations are heavily recognized in the manufacture of subsystems not only for automotive but also nautical and e-bicycle applications: battery packs, infotainment systems, drivetrains, and electronics such as engine control units (ECU), vehicle control units (VCUs) and inverters. Rimac also develops innovative advanced driver-assistance systems and creates user and OEM platforms that ensure vehicle connectivity.

 

The Rimac DNA runs in every solution. Everything is built from the ground up and Rimac maintains control of every step in the manufacturing process; in fact, a whole car can be designed, developed, and manufactured under one roof. Only the finest components go into each product and Rimac can provide turnkey as well as bespoke solutions tailor-fitted to meet customer demands.


Rigors of the Road

With Rimac’s unquenchable thirst for perfection, it is not surprising that only the highest-quality components go into each subsystem and in each car. These components undergo severe challenges and should therefore operate reliably to guarantee driving comfort and safety. Here are some of the rigorous conditions that must be hurdled:

  • Shock/Vibration – Modern hypercars may no longer roar dramatically like traditional sports cars but due to their aggressive speeds and performance as well as terrain variations they may have to navigate, they may still be subjected to considerable shock and vibration.

  • Temperature Shifts – Advanced thermal systems, along with new materials, are revolutionizing how these fast cars are handling extreme internal and external thermal challenges. Components should comply with rigid automotive-specific standards to make sure that electrical components are suitable for use in harsh environments.

  • Power Consumption – Electric power has transformed automobiles from mechanical machines into electronic systems and has unlocked new levels of performance. With components using up power, power conservation is a major challenge.


Rimac leaves no room for error and makes sure that each part of the C_Two hypercar is painstakingly selected. For C_Two subsystems, Rimac trusts ATP to provide embedded storage for its electronic control units.


ATP e.MMC: Hyper-Reliable Embedded Storage Solution for Connected Cars

Modern automobiles are becoming increasingly connected and autonomous to make driving safer and more comfortable. Now generally viewed as part of the Internet of Things (IoT), they produce huge amounts of data that require processing, analysis, and of course, storage. The following figure from Statista shows how much data connected cars generate.

Figure 1. Data generated by connected cars


ATP e.MMC embedded storage serves as a boot-up device for varied electronic control units tasked to execute specific applications and as storage for in-vehicle infotainment (IVI).


Despite its small form factor, the ATP e.MMC is packed with big storage capacity, making it suitable for compact spaces within automotive subsystems. It is a soldered-down solution, so it is securely fastened to withstand shocks and vibrations. ATP e.MMCs qualified with AEC-Q100 Grade 2 rating can operate reliably in harsh environments within extended temperature ranges of -40℃ to 105℃ while those with Grade 3 rating support industrial operating temperatures up to 85℃.


Designed for dependable performance, the ATP e.MMC delivers 2-3X higher endurance than standard e.MMC delivers higher TBW ratings, robust storage, and long product service life while consuming minimal power.


ATP e.MMC meets Rimac’s strict qualifications for high-performance data transfer and storage, using only the finest integrated circuits (ICs). It undergoes the most comprehensive testing and validation in all stages of the manufacturing process, from IC level to drive and mass production level.


 Figure 2. Meticulous testing begins at the IC level.

    

Data reliability and retention technologies such as AutoRefresh and Dynamic Data Refresh guarantee the integrity of data by preventing read disturb in often-read and seldom-accessed areas. The SRAM Soft Error Detection and Recovery mechanism helps avoid unpredictable events that could damage the system or compromise personal safety in critical autonomous applications.


The Sudden Power-Off Recovery (SPOR) solution makes sure that data is flushed to the e.MMC prior to a power loss is kept safe and uncorrupted. Power cycling tests simulate the sudden power-off environment and verify the impact on frequently read applications such as OS boot-up and map reading.

 

Figure 3. Verified by ATP's stringent power cycling test platform, SPOR minimizes the risks during a sudden power loss. (Image is for reference only. Actual screen may vary.)

 

At the mass production level, a Rapid Diagnostic Test (RDT) is performed to evaluate product reliability using stress accelerants such as extreme temperatures, power/voltage, and other factors to catch early and latent defects.


ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40℃) and high (85℃/105℃) temperatures. ATP can perform high-volume testing according to customer requests.

Figure 4. RDT at the MP level evaluates products under extreme temperatures.

 

Data retention typically goes down as the storage device is used longer and when subjected to higher temperatures and program/erase (P/E) cycles. The following graph shows that ATP e.MMC retains stored data longer compared with others, thanks to a combination of high-quality 3D MLC, low-density parity check (LDPC) error correction mechanism, and rigid RDT process. ATP e.MMC delivers reliable performance and enhanced endurance in harsh environments with extreme temperatures as well as in demanding industrial applications with high read/write/erase operations.



Figure 5. ATP e.MMC's data retention rate is higher compared with other brands.

 

Conclusion

The unassuming ATP e.MMC, despite its tiny footprint, is the right choice for the Rimac C_Two.  Both created from the ground up and thoroughly tested for long dependable use, they portray a keen attention to technical detail, luxurious aesthetics, and breakthrough performance. Rimac’s new breed of hypercars relies heavily on data to deliver unprecedented levels of performance, and the ATP e.MMC is definitely up to the challenge.

授权代理商:世强先进(深圳)科技股份有限公司
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本文由涂抹转载自ATP Featured Stories,原文标题为:New Breed of Hypercars Turns to High-Performance e.MMC for Data Storage,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules.

ATP  -  PCIE®GEN4 X4 M.2 2280,U.2 SSD,PCIE® GEN3 NVME M.2 2230 SSD,DDR5 MEMORY,PCIE®GEN3 NVME M.2 2230固态硬盘,MICROSDHC CARD,PCIE® GEN4 NVME U.2 SSD,SATA III 2.5" SSD,USB DRIVE,SD CARD,SATA III M.2 2280 SSD,SDXC CARD,PCIE®GEN3 NVME M.2 2280固态硬盘,SATA III 2.5英寸固态硬盘,PCIE®GEN4 NVME U.2固态硬盘,USB 2.0 EUSB,CFEXPRESS TYPE B MEMORY CARDS,M.2 TYPE 1620 HSBGA SSD,M.2 2242 SSD,NVME固态硬盘,MICROSDHC卡,PCIE® GEN4 X4 M.2 2280, U.2 SSDS,SECURSTOR MICROSD CARD,MSATA固态硬盘,PCIE® GEN4 NVME E1.S SSD,SATA III MSATA SSD,DRAM模块,PCIE®GEN4 NVME M.2 2280固态硬盘,MICROSDXC卡,NVME SSDS,DDR5内存,PCIE ® GEN4 NVME CFEXPRESS CARD,EMMC,SD卡,PCIE®GEN4 NVME E1.S固态硬盘,DRAM MODULES,M.2 2280固态硬盘,PCIE®GEN3 NVME M.2 2242固态硬盘,PCIE® GEN4 NVME CFEXPRESS CARD,NANODURA双UFD,E1.S PCIE GEN4 X4 SSD,SDHC CARD,袖珍闪存卡,E.MMC,PCIE® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,MICROSD,M.2 2280 SSD,M.2 2230 SSD,SATA III M.2 2280固态硬盘,PCIE® GEN3 NVME U.2 SSD,NANODURA DUAL UFDS,MICROSD卡,CFEXPRESS卡,PCIE®GEN3 NVME U.2固态硬盘,SDXC卡,SATA III M.2 2242 SSD,PCIE® GEN3 NVME M.2 2242 SSD,MICROSD CARD,CFAST卡,1.ES PCIE GEN4 X4固态硬盘,SDHC卡,PCIE®GEN3 NVME M.2型1620 HSBGA固态硬盘,随身碟,CFEXPRESS CARD,COMPACTFLASH CARD,COMPACTFLASH卡,PCIE®GEN4 NVME CFEXPRESS卡,PCIE® GEN3 NVME M.2 2280 SSD,PCIE ® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,EUSB,VALUE LINE SSDS,M.2型1620 HSBGA SSD,CFEXPRESS B型存储卡,CFAST CARD,M.2 2230固态硬盘,价值线固态硬盘,MSATA SSD,SECURSTOR MICROSD卡,PCIE® GEN4 NVME M.2 2280 SSD,MICROSDXC CARD,COMPACT FLASH CARD,M.2 2242固态硬盘,PCIE ® GEN3 NVME U.2 SSD,SATA III M.2 2242固态硬盘,A750PI,S600SC,B800PI,S750 SERIES,S600SI,B600SC,N700PC,A750 SERIES,E650SC,N601,N651SI,A600VI,S800PI,E600VC,I800PI,A600VC,A650SI,A650SC,N651SC,N750,S650SI,A600VI SERIES,N750PI,N651SIE,A800PI,N601 SERIES,A700PI,N651SIA,N650 SERIES,E600SAA,A750,A600VC SERIES,N600SC,E600SA,E650SI,N750 SERIES,E700PIA,N600SI,S650,S650SC,N651SI SERIES,E700PAA,B600SC SERIES,E600SI,N600VI SERIES,I700SC,N600VI,N650SI,E600SIA,N650SC,E750PI,N600VC,I600SC,E750PC,N651,S700PI,A650 SERIES,N650,N751PI,S700PC,N600VC SERIES,N651 SERIES,S650 SERIES,A650,N601SC,S750PC,E700PI,A600SI,N700PI,E700PA,S750,S750PI,E700PC,N651SCE,A600SC,数据记录,伺服器,汽车,AI SURVEILLANCE INFRASTRUCTURES,NETWORKING,ARTIFICIAL INTELLIGENCE (AI)-ENABLED SURVEILLANCE,HANDHELD COMPUTING,工业企业,物联网,手持计算,WEB SERVERS,网络,DATA LOGGING,POINT-OF-SALE (POS) TRANSACTIONS,自动化,IMAGING,企业,5G,STORAGE,成像,POS,销售点(POS)交易,BOX PCS,AUTOMOTIVE,SERVER,电信,ENTERPRISE,TRANSPORTATION,ROBOTICS,IOT,交通运输,SURVEILLANCE,人工智能(AI)监控,盒装PCS,边缘计算系统,工业,机器人学,AUTOMATION,EDGE COMPUTING,MISSION-CRITICAL APPLICATIONS,边际运算,INTERNET OF THINGS,EDGE COMPUTING SYSTEMS,TELECOM,INDUSTRIAL,INDUSTRIAL ENTERPRISE,关键任务应用程序,监控,存储器,人工智能监控基础设施,网络服务器

022024  - 选型指南  - v1.0 代理服务 技术支持 采购服务

ATP e.MMC v5.1 Embedded Flash Storage Solution

ATP e.MMC v5.1 是一款集成了NAND闪存、高级闪存控制器和快速MultiMedia Card(MMC)接口的高级存储解决方案。它具有工业级性能、极强耐用性和可靠性,适用于空间受限但需在恶劣环境中保持耐久性的嵌入式系统。

ATP  -  ATP E.MMC V5.1嵌入式闪存存储解决方案,ATP E.MMC V5.1 EMBEDDED FLASH STORAGE SOLUTION,E700PI,E700PIA,E600SIA,E800PI,E600SI,E700PAA,E600SAA,医学,AUTOMATION,NETWORKING,网络,TRANSPORTATION,IOT GATEWAYS / 5G SMALL CELL,EMBEDDED PCS,无人机,自动化,试验和测量,移动/手持计算机,SURVEILLANCE,嵌入式PC,交通运输,监控,TEST AND MEASUREMENT,MEDICAL,MOBILE/HANDHELD COMPUTERS,DRONES,物联网网关/5G小蜂窝

1909  - 数据手册 代理服务 技术支持 采购服务 查看更多版本

当最大的或最新的并不总是最好的:2D存储解决方案万岁

该资料主要介绍了ATP Electronics公司生产的SD/microSD卡、e.MMC和SD/SDHC/SDXC卡等存储产品的特性、规格和性能。产品具备防水、防尘、抗静电等特性,支持工业和商业温度范围,具有长达5年的供应周期。资料详细列出了不同产品的性能参数,包括顺序读写速度、功耗、耐用性和可靠性等,并提供了产品尺寸、认证和保修信息。

ATP  -  SD,MICROSD,E.MMC,COMMERCIAL,INDUSTRIAL,商业的,工业

092024  - 商品及供应商介绍  - v1.0 代理服务 技术支持 采购服务

E600Saa系列AF016GEC5X-2001A2/AF032GEC5X-2001A2/AF064GEC5X-2001A2/AF128GEC5X-2001A2汽车-等级E.MMC数据表

本资料为ATP Electronics生产的汽车级e.MMC存储解决方案的数据表。该系列包含不同容量的产品(16GB至128GB),符合AEC-Q100 Grade 2标准,适用于汽车和工业应用。产品具备高可靠性、耐用性和高性能特点,支持高速数据传输、代码和数据存储等功能。

ATP  -  E.MMC,AF128GEC5X-2001A2,AF032GEC5X-2001A2,AF064GEC5X-2001A2,E600SAA,AF016GEC5X-2001A2

数据手册  - Revision 1.1 代理服务 技术支持 采购服务

E600Si/E600Sia e.MMC 3D MLC and SLC Mode Reliability Report Summary

本报告旨在展示工业和汽车级3ATP e.MMC基于3D NAND MLC和SLC模式闪存的存储可靠性。报告涵盖了不同容量(16GB至128GB)的E600Si/E600Sia(3DMLC)和E700Pi/E700Pia(3DSLC模式)产品的数据保留测试结果,强调了其在高温和高循环次数下的可靠性和耐用性。

ATP  -  E.MMC 3D MLC AND SLC MODE,E.MMC 3D MLC和SLC模式,E700PI,E600SIA,E700PIA,E600SI

20190910  - 数据手册  - v1.0 代理服务 技术支持 采购服务

E700PI系列AF010GEC5A-SEK0111工业级SLC模式e.MMC数据表

本资料为ATP Electronics Inc.生产的工业级SLC模式e.MMC E700Pi系列产品的数据手册。该产品是一款嵌入式存储解决方案,采用MMC接口、闪存和控制器集成在同一IC封装中,适用于嵌入式和商业应用。产品具备高可靠性、高性能、长寿命等特点,支持多种高级功能,如动态数据刷新、自动刷新、SRAM软错误检测和恢复技术等。

ATP  -  INDUSTRIAL-GRADE SLC MODE E.MMC,INDUSTRIAL-GRADE E.MMC,工业级SLC模式E.MMC,工业级E.MMC,E700PI,E700PI SERIES,AF010GEC5A-SEK0111,COMMERCIAL APPLICATIONS,INDUSTRIAL,商业应用,工业

Jul. 28th 2020  - 数据手册  - Revision 1.0 代理服务 技术支持 采购服务
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ATP半导体冷板制冷器定制

可定制ATP TE Cooler的冷却功率:40~200W;运行电压:12/24/48V(DC);控温精度:≤±0.1℃; 尺寸:冷面:20*20~500*300;热面:60*60~540*400 (长*宽;单位mm)。

最小起订量: 1 提交需求>

丙烯酸/光固化&双固化UV胶定制

可定制UV胶的粘度范围:150~25000cps,粘接材料:金属,塑料PCB,玻璃,陶瓷等;固化方式:UV固化;双固化,产品通过ISO9001:2008及ISO14000等认证。

最小起订量: 1支 提交需求>

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授权代理品牌:机械电子元件

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授权代理品牌:加工与定制

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