ROHM Silicon Capacitor BTD1RVFL Series Achieves the Industry’s Smallest* size in a Mass-produced Surface Mount Package
ROHM has developed new Silicon Capacitors - the BTD1RVFL series. The devices are increasingly being adopted in smartphones and wearable devices. Silicon semiconductor processing technology cultivated over many years has enabled higher performance in a smaller size.
Smartphones and other devices with growing functionality require smaller components that support high-density mounting. Silicon capacitors using thin-film semiconductor technology can provide higher capacitance in a thinner form factor than existing multilayer ceramic capacitors (MLCCs). At the same time, stable temperature characteristics, along with excellent reliability, are accelerating their adoption in a variety of applications. In anticipation of the growth of the global market for silicon capacitors to 300 billion yen (about 2 billion US dollars) by 2030 (approximately 1.5 times higher than in 2022), ROHM has developed compact high-performance silicon capacitors by leveraging proprietary semiconductor processes.
Fig.1
ROHM’s silicon capacitors manufactured using proprietary RASMID™ miniaturization technology allow processing in 1µm increments that eliminate chipping during external formation and improve dimensional tolerances within ±10µm. This small variation in product size enables mounting with a narrower distance between adjacent components. At the same time, the backside electrode used for bonding to the substrate has been expanded to the periphery of the package to improve mounting strength.
The first series in the lineup, the BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) consists of the industry’s smallest 01005-size (0.1inch × 0.05inch) / 0402-size (0.4mm × 0.2mm) mass-produced surface mount silicon capacitors. The mounting area is reduced by approximately 55% over general 0201-size (0.2inch × 0.1inch) / 0603-size (0.6mm × 0.3mm) products to just 0.08mm², contributing to greater application miniaturization. Moreover, a built-in TVS protection element ensures high ESD resistance that minimizes the number of person-hours required for surge countermeasures and other circuit design elements.
ROHM plans on developing a second series in 2024 featuring superior high-frequency characteristics ideal for high-speed, large-capacity communication equipment. ROHM is also developing products for servers and other industrial equipment to expand applicability further.
Fig.2
Product Lineup
Table.1
Application Examples
Smartphones, wearables, compact IoT devices, optical transceivers, etc.
Online Sales Information
Sales Launch Date: August 2023
Applicable Part Nos: BTD1RVFL102 (1000pF), BTD1RVFL471 (470pF)
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本文由三年不鸣转载自ROHM News，原文标题为:ROHM Develops the First Silicon Capacitor BTD1RVFL Series，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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