Introduction of Thermal Gel and Its Application

时间： 2023-11-08 来源：SHEEN News

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The Thermal Gel series is a two-component preformed thermal grease product that meets the requirements of low pressure, high compression modulus when used in the product, enabling automated production, good contact with electronic products when assembled a lower contact resistance, and good electrical insulation properties. This material also has some advantages of thermal pads and thermal grease, which makes up for the weaknesses of both.

The thermal gel has the advantages of good affinity, good weather ability, high and low-temperature resistance, and good insulation. At the same time, the plasticity is strong enough to meet the filling of the uneven interface, which can meet the heat transfer demand of various applications. With high thermal conductivity, low compression force applications, low pressure, high compression ratio, high electrical insulation, and good resistance to new energy, thermal gel can be used to achieve the performance of automation.

Performance Characteristics

The thermally conductive gel, which is softer and has better surface affinity, can be compressed to a very low thickness relative to the thermal pad, resulting in a significant increase in heat transfer efficiency and a minimum compression of 0.1 mm. The thermal resistance at this time 0.08℃ · in²/W - 0.3℃ · in²/W, can reach the performance of part of the grease. In addition, the thermal gel has almost no hardness and, after the use of equipment will not produce internal stress.

Thermal Gel Gel is easier to handle than thermal grease. The general use of silicone grease is screen or steel plate printing or direct brushing, the user and the environment are very friendly, and because of its certain flow, generally can not be used for a thickness of 0.2mm or more occasions.

And the conductive mud is arbitrarily shaped into the desired shape, and the uneven PCB board and the irregular device (such as the battery, the corner of the component, etc.), are able to ensure good contact.

Thermal gel has a certain adhesion, and there will be no oil and dry problems, in the reliability of a certain advantage.

Application of Thermal Gel

Thermally conductive gels are widely used in LED chips, communications equipment, mobile CPUs, memory modules, IGBTs and other power modules, and power semiconductors.

The application is the LED bulb in the drive power applications. In the export of LED lights, in order to UL certification, the manufacturer more use of two-component potting. Exports to the United States lamps require a 50,000-hour warranty the current quality of LED lamp beads is no problem, the main failure is the power supply, the use of plastic potting power can not be demolished, only the whole lamp is discarded. If the use of thermal insulation on the power of the local filling, you can effectively carry out the heat, if the power supply problems can also be easily replaced by the power supply for the enterprise to save costs. Of course, for the requirements of waterproof lights. Because the heat transfer mud can not be the same as the potting of all and the gap to fill, can not be waterproof and moisture, still need to use potting.

Another typical application is in the LED fluorescent tube, the power on the two ends of the design, in order not to take up the size of the lamp, the two power supply space is relatively small, and 1.2 meters LED fluorescent lamp power is usually designed to 18w to 20w so that the heat to drive the power becomes larger. The heat transfer mud can be filled into the gap of the power supply, especially attached to the power device to help heat the lamp to extend its life. For some of the sealed module power supplies, you can use the heat transfer mud for local filling to achieve the effect of heat conduction.

Then the chip heat, in this way, we should also be more familiar with the same processor and the middle of the kind of silicon heat sink is a principle, its role is to allow the processor to send the heat can be faster To the radiator to emit out.

Similarly, thermal gel can also be used in mobile phone processors. Huawei's mobile phone processors will use thermal conductivity similar to silicone grease, which is better than the contact effect of a thermal conductivity film with only viscous graphite, and the thermal conductivity will be faster.

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本文由上山打老虎转载自SHEEN News，原文标题为:Introduction Of Thermal Gel And Its Application，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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汉华（Hanhua）导热界面材料选型指南

汉华 - 人工合成石器膜,GRAPHENE FIBER THERMAL PAD,石黑烯纤维导热硅胶垫,含玻纤导热硅胶垫,POLYIMIDE FILM SILICONE THERMAL PAD,导热硅脂,导热硅胶垫片,导热硅胶垫,HIGH THERMAL CONDUCTIVITY SILICONE THERMAL PAD,GRAPHENE THERMAL FILM,石墨烯热膜,高导热性硅胶热垫,GENERAL-PURPOSE THERMAL GEL,覆矽胶布导热硅胶垫,无硅热垫,石黑烯导热膜,导热垫片,SYNTHETIC GRAPHITE FILM,覆聚酰亚胺膜导热硅胶垫,POLYIMIDE FILM THERMAL INSULATION SHEET,含聚酰亚胺膜导热绝缘片,双组份导热凝胶,双组分热凝胶,玻璃纤维硅胶保暖垫,人工合成石墨膜,导热绝缘片,玻璃纤维隔热板,通用热凝胶,TWO-COMPONENT THERMAL GEL,THERMAL GREASE,高导热凝胶,含玻纤导热绝缘片,非硅导热垫,GENERAL-PURPOSE SILICONE THERMAL PAD,HIGH TENSILE SILICONE THERMAL PAD,SI-FREE THERMAL PAD,高导热热凝胶,人造石墨薄膜,高强度硅胶热垫,高导热硅胶垫,LOW DENSITY THERMAL SILICONE PAD,导热膏,石墨烯纤维保暖垫,HIGH THERMAL CONDUCTIVITY THERMAL GEL,普通导热硅胶垫,抗拉导热硅胶垫,GLASS FIBER SILICONE THERMAL PAD,石墨烯纤维导热硅胶垫,聚酰亚胺薄膜硅胶热垫,SILCONE-COATED THERMAL PAD,聚酰亚胺薄膜隔热板,导热凝胶,涂有硅胶的热垫,散热膏,普通导热凝胶,GLASS FIBER THERMAL INSULATION SHEET,通用硅胶热垫,低密度导热硅胶垫,石墨烯导热膜,HI,HT90,HL10,HL,HP10,HP,HS,HT,HI系列,KCH30,THSB30,KHGC系列,THSI10,HT80,HI25,THSB25,THSB20,KGF系列,HG70,HI30,KHG80,HL30,KGF100,KGF060,HP30,THSI系列,KHGC50,KGC35,HS10,KGS040A,KCH15,THSB10,HC20,KGT55,KG,HC25,KHGC60,KGS系列,HL20,KGS025A,KGC,HL25,HP20,HP25,HAZ20,KGF,KCH20,KGC系列,KCH25,HAZ10,KGS,HT100,KGT,KGF080,HC10,HAZ,KHG60,HC系列,KGC15,HS30,HG系列,KHG,HAZ30,HS35,HAZ25,KGT35,HB20,HAZ系列,HG40,HB25,KG35,KHGC80,KG15,KGT系列,KGC25,HS20,HS25,HL系列,HP系列,HB10,HT系列,HC30,KGT45,KG25,HI10,HT70,HS50,HB系列,KGS032A,THSI30,KHG系列,HG60,KHGC,HI20,KGS017A,THSB,HS40,HT60,KHG50,KG系列,THSI,KCH,KGT20,HS系列,HB30,THSI25,HB,HC,HG50,THSI20,THSB系列,HG,通讯设备,电机控制,器具,POWER MODULES,家电产品,ELECTRICAL CONTROL,COMMUNICATION EQUIPMENT,散热片,MEMORY MODULES,摄像机监视器,平面显示器,POWER SEMICONDUCTORS,MOTOR CONTROL,数据中心,新能源汽车电池模块,散热器,新能源汽车动力电池模组,摄像监控器,高速网络通信产品,服务器,HIGH-SPEED NETWORK COMMUNICATION PRODUCTS,COMMUNICATION BASE STATIONS,DATA CENTERS,APPLIANCES,POWER SUPPLIES,网络通讯产品,SMARTPHONES,功率模块,新能源汽车电池模组,LED CHIPS,FLAT-PANEL DISPLAYS,COMPUTERS,电源模块,医疗设备,高速储存设备,平板电脑,5G SMARTPHONES,汽车车灯,电脑,TABLET PCS,发光二极管,网络通信产品,笔记本电脑,内存模块,AEROSPACE,汽车电子,数码相机,HEAT SINKS,手持终端,POWER CONVERSION EQUIPMENT,HOUSEHOLD APPLIANCES,NEW ENERGY VEHICLE BATTERY MODULES,CAMERA MONITORS,COOLING MODULES,马达控制,DIGITAL CAMERAS,IGBTS,功率转换设备,MOBILE PHONE CPUS,电机电控,汽车灯,高速网通产品,高速存储设备,HIGH-SPEED LARGE-STORAGE DRIVES,电器电控,马达,电气控制,航空航天,功率半导体,LEDS,MOTORS,平板显示器,加热功率装置,IGBT,SERVERS,手机CPU,智能手机,功率半导体领域,AUTOMOTIVE LIGHTS,高速大存储驱动,高速大存储驱动器,冷却模块,NETWORK COMMUNICATIONS PRODUCTS,5G智能手机,通信基站,LAPTOPS,NETWORK COMMUNICATION PRODUCTS,HIGH-SPEED STORAGE DEVICES,散热模组,MEDICAL EQUIPMENT,HEATING POWER DEVICES,LED,发热功率器件,通信设备,家用电器,电源,AUTOMOTIVE ELECTRONICS,HANDHELD TERMINALS,LED芯片,计算机

2020/10/21 - 选型指南代理服务技术支持采购服务

THERM-A-GAP™ GEL 37 高性能完全固化可分配凝胶

THERM-A-GAP™ GEL 37是一种高性能、可涂抹的热界面材料，具有3.7 W/m-K的热导率。该产品专为将电子设备的热量传导至散热器或外壳而设计，适用于自动化点胶机、返工和现场维修等情况。

PARKER CHOMERICS - HIGH PERFORMANCE FULLY CURED DISPENSABLE GEL,HIGH PERFORMANCE, ONE COMPONENT, DISPENSABLE THERMAL INTERFACE MATERIAL,高性能、单组分、可分配的热界面材料,高性能全固化可溶凝胶,GEL 37,65-02-GEL37-0030,65-1P-GEL37-2500,65-02-GEL37-0180,THERM-A-GAP GEL 37,65-00-GEL37-0300,65-5P-GEL37-7800,THERM-A-GAP™ GEL 37,65-00-GEL37-0010,微处理器,电源模块,中央处理单元,POWER SUPPLIES,半导体,POWER MODULES,MEMORY MODULES,CPU,CENTRAL PROCESSING UNITS,SEMICONDUCTORS,MICROPROCESSORS,CPUS,电源,电信基站,TELECOM BASE STATIONS,内存模块

March 2023 - 数据手册代理服务技术支持采购服务

Parker Chomerics（派克固美丽）热界面材料（热传导性凝胶/在位灌封材料/润滑脂）选型指南

Company Profile Overview of Dispensable Materials Material Selection Equipment Types Technical Parameters Packaging Options

PARKER CHOMERICS - 现场固化灌封化合物,GELS,ELECTRONIC APPLICATION,UNDERFILL MATERIALS,导热凝胶,DISPENSABLE, VERY LOW COMPRESSION FORCE, THERMAL GAP FILLERS,THERMAL GREASES,THERM-A-GAP™ GELS,CURE-IN-PLACE POTTING COMPOUNDS,热接口材料,热润滑脂,TIM,THERMALLY CONDUCTIVE GELS,THERMAL INTERFACE MATERIAL,POTTING MATERIALS,T636,T647,T635,T646,CIP 35,GEL 30,T642,TC 50,GEL 25NS,1642,1641,GEL 8010,T630,GEL 75,T650,GEL 45,T660,T670,GEL 37,HIGH-VOLUME AUTOMATED DISPENSING SYSTEMS,配药设备,制动控制,CONSUMER ELECTRONICS,消费电子,POWER DRIVERS,MEMORY MODULES,功率半导体,TELEVISIONS,移动服务器,DC/DC CONVERTERS,DC/DC转换器,LED模块,欧洲货币单位,MICROPROCESSORS,电信基站,不间断电源,TELECOM BASE STATION,POWER CONVERSION EQUIPMENT,TELECOM BASE STATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,DISPENSING EQUIPMENT,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,MOBILE SERVERS,微处理器,POWER SUPPLIES,BRAKING CONTROLS,MOSFET ARRAYS,发动机,牵引力控制,UNINTERRUPTABLE POWER SUPPLIES,功率转换设备,TRACTION CONTROLS,电视和电子产品,金属氧化物半导体场效应晶体管阵列,功率驱动器,POWER SEMICONDUCTORS,汽车电子控制单元,DESKTOPS,电源,ECU,高容量自动分配系统,TELEVISIONS ELECTRONICS,内存模块,台式机,LED MODULES

May 2021 - 选型指南代理服务技术支持采购服务

Therm-A-Gap™凝胶60HF高性能高流速完全固化可分配凝胶

THERM-A-GAP™ GEL 60HF 是一种高性能、高流量率的单组分硅酮基热界面材料。它具有6.2 W/m-K的热导率，专为电子组件到冷却部件的高效传热设计，适用于多个行业和应用。该产品适合大量注胶和高产量生产操作，具有良好的重工作和现场维修性能。

PARKER CHOMERICS - 完全固化，单组分，硅基，可分配的热界面材料,FULLY CURED, ONE COMPONENT, SILICONE-BASED, DISPENSABLE THERMAL INTERFACE MATERIALS,HIGH PERFORMANCE HIGH FLOW RATE FULLY CURED DISPENSABLE GEL,高性能高流速全固化可分散凝胶,65-00-GEL60HF-0300-B,65-1P-GEL60HF-2500,GEL 60HF,65-5P-GEL60HF-7500-B,65-02-GEL60HF-0180,65-00-GEL60HF-0010-B,65-02-GEL60HF-0030-B,65-00-GEL60HF-0300,THERM-A-GAP GEL 60HF,THERM-A-GAP™ GEL 60HF,65-02-GEL60HF-0030,65-1P-GEL60HF-2500-B,65-5P-GEL60HF-7500,65-02-GEL60HF-0180-B,65-00-GEL60HF-0010,储能装置,ENERGY STORAGE DEVICES,MEMORY,GPUS,消费电子,CPU,POWER ELECTRONICS,AUTOMOTIVE CONTROL UNITS,COMPUTING COMPONENTS,电力电子,GPU,MODULES,计算组件,电信设备,SENSORS,CPUS,内存,TELECOMMUNICATIONS EQUIPMENT,模块,传感器,汽车控制单元,CONSUMER ELECTRONICS

January 2023 - 数据手册代理服务技术支持采购服务

关于帕克2019财年的关键事实

PARKER CHOMERICS - MICROWAVE ABSORBER,板级屏蔽漆,MOLDED ELASTOMER,NI/AL CORROSION RESISTANT EMI GASKETS,高导电性热凝胶,HIGH CONDUCTIVITY THERMAL GELS,ROBOTICALLY DISPENSED EMI GASKETS,镍/铝耐腐蚀EMI垫片,导电填料,增值组件,金属通风口和指尖,PREMIER™ SINGLE PELLET CONDUCTIVE PLASTIC,EMI屏蔽注塑件,DISPLAY GLASS,EMI SHIELDING RESIN,METAL CANS,织物垫片,FORM IN PLACE GASKETS,CONDUCTIVE ELASTOMER,EMI SHIELDING VENTS,就地成型垫片,DIE CUT SHEET STOCK,集成液晶显示器,显示玻璃,GAPFILL ERPADS,自动分配EMI垫圈,网带®垫圈,导电织物泡沫,触摸屏,TOUCH SCREENS,散热器,电磁波屏蔽,MESH STRIP® GASKETS,BOARD LEVEL SHIELDING PAINTS,将CHOMERICS零件集成到完整组件中,FINGERSTOCK,CONDUCTIVE PLASTIC,挤压弹性体,密封剂,MOLDED GASKETS,导电涂料,高精度注塑件,金属垫片,SEALANTS,模压弹性体,EMI SHIELDING,HIGH PRECISION INJECTION MOLDED PARTS,模制垫圈,通风孔,EMI屏蔽窗,VALUE ADDED ASSEMBLIES,METAL FINGERSTOCK,热凝胶,VENTS,过氧化镁,THERMAL GREASE,FABRIC GASKETS,嵌缝,PREMIER™ 单颗粒导电塑料,FORM-IN-PLACE GASKETS,吸波泡棉,电磁干扰屏蔽带,METAL GASKETS,导电弹性体,EMI SHIELDED WINDOWS,CAULKS,OVERMOLDELASTOMER,EXTRUDED ELASTOMER,INTEGRATED LCD DISPLAYS,指尖,PREMIER™ 导电工程塑料,泡沫,METAL VENTS & FINGERSTOCK,CO-EXTRUDED ELASTOMER,金属罐,EMI屏蔽树脂,EMI屏蔽通风口,散热膏,PREMIER™ CONDUCTIVE ENGINEERED PLASTICS,HEAT SPREADERS,EMI SHIELDED INJECTION MOLDED PARTS,导电塑料,金属指尖,FOAM,GASKETS,CONDUCTI VEPAINTS,INTEGRATION OF CHOMERICS PARTS INTO FULL ASSEMBLIES,垫片,共挤弹性体,CONDUCTIVE FILLER,THERMAL GELS,CONDUCTIVE TEXTILE FOAM,EMI SHIELDING TAPE,模切板料,CHO-FORM 5550,SOFT SHIELD 4850,CHO-FORM 5552,CHO-BOND® 584-29,THERM-A-GAP GEL,CHO-FORM 5538,CHO-MUTE 9025,CHO-MUTE 9005,SOFT-SHIELD 3700,SOFT-SHIELD 4800,CHO-BOND® 1075,CHO-BOND® 580-208,SOFT-SHIELD 4850,CHO-FORM® 5528,CHO-SEAL 2557,CHO-SEAL 2532,SOFT-SHIELD 3500,CHO-BOND® 1038,CHO-SEAL 2542,无线手持设备,FLUID CONNECTORS,CELLULAR BASE STATION ENCLOSURES,蜂窝基站外壳,APU,DESKTOP COMPUTERS,MEMORY MODULES,锡铅焊点更换,工程材料,蜂窝基站,AUTOMOTIVE,SETTOP BOX,通信,COMPUTER,移动蜂窝通信,大型计算机,信息技术,NOTEBOOKS,铸造外壳,电源组件,WIRELESS DEVICE HOUSINGS,NIGHT VISION EQUIPMENT,有线电信机柜,板屏蔽,MOTION SYSTEMS INSTRUMENTATION,I/O CONNECTOR PANEL,商用飞机翼板垫片,远程信息处理,全球定位系统,SET TOP BOXES,背板,LIFE SCIENCE,COMMUNICATIONS,ANTENNA ATTACHMENT,MISCELLANEOUS ELECTRONICS DEVICES,ENGINEERED MATERIALS,加固型计算机,小型消费电子产品外壳,IT,夜视设备,当没有机械附件时使用，如螺栓和螺母,NETWORK DEVICES,I/O连接器面板,电子外壳,BACKPLANES,SEAMS OF EMI SHIELDED ROOMS AND ELECTRONIC ENCLOSURES,ELECTRICAL CONTACT TO SURFACES THAT CAN’T BE SOLDERED (PLASTIC OR ALUMINUM),超级笔记本,网络设备,服务器,MEDICAL,台式电脑,机顶盒,MILITARY COMMUNICATIONS SYSTEMS,TELECOM CABINETS,电信,台式计算机,军事电子,竞争性导电泡沫,军事通信系统,POWER SUPPLIES AND UNINTERRUPTABLE POWER SUPPLIES,笔记本,LIFE SCIENCES,FOIL WRAPPED GASKETS,NETWORK SERVERS,街机游戏,MOBILE ELECTRONICS,压缩应用不是纯粹的,EMI/ENVIRONMENTAL SEALS,ARCADE GAMES,后侧检测系统,MILITARY ELECTRONICS,CABINETS,EMI/环境密封,产生热量,FOR LOW POWER APPLICATIONS,微处理器,COMPETITIVE CONDUCTIVE FOAMS,纤维缠绕垫片,游戏控制台,APPLICATIONS IN COMPRESSION NOT SHEER,MAINFRAME COMPUTERS,冲压金属输入/输出,中央处理器,INFORMATION TECHNOLOGY,无线设备外壳,DEFENSE,FABRIC WRAPPED GASKETS,STAMPED METAL I/O’S,TELECOM,CAST HOUSINGS,ULTRABOOKS,有线电视盒,电脑,发光二极管,医疗展示组件,REAR SIDE DETECTION SYSTEM,COMMERCIAL AIRCRAFT WING PANEL GASKETS,内存,FOR SMD COMPONENTS,笔记本电脑,内存模块,SUB RACK ASSEMBLIES,HAND HELD ELECTRONICS,网络服务器,ELECTRONIC ENCLOSURES,医学,流体连接器,汽车,导电外壳,橱柜,汽车发动机控制模块,MEDICAL DISPLAY ASSEMBLIES,CPU,EMI/RFI GASKET BONDING,GPS,任何接口连接器,GPU,医学电子学,REPLACE LEAD-TIN SOLDER JOINTS,CABLE SHIELDING,子架组件,BOARD SHIELDING,AEROSPACE,LOW CLOSURE FOR GASKET,阴极射线管的接地,电信外壳,MEDICAL ELECTRONICS,垫片低闭合,电源和不间断电源,SMD组件,铝或塑料不能接触的表面,其他电子设备,FILTRATION,POWER SUPPLIES,路由器,功率转换设备,手持设备,电信机柜,AUTOMOTIVE ELECTRONIC ENCLOSURES,WIRELESS HANDHELDS,运动系统仪器,EMI屏蔽室和电子外壳的接缝,移动电子设备,汽车电子外壳,低功耗应用,TELCOM,ELECTRICAL GROUND OF CRT’S,COMPUTERS,CELLULAR BASE STATIONS,箔包垫片,MEMORY,INDUSTRIAL,LED模块和电源驱动器,天线连接,航空航天,ANY CONNECTOR INTERFACE,MOBILE CELLULAR COMMUNICATIONS,TELEMATICS,LEDS,GENERATE HEAT,电缆屏蔽,SERVERS,EMI/RFI垫片粘接,MICROPROCESSORS,SMALL CONSUMER ELECTRONICS ENCLOSURES,POWER CONVERSION EQUIPMENT,TELECOM ENCLOSURES,AUTOMOTIVE ECMS,CONDUCTIVE ENCLOSURES,HANDHELD DEVICES,国防,工业,POWER SUPPLY ASSEMBLIES,RUGGEDIZED COMPUTERS,LED MODULES AND POWER DRIVERS,NOTEBOOK,辅助动力装置,ROUTERS,手持式电子设备,USED WHEN NO MECHANICAL ATTACHMENT IS AVAILABLE E.GBOLT AND NUT,CATV BOXES,过滤,电源,WIRED TELECOM CABINETS,GAME CONSOLES,LAPTOPS,生命科学,DESKTOP PCS,计算机

商品及供应商介绍代理服务技术支持采购服务

Thermal Interface Material Supplier Offers High-Quality TIM Solutions

When it comes to thermal management solutions, choosing a reliable thermal interface material (TIM) manufacturer is essential. Sheen Technology is a leading provider of high-quality TIMs, offering innovative solutions to meet the diverse needs of industries such as automotive, electronics, and telecommunications.

2024-11-21 - 原厂动态代理服务技术支持采购服务

热凝胶21-365BA

本资料介绍了型号为21-365BA的热凝胶（Thermal Gel），一种软质、单组分硅酮膏状热界面材料。该产品适用于填充大间隙并降低对敏感组件的机械应力，具有良好的导热性、低挥发性、电绝缘性和易流动性等特点。

中石科技 - THERMAL GEL,GAP FILLER,热凝胶,间隙填充剂,SOFT, SINGLE PART, SILICONE PUTTY THERMAL GAP FILLER,软质、单件、硅酮腻子热填缝剂,21-3XX-001-YYY,21-365BA-001-005G,21-365BA-001-300M,21-365BA,机顶盒,家庭网络,COMMON HEAT SINK,MEMORY MODULES,HOME NETWORK,等离子平板显示器,RADIOS,电力电子,PDP FLAT PANEL,LCD FLAT PANEL,TELECOMMUNICATION HARDWARE,收音机,液晶平板,LED SOLID STATE LIGHTING,SET TOP BOXES,普通散热器,AUTOMOTIVE ELECTRONICS,底盘,POWER ELECTRONICS,CHASSIS,通信硬件,大容量存储设备,SMALL OFFICE NETWORK,LED固态照明,小型办公网络,MASS STORAGE DEVICES,内存模块,汽车电子,框架,FRAME

2022 Feb. - 数据手册 - Version 2022 Feb. 代理服务技术支持采购服务

热凝胶21-361

Jones Tech PLC推出的Thermal Gel 21-361是一种单组分硅酮热膏，无需固化。该产品适用于大间隙容忍度且需低机械应力的情况，用于填充多个组件与散热器之间的可变间隙。它具有优异的热传导性能和良好的顺应性，能够在压力下轻松流动。

中石科技 - THERMAL GEL,THERMAL MANAGEMENT MATERIAL,热凝胶,SOFT, SINGLE PART, SILICONE PUTTY THERMAL GAP FILLER,热管理材料,软质、单件、硅酮腻子热填缝剂,21-3XX-AB-YYY,21-361,21-361-080-25KG,21-361-010-800G,GPS NAVIGATION,MEMORY MODULES,HEAT SINK,等离子平板显示器,电力电子,视频组件,PDP FLAT PANEL,LCD FLAT PANEL,TELECOMMUNICATION HARDWARE,PORTABLE DEVICES,便携式设备,AUDIO COMPONENT,配套部件,散热片,MATING COMPONENTS,液晶平板,VIDEO COMPONENT,GPS导航,AUTOMOTIVE ELECTRONICS,底盘,POWER ELECTRONICS,CHASSIS,通信硬件,大容量存储设备,音频组件,MASS STORAGE DEVICES,IT基础设施,IT INFRASTRUCTURE,内存模块,汽车电子,框架,FRAME

2023 Feb. - 数据手册 - Version 2023 Feb. 代理服务技术支持采购服务

What is Thermal Putty?

Thermal putty, also known as thermal gel, is a highly versatile thermal interface material (TIM) designed to efficiently transfer heat between electronic components and their cooling solutions.

2024-08-17 - 技术探讨代理服务技术支持采购服务