【经验】IDT HXT44120-DNG DML driver键合打线流程以及注意事项
目前芯片的引线键合主要技术有两种，即热压键合和热超声键合。下面主要结合IDT（被RENESAS收购）的DML driver 28Gbps 1ch-4ch HXT44120-DNG裸DIE对于COB封装下的热压键合引线大致工艺流程以及注意事项做简要介绍，此方法主要应用在金丝键合工艺领域。
键合工艺流程：
1.劈刀把金丝前端烧成球，加热熔化成滴。如图所示的球状金丝
SEM图
2.往driver上的pad位置垂直下压 ，同时加热，使driver上的pad与金球相连，如下图
SEM图 金相图
3.劈刀离开，金线拉弯，拉到第二个pad，即第二键合点位置，然后把金丝压断，加热，则第二键合打线完成，如下图所示。
SEM图 金相图
芯片键合形貌如下图
注意事项：
1. 键合球往下焊压，如果占面积太大，有个疙瘩，对于高频射频电信号损伤。可用楔型键合，这个占面积小。
2.两键合之间的间距应在两倍线宽以上。线与线之间应避免交叉的情况出现。
3.键合球打线不超出Pad边缘的1/4.打线的力度应符合键合拉拔力的行业标准。（验证可通过弹坑实验得出）。
4.键合类型有纯金键合，纯铜键合，铜铝键合，银键合，镀钯银键合，镀钯铜键合，但是一般精密芯片对于纯铜键合，铜铝键合，银键合被认为是高风险。对于光芯片来说，其高速性能和高标准要求，必须是纯金键合。
5.Driver 表面一般为Al PAD,尺寸大小一般为60-80um，第一键合点为键合球，球直径为线宽的2-5倍，键合金丝直径常见的为20-25um，因此键合球的直径范围一般对应为40-100um。如下图为芯片PAD,键合球常见尺寸。
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