ECP封装中的宇阳科技铜端子MLCC应用,可实现更宽、更大端头面积,增加PCB内埋后端子接触面积
近年来,AI等新兴应用逐渐火爆,这类应用对芯片功能提升的需求非常迫切。而在“后摩尔时代”下,元器件的原材料、工艺已触摸到瓶颈,传统的封装方法无法再满足元器件摆放的需求,一些芯片、元器件逐渐向PCB板内转移,以寻求更多的设计空间。相关的封装技术在行业内统称为先进封装技术。根据Yole,先进封装市场规模处于逐年递增的趋势,预计到2027年先进封装市场的收入规模将达到650亿美元。
图1 2020-2027先进封装市场预测数据(来源:Yole)
ECP(Embedded Chip Package)是先进封装技术的其中一种,中文称为嵌入式芯片封装,是指将芯片或元器件嵌入基板内的一种封装技术。ECP封装技术有效促进了众多行业产品的小型化、轻薄化,采用这种技术的终端产品可以在不影响整机性能的情况下,缩小产品体积,还有助于元器件的散热与外围保护。本文将重点介绍ECP封装中的MLCC应用。
在ECP封装的电源管理模块中,铜端子MLCC一直在批量应用。通过采用铜端子MLCC,可以使电容内埋于PCB板内,通过激光钻孔、镀铜连线,实现垂直供电,可大大减少电路布线,降低电路损耗、提升电源转换效率。
图2 ECP封装流程
图3 铜端子MLCC简要应用示意图
与镀锡MLCC产品相比,铜端子MLCC的主要特点如下:
1)通过特殊的封端工艺,基础铜层可实现更宽、更大的端头面积,增加PCB内埋后的端子接触面积
2)电镀工序直接在封端铜层的基础上进行镀铜,增强铜端子的一致性、致密性,同时需要抗氧化处理
3)测试、检验阶段均需要严格控制暴露时间,避免铜端子产品氧化、品质变差
4)需要保存在氮气环境中以降低端子氧化风险
5)包装采用铝箔袋、抽真空、充氮气包装,并放置干燥机、潮敏卡(铜端子MLCC定义MSL=3)
6)针对铜端子的抗氧化性检验项目,确保品质
图4 铜端子MLCC包装示意图、外观图
在当前市场成熟应用的电源管理芯片中,主流尺寸一般为0201~0402,但由于需要适应PCB内埋的高度要求,0402一般为薄型规格——Tmax0.33mm,与0201高度相同。当前应用的容量范围一般在几百pF~几百nF。然而,在未来的大算力芯片市场中,更多的芯片设计者可能需求更高容量、更多元化封装的铜端子MLCC,使得芯片能得到更大的供电电流,例如10μF、22μF等,但提升容量的同时尺寸只能进一步扩大,更大的MLCC尺寸则需求匹配进更高的PCB层高,这对ECP封装的工艺则是更大的考验,宇阳积极配合与客户端一起攻克此技术难题。
铜端子系列产品是宇阳科技量产产品,并且是宇阳科技未来路标中持续配合市场需求的产品系列,欢迎设计者向宇阳科技提出更多应用在ECP封装的铜端子MLCC规格需求!
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本文由星晴123转载自宇阳科技公众号,原文标题为:宇阳科技铜端子MLCC产品介绍,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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型号- 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描述- Shenzhen EYANG Technology Development Co., Ltd. has been a Product Diagram committed to the R&D, production, and sales of electronic components. The company has made critical investments to build the world's advanced MLCC (multilayer ceramic capacitors) production lines in its new factories in Dongguan and Chuzhou.
型号- 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电子商城
现货市场
服务
可定制插座连接器的间距1.25mm~2.54mm;列数:单列/双列/三列/四列;端子类型:直焊针、直角焊针、表面贴装式、无焊柔性针压接、绕接、载体.;镀层、车针长度/直径、连接针长度等参数可按需定制。
最小起订量: 1 提交需求>
可根据用户端子定制线束,制程能力:Min: 0.13mm2、Max: 120mm2;具有设计方案验证、定案、样品交付及量产快速响应能力。
最小起订量: 1000pcs 提交需求>
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