Automotive-grade MCU BAT32A237 from Cmsemicon Wins the 2023 Automotive Chip Top 50 Award
The “Chip to E-Town” Automotive Chip Competition, guided by the Beijing Municipal Science and Technology Commission and the Beijing Municipal Economic and Information Bureau, organized by the Beijing E-Town Administrative Committee, and collaborated by Gasgoo, concluded successfully on November 28, 2023. The Automotive-grade MCU BAT32A237 from China Micro Semicon (Shenzhen) Co., Ltd. (hereinafter referred to as Cmsemicon) was recognized for its outstanding performance and awarded the 2023 Automotive Chip Top 50 in this automotive chip competition.
The “Chip to E-Town” 2023 Automotive Chip Competition aims to accelerate the application and promotion of mature automotive chip products, promote cross-border integration of the automotive and chip industries, and foster the collaborative development of the industrial chain. The competition has set up four categories of awards for the selection of outstanding enterprises and advanced technology solutions. Among them, the 2023 Automotive Chip Top 50 Award is aimed at recognizing automotive chip enterprises that have achieved large-scale production and application, demonstrated product innovation leading to industry transformation and upgrading, and exhibited excellent market performance and a wide user base.
With its 22-year technological expertise and resources in the MCU field, Cmsemicon has been continually building a leading global MCU product portfolio and promoting the localization of core MCU products for domestic automobiles. The BAT32A2 series, specifically designed for automotive applications, meets the AEC-Q100 Grade 1 standard. This series consists of four products: BAT32A233, BAT32A237, BAT32A239, and BAT32A279, with dozens of part numbers, effectively expanding the application scenarios.
The BAT32A237 series, recognized as one of the 2023 Automotive Chip Top 50, stands out for its outstanding performance in reliability, consistency, safety, stability, and long-term effectiveness. It is based on the Arm Cortex®-M0+ core, operates at a frequency of 48 MHz, and is equipped with 128KB Flash, 12KB SRAM, and 1.5KB dedicated Data Flash. It features multiple communication interfaces such as CAN/LIN and analog peripherals. With a working temperature range of -40℃ to 125℃, it is suitable for complex automotive operating conditions and harsh environments. The BAT32A237 series has already entered the supply chains of numerous renowned domestic automobile manufacturers and is widely used in various projects related to the vehicle body domain and advanced driver-assistance systems, such as headlights, combination switches, grille controllers, AQS sensors, water pumps, and valves.
Cmsemicon has established a comprehensive MCU product matrix and a high-standard quality management system for automotive-grade products. The BAT32A233 series, with its high performance and support for hardware LIN2.2 interface, is particularly suitable for compact and flexible applications in automotive parts such as doors, windows, lights, sensors, control panels, and combination switches. The BAT32A239 and BAT32A279 series, with up to 512KB Flash, up to 64KB SRAM, and up to 3-channel CAN 2.0B interface, provide rich analog peripherals. The product range, available in 24-100 pins, significantly expands the application scenarios for future intelligent automobiles.
This award signifies the widespread recognition of Cmsemicon’s automotive-grade chips in the market. In the future, Cmsemicon will further expand the construction of automotive chip design resources in response to market demands. It will focus on developing high-performance and high-safety chips, establish a platform for integrated solutions to serve more Tier 1 suppliers and OEMs, and continue to innovate and develop high-safety 32-bit automotive-grade MCUs and SoCs, thereby promoting the high-quality development of the domestic automotive electronics industry.
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本文由玄子转载自Cmsemicon News，原文标题为:【Honor】BAT32A237 Wins the 2023 Automotive Chip Top 50 Award，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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中微半导体微控制器（MCU）选型表
中微半导体提供以下8位MCU/32位MCU参数选型，主频8MHz-128MHz，电压1.8V-5.5V。
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产品型号
|
品类
|
封装形式
|
主频(MHz)
|
内核
|
工作温度 （℃）
|
电压 （V）
|
Memory Type
|
ROM
|
RAM
|
GPIO
|
DMA
|
Timer
|
WDT/WWDT
|
UART
|
I²C
|
SPI
|
PWME/PWM
|
SAR-ADC-unit
|
SAR-ADC-bit
|
SAR-ADC-ch
|
COMP
|
|
BAT32A233KC24NA
|
32位通用MCU
|
QFN24
|
64MHz
|
M0+
|
-40℃ ~125℃
|
2.0V~5.5V
|
FLASH
|
32KB
|
4KB
|
21
|
40
|
9
|
1
|
2
|
2+1
|
2+1
|
7
|
1
|
12
|
8
|
2
|
选型表 - 中微半导体 立即选型
【经验】使用中微的BAT32A237车规级MCU写DataFlash后程序空间数据被修改的解决办法
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中微半导体车规MCU选型表
车规mcu，主频：48MHz-64MHz，内核M0+
|
产品型号
|
品类
|
主频(MHz)
|
电压 （V）
|
Memory Type
|
ROM（KB）
|
RAM（KB）
|
Data Flash（KB）
|
GPIO
|
DMA
|
Timer
|
WDT/WWDT
|
RTC
|
UART
|
I²C
|
SPI
|
CAN
|
LIN
|
PWM/EPWM
|
SAR-ADC-unit
|
SAR-ADC-bit
|
SAR-ADC-ch
|
SAR-ADC-speed(Msps)
|
DAC-unit
|
DAC-bit
|
COMP
|
PGA
|
Co_proc-MUL
|
Co_proc-DIV
|
|
BAT32A237KE24NA
|
车规MCU
|
48
|
2.0V~5.5V
|
FLASH
|
64KB
|
12KB
|
1.5KB
|
21
|
35
|
9
|
1
|
1
|
3
|
3+1
|
3
|
1
|
1
|
4
|
1
|
12
|
8
|
1.06M
|
1
|
8
|
2
|
1
|
Co_proc-MUL
|
Co_proc-DIV
|
选型表 - 中微半导体 立即选型
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