How to Choose the Right Small Bluetooth Chip Solutions of SILICON LABS for Medical Devices and Wearables?

2024-01-31 SILICON LABS Blogs
Bluetooth Chips,Bluetooth Low Energy chips,Bluetooth LE chips,Bluetooth LE SoC Bluetooth Chips,Bluetooth Low Energy chips,Bluetooth LE chips,Bluetooth LE SoC Bluetooth Chips,Bluetooth Low Energy chips,Bluetooth LE chips,Bluetooth LE SoC Bluetooth Chips,Bluetooth Low Energy chips,Bluetooth LE chips,Bluetooth LE SoC

SILICON LABS has been delivering small, application-optimized Bluetooth solutions for the manufacturers of medical devices and wearables for decades. Not only do SILICON LABS solutions deliver ultra-low-power and high-performance Bluetooth LE in a small footprint, they also feature medical-graded security, integrated AI/ML, Analog, DC-DC converter, RF-certified antenna, and many, many other functionalities. This blog showcases eight of SILICON LABS' smallest Bluetooth Chips optimized for medical devices and wearables. The quick comparison table helps you to choose the smallest optimal Bluetooth chip for your application!


This table shows Silicon Labs’ smallest Bluetooth Low Energy chips ( Bluetooth LE chips), comparing their medical- and wearables-optimized features and functionalities.

Overview of the Smallest Bluetooth Chips

Here’s an overview of Silicon Labs’ smallest Bluetooth chips optimized for medical devices and wearables.


BG22

The BG22 Bluetooth LE SoC family with a size of 4x4 mm is an excellent fit for feature-optimized portable medical devices and wearables. The BG22 offers 512k of Flash, leaving room for a small application that takes advantage of the many features of the BG22. The Bill of Material (BoM) can be reduced with a minimum antenna/matching network setup, the integrated crystal, and 16-bit ADC. The extremely low power operation of BG22 allows for the use of the smaller battery.


The BG22 TQFN (Thin QFN) package with a mere 0.3 mm thickness enables product designs with a slimmer PCB board architecture.


The BGM220S System-in-Package (SiP) module is based on the BG22 SoC and it integrates more than 20 critical components, such as decoupling capacitors, DCDC components, crystal, RF matching, and harmonic filtering in a tiny footprint of 6x6 mm, enabling device makers to reduce their PCB size radically. Additionally, the BGM220S module comes with an integrated antenna and worldwide RF certifications, accelerating development time significantly.


BG22 is DTSec compliant, meeting the defined protection profile for BGMs, CGMs, and insulin delivery systems.


With Silicon Labs Bluetooth SDK and tools, you get the software, sample applications, reference design, and everything needed to get started when building a customized medical application!


BG27

The Silicon Labs BG27 Bluetooth Low Energy SoC family is a successor of BG22, offering increased RAM and Flash memory, exceptional wireless performance with ultra-low-power (just like BG22), and many integrated functionalities you need when developing medical and wearable devices, including:

  • DTSec compliance for Diabetes Management Devices

  • The highest level of Security Evaluation Standard for IoT Platforms (SESIP) certification ensuring resistance to hardware and software attacks, including the IEEE 2621 standard for medical devices in diabetes management

  • DCDC Boost enables 1.5v operation off single-cell alkaline, silver oxide, and button cell batteries typically used on medical applications such as patches, wearable electrocardiograms (ECG), and continuous glucose monitors (CGM)

  • WLCSP package with dimensions of 2.3x2.6 mm for extremely small device form factors

  • Coulomb Counter for accurate battery level tracking to enhance user safety and experience

  • Wake-up Pin allows products to spend months in warehouses and transport, consuming less than 20 nA, until awoken, ensuring the battery remains fully charged when the device is needed the most.


BG24

The Silicon Labs BG24 Bluetooth LE SoC family is a highly advanced Bluetooth LE solution offering large RAM and Flash memories and exceptional wireless performance with ultra-low power. Its many integrated functionalities include an AI/ML accelerator for faster and more energy-efficient Machine Learning (ML) inferencing and a Digital-to-Analog Converter (DAC) that can be coupled with external Operational Amplifiers to form a complete Analog Front End (AFE) with reduced cost, space, and complexity of integration. BG24 is available as an ultra-compact WLCSP package (3.0x3.1 mm) to enable extremely small device form factors.


The BGM240S System-in-Package module (SiP module) is based on the BG24 SoC and it integrates more than 20 critical components, such as decoupling capacitors, DCDC components, crystal, RF matching, and harmonic filtering in a compact footprint of 7x7 mm, enabling you to reduce the device’s PCB size. The integrated antenna and worldwide RF certifications accelerate your product development time significantly.


Learn More About Small Bluetooth Devices

Choosing the smallest optimal chip is only one of the many ways to reduce your Bluetooth product design. Download SILICON LABS whitepaper about Small Bluetooth Devices to learn how SiP modules and smarter antenna design can do wonders for minimizing your PCB footprint and BoM without compromising wireless performance!

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
  • +1 赞 0
  • 收藏
  • 评论 0

本文由玄子转载自SILICON LABS Blogs,原文标题为:Small Bluetooth Chips – How to Choose the Right Solution for Medical Devices and Wearables?,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

评论

   |   

提交评论

全部评论(0

暂无评论

相关推荐

【IC】芯科推出Wi-Fi 6 SoC SiWx917,采用7x7mmQFN封装,是超低功耗物联网无线设备的理想选择

SiWx917 SoC是功耗最低的Wi-Fi 6 SoC,是使用Wi-Fi、Bluetooth®、Matter和IP网络实现安全云连接的超低功耗物联网无线设备的理想选择。SiWx917 SoC包括一个超低功耗Wi-Fi 6加低功耗蓝牙(LE)5.4无线CPU子系统,以及一个集成微控制器(MCU)应用子系统、安全、外围设备和电源管理子系统。

产品    发布时间 : 2024-02-20

【IC】芯科科技BG27蓝牙SoC赢得IoT Evolution World评选2024年资产跟踪产品奖

SILICON LABS的BG27蓝牙SoC近期荣获IoT Evolution World网站举办的2024年资产跟踪产品奖。该奖项旨在表彰利用物联网技术实现资产跟踪功能自动化的卓越创新,以提高效率、减少盗窃或优化资产利用率。

产品    发布时间 : 2024-06-19

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Silicon Labs today announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader‘s highest performance device family to date. The new family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU.

产品    发布时间 : 2024-04-13

选对了针对医疗和可穿戴设备的小型蓝牙芯片,设计毫不费力!

芯科科技一直为医疗设备和可穿戴设备制造商提供小型、专为应用而优化的蓝牙解决方案。以下展示了芯科科技提供的八款小型蓝牙芯片以及快速比较表,可以帮助您为应用程序选择最佳蓝牙解决方案!

应用方案    发布时间 : 2024-02-04

【选型】Silicon Labs BG22、xG24、BG27无线SoC比较及信驰达无线模块选型指南

作为安全、智能无线技术领域的前沿品牌,Silicon Labs在最近几年陆续推出了EFR32BG22、EFR32xG24、EFR32BG27等系列无线SoC。RF-star作为物联网行业领先的无线通信模组厂商,基于Silicon Labs的无线SoC推出了RF-BM-BG22x系列串口转蓝牙透传模块、RF-BM-BG24x旗舰系列低功耗蓝牙模块和RF-BM-MG24x旗舰系列并发多协议无线模块。

器件选型    发布时间 : 2023-09-07

Silicon Labs联手Unikie拓展边缘物联网应用,强化蓝牙定位解决方案性能

Silicon Labs(芯科科技)与物联网设计伙伴Unikie近期针对边缘智能(Edge AI)和物联网结合的应用强化合作。Unikie拥有近600名嵌入式系统工程专家,可帮助汽车、医疗保健、工业和智能建筑领域的设备OEM充分利用芯科科技的物联网无线连接、低功耗蓝牙(Bluetooth LE)和应用于边缘智能的人工智能和机器学习(AI/ML)解决方案。

厂牌及品类    发布时间 : 2024-09-04

芯科科技提供多款无线连接和控制芯片产品及解决方案,BG2x系列蓝牙SoC成就多样医疗物联网用例,

Silicon Labs(亦称“芯科科技”)的无线SoC和MCU助力全球客户的医疗物联网应用创新,持续打造更智能、高效、安全和便捷的健康监测设备。智能和网联技术近年来一直是医疗和健康保障领域内的热门技术,许多厂商都在利用医疗物联网(IoMT)技术开发更加智能和互联的健康监测设备,以利用物联网、云计算、人工智能和可穿戴等新一代信息通信技术,来帮助用户时刻监控自己的健康状况、降低医疗费用和就医麻烦。

厂牌及品类    发布时间 : 2023-06-29

洞悉标准化蓝牙ESL应用潜力,芯科科技全系列低功耗、高性能蓝牙SoC和模块现已支持最新蓝牙5.4版本

随着蓝牙标准的推陈出新,Silicon Labs(亦称“芯科科技”)也持续升级蓝牙解决方案,全系列低功耗、高性能蓝牙SoC和模块现已支持最新蓝牙5.4版本,以满足开发人员的需求。

厂牌及品类    发布时间 : 2023-08-10

UG564: SiWx91x Wi-Fi 6 and Bluetooth LE SoC 8 MB Flash + 8 MB ext PSRAM Radio Board User's Guide

型号- SIWX91X-PK6032A,SIWG917,BRD4002A,SIWX91X,BRD4342A,SIWG917M111MGTBA,SIWX91X-RB4342A

用户指南  -  SILICON LABS  - Rev. 1.10  - July 2024 PDF 英文 下载

芯科科技全新xG26系列记忆体容量和GPIO翻倍,扩展Matter开发支持

SILICON LABS宣布推出新的xG26系列无线片上系统(SoC)和微控制器(MCU),这是迄今为止物联网行业领先企业性能最高的系列产品。该新系列产品包括多协议MG26 SoC、低功耗蓝牙(Bluetooth LE)BG26 SoC和PG26 MCU。这三款产品的闪存和RAM容量都是芯科科技其他多协议产品的两倍,旨在满足未来物联网(IoT)的需求,以应对一些要求严苛的新兴应用,如Matter。

厂牌及品类    发布时间 : 2024-04-11

芯科科技EFR32BG27蓝牙SoC助力持续性血糖监测CGM设备长达21天续航时间

在当今医疗领域,持续性血糖监测(CGM)成为人们关注的焦点,特别是对于糖尿病患者而言,实时了解血糖水平变化对于治疗和生活质量的提升具有举足轻重的意义。Silicon Labs提供的极小型、超低功耗EFR32BG27(BG27)蓝牙SoC在CGM中的应用显得尤为突出。本文将详细介绍BG27蓝牙SoC在CGM中的应用及其突出特点。

应用方案    发布时间 : 2024-07-12

与智能同行 - 借力微型、内置ML加速器的芯科科技无线SoC实现医疗电子多样功能!

针对医疗电子控制器当前的应用现状和未来的发展方向,Silicon Labs无线产品营销高级经理Brian Blum先生近期参与大比特(Big-Bit)半导体器件应用网的访谈,针对产业链上下游的半导体器件应用和医疗设备发展趋势展开对话,以洞悉行业未来方向。本文介绍本次访谈的问答摘要内容。

应用方案    发布时间 : 2024-08-10

【应用】芯科BG27蓝牙SoC助力开发可安装于牙齿的极小型唾液健康监测器,小至2.3x2.6毫米的封装尺寸

Silicon Labs全新发布了专为极小型物联网设备设计的BG27蓝牙SoC系列,通过该款新品小至2.3x2.6毫米的封装尺寸以及集成的低功耗蓝牙连接和安全性,助力Lura Health公司设计出世界上首款持续的唾液健康监测仪。

应用方案    发布时间 : 2023-07-30

芯科科技支援新的蓝牙®网状网络功能增强和网络照明控制标准化配置文件

中国,北京 - 2023年9月21日 – 致力于以安全、智能无线连接技术,建立更互联世界的全球领导厂商Silicon Labs(亦称“芯科科技”,NASDAQ:SLAB),今日宣布其支持蓝牙技术联盟(Bluetooth SIG)针对蓝牙网状网络(Bluetooth Mesh)实现的新功能增强,以及他们新的网络照明控制(NLC)标准,该标准旨在为使用蓝牙网状网络的商业和工业照明提供一种统一标准。

厂牌及品类    发布时间 : 2024-07-25

长达10年电池寿命的蓝牙SoC EFR32BG22

型号- SLWRB4183A,FG12,FG13,FG14,EFM32,ESP32-S2,BG22C224,BG22C222,DA16200,FG1,CYW43012,SX126X,EFR32FG23,EFR32FG1,BG22,BG21,EFR32BG22,BGM220S,EFR32,RS9116X-SB-EVK1,BGM220P,RS9110,CC3220,FG22,RS9113,BGM220,EFR32XG1X,SLWRB4182A,RS9116,RS9116X-DB-EVK1,EFR32FG,BG22C112,MT 5932,QCA4020,SLWSTK6021A,ESP32,SLTB010A,SX127X,EFR32FG13,EFR32FG12,EFR32FG14

商品及供应商介绍  -  SILICON LABS PDF 中文 下载

展开更多

电子商城

查看更多

只看有货

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥8.1764

现货: 111,380

品牌:SILICON LABS

品类:Wireless SoC

价格:¥25.9222

现货: 24,433

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥11.7068

现货: 12,703

品牌:SILICON LABS

品类:Bluetooth Module

价格:¥32.6118

现货: 2,494

品牌:SILICON LABS

品类:Bluetooth Module

价格:

现货: 0

品牌:SILICON LABS

品类:Mighty Gecko Multi-Protocol Wireless SoC

价格:¥27.0929

现货: 98,034

品牌:SILICON LABS

品类:Wireless SoC

价格:¥21.5556

现货: 94,361

品牌:SILICON LABS

品类:8位MCU

价格:¥5.8534

现货: 89,412

品牌:SILICON LABS

品类:Wireless SoC

价格:¥9.1982

现货: 88,300

品牌:SILICON LABS

品类:Wireless SoC

价格:¥27.2234

现货: 86,020

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

现货市场

查看更多

品牌:SILICON LABS

品类:Switch Hall Effect Magnetic Position Sensor

价格:¥2.2924

现货:150,000

品牌:SILICON LABS

品类:Light Sensor

价格:¥20.3400

现货:28,003

品牌:SILICON LABS

品类:Position Sensor

价格:¥3.0897

现货:12,568

品牌:SILICON LABS

品类:8位MCU

价格:¥4.9000

现货:12,000

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥10.1700

现货:10,000

品牌:SILICON LABS

品类:Gecko MCU

价格:¥15.6000

现货:5,353

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥3.7900

现货:3,451

品牌:SILICON LABS

品类:Wireless SoC

价格:¥15.1400

现货:1,455

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥11.1200

现货:1,201

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥16.8500

现货:550

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

服务

查看更多

蓝牙射频及通信协议测试

根据用户的蓝牙模块,使用Bluetooth 蓝牙测试装置MT8852B,测试蓝牙1.0至5.1,包括传输速率、功率、频率、调制和接收机灵敏度,生成测试报告。支持到场/视频直播测试,资深专家全程指导。

实验室地址: 深圳 提交需求>

蓝牙认证BQB测试

支持Bluetooth SIG最新的测试规范,支持2.0(EDR), 2.1(EDR), 3.0(HS), 4.0(LE)规范, 并且能完整覆盖BR/EDR/HS/BLE的所有射频测试项目。测试标准:RF.TS/4.03 ;RF-PHYTS/40.3。

实验室地址: 深圳 提交需求>

世强和原厂的技术专家将在一个工作日内解答,帮助您快速完成研发及采购。
我要提问

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

研发客服
商务客服
服务热线

联系我们

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

投诉与建议

E-mail:claim@sekorm.com

商务合作

E-mail:contact@sekorm.com

收藏
收藏当前页面