Miller Effect on MOS Tube Switches

2024-02-09 HI-SEMICON News
MOS tube,MOS tube switches,MOS,HI-SEMICON MOS tube,MOS tube switches,MOS,HI-SEMICON MOS tube,MOS tube switches,MOS,HI-SEMICON MOS tube,MOS tube switches,MOS,HI-SEMICON

The basic principle of formation of Miller platform

The gate drive process of MOSFET can be simply understood as the charging and discharging process of the input capacitance (mainly CGS of the gate source capacitance) of the MOSFET. When THE CGS reaches the threshold voltage, MOSFET will enter the opening state. When MOSFET is opened, VDS starts to decline and ID starts to rise. At this time, MOSFET enters the saturated region. However, due to Miller effect, VGS will not rise for a period of time. At this time, ID has reached the maximum, while VDS continues to decline until Miller capacitor is fully charged and VGS rises to the value of the driving voltage. At this time, MOSFET enters the resistance area, VDS completely drops and the opening ends.


Because miller capacitors prevent VGS from rising, they prevent Vds from falling, thus increasing the time to wear out. (When VGS goes up, the conduction resistance goes down, thus VDS goes down)

Fig.1

Miller effect is notorious in MOS drive. It is caused by the miller capacitance of the MOS tube. During the opening process of the MOS tube, the GS voltage rises to a certain voltage value and then becomes stable for some time, after which the GS voltage starts to rise again until complete conduction. Why is there a stable value here? Before the MOS is switched on, the D-pole voltage is greater than the G-pole voltage, and the electric quantity stored by the MOS parasitic capacitor CGD needs to be neutralized by the G pole injected during its conduction because the G-pole voltage is greater than the D-pole voltage after the MOS is fully switched on. The Miller effect will greatly increase the opening loss of MOS. (The MOS tube cannot be switched on very quickly)

So there comes the so-called totem drive!! When MOS is selected, the smaller the CGD is, the smaller the switching loss will be. The Miller effect is unlikely to disappear entirely.


Miller platform in MOSFET is a typical symbol of MOSFET being in the "big zone".

Using an oscilloscope to measure the GS voltage, you can see that there is a platform or pit during the voltage rise, this is the Miller platform.

The detailed process of formation of the Miller platform
The Miller effect refers to the miller platform produced in the opening process of the MOS tube switches. The principle is as follows.


In theory, the Miller effect can be eliminated by adding enough capacitance between the G and S stages of the drive circuit. But the switching time will drag on for a long time. The general recommendation plus a capacitance value of 0.1CIESS is beneficial.


The gentle part in the thick black line below is the Miller platform.

Fig.2 

This diagram shows the delay-charge coefficient at the first turning point: VDS starts conduction. The variation of VDS forms a differential through CGD and the internal resistance of the driver source. Since VDS is approximately linearly decreasing, linear differentiation is a constant, resulting in a platform at VGS.


Miller platform is caused by the capacitance at both ends of MOS GD, namely CRSS in the MOS datasheet.


This process is to charge THE CGD, so the VGS changes very little. When the CGD is charged to the VGS level, the VGS will continue to rise.


When MOS was just opened, CGD discharged rapidly through MOS, and then the drive voltage was reversed charged, which Shared the drive current, making the voltage rise on CGS slow and the platform appeared.

Fig.3

T0 ~ T1: VGS from 0 to VTH Mosfet not through Current by parasitic diode DF
T1 ~ T2: VGS from VTH to Va ID
T2 ~ T3: VDS decreases, The higher the current continues to pass through CGD VDD, the longer the time required.

IG is the driving current


It starts to get healthier faster When VDG approaches zero, CGD increases Until VDG becomes negative, CGD increases to the maximum IG decreases slowly


T3 ~ T4: complete conduction of Mosfet, operating in resistance zone VGS continues to rise to VGG

Fig.4

In the later stage of the platform, VGS continued to grow, and IDS changed little because MOS was saturated. However, from the picture of the building owner, this platform still had a length


During this platform, it can be considered that MOS is in the amplification period


Before the previous inflection point: MOS cutoff period, at which time CGS is charging and VGS is pressing into VTH
The previous inflection point: MOS officially entered the amplification period


At the latter inflection point, MOS officially exits the amplification period and begins to enter the saturation period


When a voltage V with a slope of it is applied to capacitance C (such as the output voltage of the driver), the current in the capacitor will be increased:
I = C x dV/dt (1)
Therefore, when voltage is applied to MOSFET, input current IGATE = I1 + I2 will be generated, as shown in the figure below:

Fig.5


Using Equation (1) on the right voltage node, the following equation can be obtained:


I1 = CGD x d (VGS - VDS)/dt = CGD x (dVgs/dt - dVds/dt) (2)
I2 = CGS x d (VGS/dt) (3)

If the grid-source voltage VGS is applied to the MOSFET, the leak-source voltage VDS will drop (even in a non-linear fashion). Therefore, the negative gain of connecting the two voltages can be defined as:

Av= -VDS /VGS (4).

Substituting Equation (4) into Equation (2), we can get:

I1=CGD× (1+Av) dVgs/dt (5)

In the conversion (conduction or turn-off) process, the total equivalent capacitance Ceq of the grid-source electrode is:

IGATE = I1 + I2 = (CGD x (1 + Av) + CGS) * dVgs yet dVgs/dt = Ceq/dt (6)


The term (1+Av) is called the Miller effect, which describes the capacitive feedback between output and input in an electronic device. The Miller effect occurs when the grid-drain voltage is close to zero.


CDS diverts the most severe stage in a large area. Why? Because VD changes the most dramatically at this stage. It is precisely at this stage that the platform is formed. You can assume that the gate current IGATE is completely absorbed by the CDS and no current flows to the CGS.

Fig.6

Note the representation in the datasheet:

CISS=CGS+CGD

COSS=CDS+CGD

CRSS=CGD

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高热流密度液冷板定制

定制液冷板尺寸5mm*5mm~3m*1.8m,厚度2mm-100mm,单相液冷板散热能力最高300W/cm²。

最小起订量: 1片 提交需求>

MCU烧录/Flash烧录/CPLD烧录

可烧录IC封装SOP/MSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN;IC包装Tray/Tube/Tape;IC厂商不限,交期1-3天。支持IC测试(FT/SLT),管装、托盘装、卷带装包装转换,IC打印标记加工。

最小起订量: 1pcs 提交需求>

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授权代理品牌:接插件及结构件

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授权代理品牌:部件、组件及配件

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授权代理品牌:电源及模块

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授权代理品牌:电子材料

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授权代理品牌:仪器仪表及测试配组件

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授权代理品牌:电工工具及材料

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授权代理品牌:机械电子元件

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授权代理品牌:加工与定制

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