德聚半导体固晶胶解决方案提供稳定可靠的封装连接，为半导体封装工艺提供更多优化选择

禧合（Stick1）胶粘剂选型指南

目录- 公司简介    底部填充    光模块&器件胶    SMT贴片胶    Die attch非导电芯片粘接    COB包封    导电胶    环氧粘接    光固化&双固化UV胶    光学UV胶    快干胶    有机硅胶    PUR反应型热熔胶    导热胶    功能助剂    结构粘接胶    器件灌封保护胶   

型号- 8132,5660,G5002N,5661,8138,5662,8139,9180,8130,TP2615H,2115H-5,8131,288-2,2305,6509,8527,8525,6503,5658,6506,5659,5663/T,5310,5311,1203S,5312,8302,1107,5708,1105,1103,2311,1101,5611LB,2310,5302,7206,5668,5701,5702,5307,6519,5680,5320,5321,LM525,5201,LM523,2201,2200,5315,TP2612VL,8201,5210,5331,ST12,5211,5212,5602,7120,7123,5220,7001,8213,5224,2110,2107,7220HP,VTP2615,5612,5216,2905,2506,ST195BL,2505,2109,5909Y/YL,8100,6200,8103,6203,ST-2286,6202,2121,1305,2878,5906,5401/F,2116,5908,1301,2510,2112,ST40,5901,1308,5505,5902,9166,9161,1309L,5915,2800,2887,5650N,1310,2123,2807,5911,6340,9212,8121,9210,8122,5012,8523,5652,5805,1205,1201,5403,5920,1207

Rogers（罗杰斯）高频层压板材料和粘结材料选型指南（英文）

描述- Rogers Corporation is the world’s leading manufacturer of high performance dielectrics, laminates and prepregs used in microwave and RF printed circuit and related applications in Aerospace & Defense, Wireless & Wireline (digital) Infrastructure, Automotive Radar Sensor, Satellite TV, Mobile Internet Device and High End Chip Scale Packaging.

型号- RO4534,RO3203,RO4533,KAPPA® 438,RO4003C,RO4533™,AD300D-IM,CLTE-MW,COOLSPAN,ISOCLAD 933,RT/DUROID 6002,CUCLAD 217,AD255C,RO3035™,AD300D,COOLSPAN® TECA,RO4725JXR™,AD250TM,CUCLAD,CLTE™,6010.2LM,CLTE-AT™,RT/DUROID 6006,RO4003C LOPRO®,RO4730G3 LOPRO®,RO4534™,XTREMESPEED RO1200,CLTE SERIES,CUCLAD® 6250,RO4835T™,6002,RO3210,RO4350B LOPRO,AD350A™,AD255C™-IM,RO3006™,RO4730G3™,RO3010™,TC600™,RO3206,RO4535,RT/DUROID 6202PR,RO4535™,RO4835 LOPRO®,RO4534 LOPRO®,RO4533 LOPRO®,6250,RO4730G3 ED,TC600TM,AD255TM,RT/DUROID 6202PR 0.005",AD250C™,RO3003G2™,RO4360G2,ISOCLAD® 917,CUCLAD 233,RADIX,RT/DUROID® 5880LZ,AD350A,6006,TC600,RO4835™,RO4535 LOPRO,TMM®10,AD300D™-IM™,DICLAD,RO3035,RO4835IND™ LOPRO,KAPPA,RO4000,TMM 13I,AD SERIES,RO4730G3,CLTE SERIES™,MAGTREX® 555,TMM®13I,ISOCLAD,CLTE-XT™,RO3210™,CUCLAD 6700,TMM® 3,RO3206™,RO4350B LOPRO®,ANTEO,RT/DUROID 6202PR 0.020",XTREMESPEED™ RO1200™,TMM 10,RT/DUROID® 5870,TC350™ PLUS,TC350,RO4360G2™,RO3003,RT/DUROID 6010.2 LM,CLTE-MW™,RO3000,CLTE,DICLAD® 880,RO3003G2,588018X12H1/H1R30200+-001DI,RO4350B,AD300TM,CUCLAD 250,RT/DUROID 5870,DICLAD 527,RO4835T,AD255C™,RO3003™,6700,RO4460G2™,DICLAD 880,DICLAD® 527,RT/DUROID 5880LZ,RT/DUROID 6202,RO4835IND,TC350 PLUS,AD350TM,RO4350B™,6202,RO3010,RT/DUROID 6035HTC,RO4450F™,RO4835 LOPRO,AD300D™,RT/DUROID 5880,RT/DUROID 6202PR 0.010",DICLAD 880-IM,AD350,KAPPA 438,DICLAD 870,6202PR,SPEEDWAVE® 300P,ANTEO™,CLTE-XT,RO3006,RO4830™,RO4830,TMM 10I,5880,AD300,AD255-IM,RT/DUROID,TMM 6,TMM 4,TMM®10I,DICLADR 880-IM,RT/DUROID 6010.2LM,TC350 TM,CU4000 LOPRO,RO3203™,ISOCLAD 917,RO4003C™,2929,TC350™,RO4460G2,DICLAD® 870,RO4450F,TMM,CLTE-AT,RO4450T™,TMM®4,AD250,AD250C,TC SERIES,TMM®3,6035HTC,AD255,RO4835,CUCLAD® 217,TMM®6,RO4450T

【视频】瓦克工业解决方案在ICT行业的应用（数据中心和浸没式冷却）

描述- 本文介绍了瓦克化学在ICT行业的应用，特别是数据中心和浸没式冷却技术。文章详细阐述了瓦克化学在有机硅材料领域的优势，包括其高度集成的上下游体系、丰富的产品线以及针对不同应用场景的定制化解决方案。此外，文章还重点介绍了瓦克化学在半导体封装及PCB保护领域的粘结、导热材料，以及其在浸没式冷却技术中的应用，如HELISOL®冷却液等。

型号- SEMICOSIL 26X,SEMICOSIL 268,SEM 964,SEMICOSIL 269,SEMICOSIL 984,HELISOL® 5A,HELISOL® XA,HELISOL®,SEMCOSIL 988,SEMICOSIL ®,SEM 9480,SEM 942 UV,ELL N9481-200,HELISOL® 10A,EL N2140,HELISOL® XLP,EL N2011,SEMICOSIL 267

上海禧合应用材料有限公司

型号- 6230,5664D,DP460,7123,8132,6232,7001,DP420,DP100,5216L,2110,X2406025,7220HP,5654,5216,5612,8100BL,5218,6503N,2505,7011,8102,X2210021,8100,X2407209,X23082C3,5310,71252,2315,5709,5920S,5701,ST40,E-05MR,5307,2319,2318,VTP2615D,X2403011,5320,2318F,X2306080,8152,2888,2203,5911,5913,ST196BL,2802,X2403100,5650,5663BK,5331,5401F,E20HP,X2312109,5805,X23122C1,5203,5401,X24052H6,5920