Longsys and Western Digital Expand Business Cooperation to Serve the Mobile Phone Storage Market in Greater China
As AI technology continues to advance by leaps and bounds, so does the need for advanced storage solutions. In particular, the gradual application of large AI models in the field of edge devices and mobile devices will increase the demand for reliable, high-performance storage. To meet the growing demand, Longsys announced today that it is extending its relationship with Western Digital to actively explore and jointly support new market opportunities for the next wave of AI-enabled mobile storage devices and applications.
Building on the companies' long-term business relationship, Longsys and Western Digital will deepen their business cooperation to provide market-leading, customized embedded storage solutions for the mobile phone market in Greater China, including the Chinese mainland, Hong Kong, Macao, and Taiwan.
Longsys will use Western Digital's innovative flash memory in its storage products for the mobile phone market, and Western Digital will provide technical and engineering support to help Longsys deliver advanced mobile solutions to Greater China. Through close cooperation, Longsys will be able to more effectively leverage the advantages of Western Digital's flash memory technology, thereby enhancing its product competitiveness in the mobile storage market, and ensuring that both parties remain at the forefront of innovation in embedded storage solutions.
Cai Huabo, chairman and general manager of Longsys said, "The application of AI in the field of mobile phones is showing broad prospects and great potential. To make further breakthroughs in the mobile phone market, the company and Western Digital have jointly strengthened the resource cooperation of embedded storage, and combined with Longsys' self-developed main control technology, firmware algorithms, and its own advanced packaging and testing capabilities, we will be able to significantly improve the performance of mobile phone storage, thereby promoting the rapid popularization of generative AI functions in smartphones."
Rob Soderbery, executive vice president and general manager of Western Digital's Flash Business Unit said, "We value our business relationship with Longsys and are pleased to announce the extension of our longstanding partnership. This collaboration leverages our cutting-edge NAND technology, enabling Longsys to design and deliver products specifically tailored for the Greater China mobile market. This strategic move not only strengthens our existing relationship but also amplifies the leadership capabilities, flexibility and go-to-market strategies we have in the NAND Flash industry. By combining our strengths, this is a strategic step forward to meet the emerging demand for advanced memory mobile solutions driven by AI."
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本文由Vicky转载自FORESEE News，原文标题为:Longsys and Western Digital expand business cooperation to serve the mobile phone storage market in Greater China，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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FI4S26M016GSC3
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DDR4 DIMM
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16GB
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2666MT/s
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1.2V
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0℃ to 85℃
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64bits
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260pin
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SODIMM
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69.6 x 30mm
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型号- F35SQA001G-WWT,F35SQA001G-WAT,F35SQA001G,F35SQA001G-WWR
Mnemonic Electronic Debuts at COMPUTEX 2024, Embracing the Era of High-Capacity SSDs
On June 4th, COMPUTEX 2024 was successfully held at the Taipei Nangang Exhibition Center. Mnemonic Electronic Co., Ltd., the Taiwanese subsidiary of Longsys, showcased industry-leading high-capacity SSDs under the theme “Embracing the Era of High-Capacity SSDs.” The products on display included the Mnemonic MS90 8TB SATA SSD, FORESEE ORCA 4836 series enterprise NVMe SSDs, FORESEE XP2300 PCIe Gen4 SSDs, and rich product lines comprising embedded storage, memory modules, memory cards, and more.
原厂动态 发布时间 : 2024-06-25
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支持1拖1/1拖8/eMMC离线烧录，可烧录IC类型：UFS/UMCP/MCU/MPU/EPROM/EEPROM/FLASH/Nand Flash/PLD/CPLD/SD Card/TF Card/ CF Card/eMMC Card/eMMC/eMCP/MoviNand/OneNand等；IC包装Tray/Tube/Tape；提供免费10pcs样品试样。
最小起订量： 1 提交需求>
可烧录MCU/MPU，EPROM,EEPROM,FLASH,Nand Flash, PLD/CPLD,SD Card,TF Card, CF Card,eMMC Card,eMMC,MoviNand, OneNand等各类型IC,IC封装：DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN.
最小起订量： 1 提交需求>
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