芯片产业专业术语和缩写
制造:
TAPEOUT(TO)流片:指提交最终GDSII文件给Foundry工厂做加工。
FULL MASK 全掩膜: 即制造流程中的全部掩膜都为某个设计服务。
MPW (Multi Project Wafer)多项目晶圆: 即多个项目共享某个晶圆,也即同一次制造流程可以承担多个IC设计的制造任务。
MPW就是和别的厂家共享一张掩模版,而FULL MASK则是独享一张掩膜版。如果芯片风险比较高,则可以先做MPW,测试没有问题,再做FULL MASK。
Foundry晶圆厂: 专门从事芯片制造的厂家,例如台积电(TSMC),中芯国际(SMIC),联电(UMC)。对应的就是fabless,就是设计厂家,就是没有晶圆厂。
Wafer:晶圆。
Die:晶圆切割后,单个芯片的晶圆,这个需要加上封装好的外壳才能能变成芯片。
Chip:最后封装后的芯片。
Bump:bumping指凸点。在wafer表面长出凸点(金,锡铅,无铅等等)后,(多用于倒装工艺封装上,也就是flipchip)。
Mask掩模:在硅片上选定的区域中对一个不透明的图形模板遮盖,继而下面的腐蚀或扩散将只影响选定的区域以外的区域
Chamber真空室,反应室:专指一密闭的空间,而有特殊的用途、诸如抽真空,气体反应或金属溅镀等。
Dicing Wafer:晶圆划片,晶圆切割
CVD(Chemical Vapor Deposition)化学气相沉积:是一种被广泛应用于材料制备领域的先进技术,利用高温和低压环境将气体或气体混合物中的化学物质转化为固体材料。
PVD(Physical Vapor Deposition)物理气象沉积:通过离子等离子技术在基材表面附着另一种材料的方法。是喷射、蒸发等的总称。
CMP(Chemical-Mechincal Polish)化学机械抛光:利用在表面布满研磨颗粒的研磨垫(polishingpad),对凸凹不平的晶体表面,藉由化学助剂(reagent)的辅助,以化学反应和机械式研磨等双重的加工动作,来进行其表面平坦化的处理。
CDA(Clean Dry Air)压缩干燥空气:通常指压力在60到110psi之间的空气,经过净化和干燥处理。作为气动元件的气体源。
Diffusion扩散:在半导体工业上常在很纯的硅芯片上以预置或离子植入的方式做扩散源,以进炉管加高温的方式,使扩散在数小时内完成
DI Water去离子水:自来水或地下水中,含有大量的细菌,金属离子及Particle,必须用设备将之杀菌过滤和纯化后,再把金属离子等杂质去除,所得的水即称为"去离子水"。专供IC制造使用。
Dopant掺杂:在原本的半导体材料里,主动植入或通过扩散的方法将其它的原子或离子掺入进去,达到改变其电性能的方法。
Dummy Wafer挡片:对制程起一定辅助作用的硅片,区别于产品。一般对其质量要求不是很高。
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本文由星晴123转载自SLKOR官网,原文标题为:芯片产业.专业术语和缩写.名词图文解析之制造,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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产品型号
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品类
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Polarity
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Iᴄ(A)
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Vᴄʙᴏ(V)
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Vᴄᴇᴏ(V)
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Vᴇʙᴏ(V)
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Vᴄᴇ(sat)(V)
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Package
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S8050
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三极管
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NPN
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0.5
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40
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25
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5
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0.6
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SOT-23/TO-92
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产品 发布时间 : 2024-10-31
Slkor萨科微18V稳定电压值的稳压二极管MM3Z18,广泛应用于信号限幅电路等领域
萨科微稳压二极管MM3Z18的总功耗最大值为300mW。表明该二极管在正常工作条件下可以承受较大的功率负荷,适用于需要处理较大电流的电路。该器件采用了适用于表面安装设计的小型塑料封装。表面安装技术(SMT)是现代电子制造中广泛使用的一种技术,具有组装密度高、可靠性高、抗振能力强等优点。小型塑料封装则意味着二极管占用空间小,便于在集成度高、空间有限的电路板上安装使用。
产品 发布时间 : 2024-06-25
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