Silicon Labs‘ Most Energy-efficient Wireless SoC New xG22E Family to Date with Energy Harvesting-ready Capabilities
SILICON LABS (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E. As Silicon Labs' most energy-efficient SoCs to date, all three SoCs will enable IoT device makers to build high-performance, Bluetooth Low Energy (LE), 802.15.4-based, or Sub-Ghz wireless devices for battery-optimized and battery-free devices that can harvest energy from external sources in their environments like indoor or outdoor ambient light, ambient radio waves, and kinetic motion.
To help device manufacturers build a complete energy harvesting solution, Silicon Labs is also announcing their partnership with e-peas, a provider of industry-leading Power Managed Integrated Circuits (PMICs) designed for energy harvesting. Through this partnership, Silicon Labs and e-peas co-developed two energy harvesting shields for Silicon Labs' new, energy-optimized xG22E Explorer Kit. To better develop within the tight constraints that energy harvesting requires, the new xG22E Explorer Kit allows developers to customize the peripherals and debugging options that best match their application and get highly accurate measurements to better build their applications and devices with the energy harvesting shields. The energy harvesting shields are each tuned and optimized for different energy sources and energy storage technologies. They are custom-fit to slot onto the Explorer Kit. Notably, one of the shields uses e-peas' latest AEM13920 dual-harvester, which allows it to pull energy simultaneously from two distinct energy sources, like indoor or outdoor light, thermal gradients, and electromagnetic waves without sacrificing on energy conversion efficiency. The second co-developed shield is based on e-peas' AEM00300 shield, and is dedicated to harvesting power from random pulsed energy sources.
"As the market for energy harvesting and low-power solutions grows, Silicon Labs remains dedicated to enhancing our wireless MCU and radio stack capabilities to advance the development of battery-free IoT solutions," said Ross Sabolcik, Senior Vice President for the Industrial and Commercial Business Unit at Silicon Labs. "Our efforts to prioritize energy efficiency and increase device longevity underscore our commitment to fostering a more sustainable IoT ecosystem."
xG22E Designed to Address Energy Efficiency Challenges for the IoT
The evolution and widespread deployment of the Internet of Things (IoT) faces a significant challenge related to powering low-complexity, small-form-factor devices. Traditional sources like mains power or batteries pose scalability and maintenance issues. The emergence of the Ambient IoT addresses this challenge by introducing a class of connected devices primarily powered through energy harvesting from ambient sources like radio waves, light, motion, and heat.
Silicon Labs aims to build a device that can address one of the significant challenges in Ambient IoT: creating a platform that can optimize its energy consumption and prolong its lifespan. The xG22E family comes equipped with several features designed to minimize energy use and make it the platform of choice for energy harvesting, including:
Ultra-fast, low-energy cold start for applications starting from a zero-energy state to transmit packets and then rapidly return to sleep. An xG22E device wakes up in only eight milliseconds and uses only 150 micro-Joules, or roughly 0.003% of the energy needed to power a 60-watt equivalent LED lightbulb for one second.
Energy conserving deep sleep swift wake-up reduces wake-up energy by 78% compared to other Silicon Labs devices.
Power-efficient energy mode transition to smoothly transition in and out of energy modes by mitigating current spikes or inrush, which can harm energy storage capacity.
Multiple deep sleep wake-up options, such as RFSense, GPIO, and RTC wake-up sources from the deepest EM4 sleep mode, are ideal for extended storage.
Energy Harvesting Applications Enable a More Sustainable IoT
Energy harvesting and conservation technologies offer significant benefits across industries, including reduced energy costs, elimination of battery dependence, and reduced operational carbon footprint by changing energy consumption sources and minimizing battery waste. It also complements many existing IoT applications. For example, electronic shelf labels are being rapidly adopted by retailers across the globe to allow for more accurate pricing, inventory management, and even loss prevention. However, with a single location having as many as thousands of labels, they require a lot of batteries. Fortunately, electronic shelf labels do not need a lot of power, nor do they require always-on connectivity, making them an excellent fit for energy harvesting. By using Ambient IoT energy sources, retailers can reduce or eliminate their need for batteries for shelf labels. Other examples in the consumer space include television remote controls that use solar energy and movable, wireless light or appliance switches.
Silicon Labs actively supports companies developing successful low-power devices and pursuing battery-free designs, fostering an environmentally sustainable leadership within their respective fields.
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本文由玄子转载自SILICON LABS News，原文标题为:Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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型号- EFR32MG21B020F768IM32-DR,EFR32BG21B020F768IM32-DR,EFR32BG21A010F512IM32-B,EFR32BG21B020F768IM32-D,EFR32BG21B020F768IM32-B,EFR32BG21A010F512IM32-D,EFR32MG21B020F1024IM32-DR,EFR32BG21A010X1652IM32-BR,EFR32MG21B010F1024IM32-BR,EFR32MG21A010F512IM32-BR,EFR32BG21B010F1024IM32-DR,EFR32MG21A010F512IM32-B,EFR32BG21B010X1653IM32-B,EFR32BG21A020F1024IM32-B,EFR32BG21A010F1024IM32-D,EFR32MG21A020F512IM32-BR,EFR32MG21B010F768IM32-DR,EFR32BG21A010F1024IM32-B,EFR32MG21A020PZ024IM32-B,EFR32BG21B020P1693IM32-B,EFR32MG21B020F768IM32-B,EFR32MG21A010F1024IM32-DR,EFR32MG21B020F768IM32-D,EFR32BG21B010F768IM32-DR,EFR32BG21A010F512IM32-BR,EFR32BG21A020F512IM32-BR,EFR32BG21A020F1024IM32-BR,EFR32BG21A020F768IM32-B,EFR32BG21B020F768IM32-BR,EFR32BG21A020F768IM32-D,EFR32BG21B020P1689IM32-BR,EFR32BG21B010F1024IM32-BR,EFR32MG21A010F512IM32-DR,EFR32BG21A010X1652IM32-B,EFR32MG21A020PZ013IM32-BR,EFR32MG21B010F512IM32-B,EFR32MG21A020F512IM32-DR,EFR32BG21A020F512IM32-B,EFR32BG21A020F512IM32-D,EFR32MG21B010F1024IM32-DR,EFR32BG21A010F768IM32-BR,EFR32BG21A020F768IM32-BR,EFR32BG21A020F1024IM32-D,EFR32MG21B010F512IM32-D,EFR32MG21A020F1024IM32-BR,EFR32MG21B020F512IM32-BR,EFR32MG21B010F512IM32-BR,EFR32BG21A010F768IM32-D,EFR32BG21B010F768IM32-BR,EFR32BG21A010F768IM32-B,EFR32MG21A010M1475IM32-B,EFR32BG21B010F1024IM32-D,EFR32BG21B020F1024IM32-B,EFR32BG21B020F1024IM32-D,EFR32BG21B010F1024IM32-B,EFR32BG21A020F1024IM32-DR,EFR32BG21B020P1693IM32-BR,EFR32BG21B010F512IM32-BR,EFR32BG21A010F1024IM32-BR,EFR32MG21B020F512IM32-D,EFR32MG21A020PZ013IM32-B,EFR32BG21B020P1697IM32-BR,EFR32MG21B020F512IM32-B,EFR32BG21B020P1712IM32-BR,EFR32BG21B020P1697IM32-B,EFR32BG21B020P1712IM32-B,EFR32BG21B020F1024IM32-BR,EFR32BG21B020F512IM32-BR,EFR32BG21B020F512IM32-D,EFR32MG21B010F768IM32-D,EFR32MG21B010F1024IM32-B,EFR32MG21B020F1024IM32-B,EFR32MG21B010PZ045IM32-BR,EFR32MG21B010F1024IM32-D,EFR32BG21B020F512IM32-B,EFR32MG21B010F768IM32-B,EFR32MG21A010M1475IM32-BR,EFR32BG21,EFR32MG21A020PZ024IM32-BR,EFR32MG21B020F1024IM32-D,EFR32BG21A020F768IM32-DR,EFR32MG21A020F1024IM32-DR,EFR32BG21A010F768IM32-DR,EFR32MG21A020F768IM32-D,EFR32MG21A020F768IM32-B,EFR32MG21B010F512IM32-DR,EFR32MG21A020F768IM32-DR,EFR32MG21B020F512IM32-DR,EFR32MG21A010F768IM32-DR,EFR32MG21B010F768IM32-BR,EFR32BG21A010F1024IM32-DR,EFR32MG21A020F512IM32-B,EFR32MG21B020F768IM32-BR,EFR32BG21B010X1653IM32-BR,EFR32BG21B010F512IM32-DR,EFR32BG21B010F512IM32-B,EFR32BG21B010F512IM32-D,EFR32XG21X010,EFR32BG21B020F1024IM32-DR,EFR32MG21A010F768IM32-D,EFR32BG21B020F512IM32-DR,EFR32BG21B020P1689IM32-B,EFR32MG21A010F768IM32-B,EFR32MG21B020F1024IM32-BR,EFR32MG21B010PZ045IM32-B,EFR32MG21A010F768IM32-BR,EFR32MG21,EFR32MG21A020F768IM32-BR,EFR32MG21A010F512IM32-D,EFR32MG21A010F1024IM32-BR,EFR32BG21A020F512IM32-DR,EFR32BG21A010F512IM32-DR,EFR32XG21X020,EFR32BG21B010F768IM32-B,EFR32MG21A020F512IM32-D,EFR32BG21B010F768IM32-D,EFR32XG21,EFR32MG21A020F1024IM32-D,EFR32MG21A010F1024IM32-B,EFR32MG21A010F1024IM32-D,EFR32MG21A020F1024IM32-B
2405011529 Additional Source for EFR32xG21 SoCs, Datasheet and Errata Updates
型号- EFR32MG21B020F768IM32-DR,EFR32BG21B020F768IM32-DR,EFR32BG21A010F512IM32-B,EFR32BG21B020F768IM32-D,EFR32BG21B020F768IM32-B,EFR32BG21A010F512IM32-D,EFR32MG21B020F1024IM32-DR,EFR32BG21A010X1652IM32-BR,EFR32MG21B010F1024IM32-BR,EFR32MG21A010F512IM32-BR,EFR32BG21B010F1024IM32-DR,EFR32MG21A010F512IM32-B,EFR32BG21B010X1653IM32-B,EFR32BG21A020F1024IM32-B,EFR32BG21A010F1024IM32-D,EFR32MG21A020F512IM32-BR,EFR32MG21B010F768IM32-DR,EFR32BG21A010F1024IM32-B,EFR32MG21A020PZ024IM32-B,EFR32BG21B020P1693IM32-B,EFR32MG21B020F768IM32-B,EFR32MG21A010F1024IM32-DR,EFR32MG21B020F768IM32-D,EFR32BG21B010F768IM32-DR,EFR32BG21A010F512IM32-BR,EFR32BG21A020F512IM32-BR,EFR32BG21A020F1024IM32-BR,EFR32BG21A020F768IM32-B,EFR32BG21B020F768IM32-BR,EFR32BG21A020F768IM32-D,EFR32BG21B020P1689IM32-BR,EFR32BG21B010F1024IM32-BR,EFR32MG21A010F512IM32-DR,EFR32BG21A010X1652IM32-B,EFR32MG21A020PZ013IM32-BR,EFR32MG21B010F512IM32-B,EFR32MG21A020F512IM32-DR,EFR32BG21A020F512IM32-B,EFR32BG21A020F512IM32-D,EFR32MG21B010F1024IM32-DR,EFR32BG21A010F768IM32-BR,EFR32BG21A020F768IM32-BR,EFR32BG21A020F1024IM32-D,EFR32MG21B010F512IM32-D,EFR32MG21A020F1024IM32-BR,EFR32MG21B020F512IM32-BR,EFR32MG21B010F512IM32-BR,EFR32BG21A010F768IM32-D,EFR32BG21B010F768IM32-BR,EFR32BG21A010F768IM32-B,EFR32MG21A010M1475IM32-B,EFR32BG21B010F1024IM32-D,EFR32BG21B020F1024IM32-B,EFR32BG21B020F1024IM32-D,EFR32BG21B010F1024IM32-B,EFR32BG21A020F1024IM32-DR,EFR32BG21B020P1693IM32-BR,EFR32BG21B010F512IM32-BR,EFR32BG21A010F1024IM32-BR,EFR32MG21B020F512IM32-D,EFR32MG21A020PZ013IM32-B,EFR32BG21B020P1697IM32-BR,EFR32MG21B020F512IM32-B,EFR32BG21B020P1712IM32-BR,EFR32BG21B020P1697IM32-B,EFR32BG21B020P1712IM32-B,EFR32BG21B020F1024IM32-BR,EFR32BG21B020F512IM32-BR,EFR32BG21B020F512IM32-D,EFR32MG21B010F768IM32-D,EFR32MG21B010F1024IM32-B,EFR32MG21B020F1024IM32-B,EFR32MG21B010PZ045IM32-BR,EFR32MG21B010F1024IM32-D,EFR32BG21B020F512IM32-B,EFR32MG21B010F768IM32-B,EFR32MG21A010M1475IM32-BR,EFR32BG21,EFR32MG21A020PZ024IM32-BR,EFR32MG21B020F1024IM32-D,EFR32BG21A020F768IM32-DR,EFR32MG21A020F1024IM32-DR,EFR32BG21A010F768IM32-DR,EFR32MG21A020F768IM32-D,EFR32MG21A020F768IM32-B,EFR32MG21B010F512IM32-DR,EFR32MG21A020F768IM32-DR,EFR32MG21B020F512IM32-DR,EFR32MG21A010F768IM32-DR,EFR32MG21B010F768IM32-BR,EFR32BG21A010F1024IM32-DR,EFR32MG21A020F512IM32-B,EFR32MG21B020F768IM32-BR,EFR32BG21B010X1653IM32-BR,EFR32BG21B010F512IM32-DR,EFR32BG21B010F512IM32-B,EFR32BG21B010F512IM32-D,EFR32BG21B020F1024IM32-DR,EFR32MG21A010F768IM32-D,EFR32BG21B020F512IM32-DR,EFR32BG21B020P1689IM32-B,EFR32MG21A010F768IM32-B,EFR32MG21B020F1024IM32-BR,EFR32MG21B010PZ045IM32-B,EFR32MG21A010F768IM32-BR,EFR32MG21,EFR32MG21A020F768IM32-BR,EFR32MG21A010F512IM32-D,EFR32MG21A010F1024IM32-BR,EFR32BG21A020F512IM32-DR,EFR32BG21A010F512IM32-DR,EFR32BG21B010F768IM32-B,EFR32MG21A020F512IM32-D,EFR32BG21B010F768IM32-D,EFR32MG21A020F1024IM32-D,EFR32MG21A010F1024IM32-B,EFR32MG21A010F1024IM32-D,EFR32MG21A020F1024IM32-B
SiWG917 SoC Single Chip Wi-Fi® and Bluetooth® LE Wireless Secure MCU Solutions
型号- SIWG917M100MGTBA,SIWG917M121XGTBA,SIWG917,SIWG917M111XGTBA,SIWG917M110LGTBA,SIWG917M111MGTBA,SIWG917M141XGTBA
EFR32FG23 Wireless SoC Family Data Sheet
型号- EFR32XG23,EFR32FG23B010F128GM40-C,EFR32FG23A010F256GM48-C,EFR32FG23B010F512IM40-C,EFR32FG23A020F512GM48-C,EFR32FG23A021F512GM40-C,EFR32FG23A010F512GM48-C,EFR32FG23A010F256GM40-C,EFR32FG23B010F512IM48-C,EFR32FG23A020F512GM40-C,EFR32FG23A010F512GM40-C,EFR32FG23B021F512IM40-C,EFR32FG23A011F512GM40-C,EFR32FG23B020F512IM40-C,EFR32FG23 FAMILY,EFR32FG23A020F256GM48-C,EFR32FG23B020F512IM48-CR,EFR32FG23,EFR32FG23B020F128GM40-C,EFR32FG23B021F512IM48-C,EFR32,EFR32FG23B020F512IM48-C,EFR32FG23A020F256GM40-C
EFR32BG24 Wireless SoC Family Data Sheet
型号- EFR32BG24B110F1536IM48-B,EFR32BG24B210F1024IM48-B,EFR32BG24A020F1024IM40-B,EFR32XG24,EFR32BG24A010F1024IM48-B,EFR32BG24A020F1024IM48-B,EFR32BG24 FAMILY,EFR32BG24B220F1024IM48-B,EFR32BG24B020F1536IM48-BR,EFR32,EFR32BG24,EFR32BG24A010F1024IM40-B
2409181571 End of Life Notification for Select EFR32MG14 Series 1 SoCs
型号- EFR32MG14P732F256IM32-B,EFR32MG14P733F256IM48-B,EFR32MG14,EFR32MG14P733F256GM48-BR,EFR32MG14P732F256IM48-B,EFR32MG14P732F256IM48-BR,EFR32MG21B020F512IM32-B,EFR32MG14P732F256GM32-B,EFR32MG14P732F256GM32-BR,EFR32MG14P632F256GM32-BR,EFR32MG21B020F512IM32-BR,EFR32MG14P632F256GM48-B,EFR32MG14P632F256GM48-BR,EFR32MG14P632F256GM32-B,EFR32MG14P733F256GM48-B,EFR32MG14P733F256IM48-BR,EFR32MG14P732F256IM32-BR
Matter、LPWAN技术构建未来无线通信新生态
Silicon Labs（亦称“芯科科技”）作为物联网无线技术领域动化等领域提供高性能、低功耗、高安全的无线连接解决方案。近日，芯科科技主任现场应用工程师黄良军（Bruce Huang）接受EEPW无线通信专题采访，就芯科科技对未来无线通信市场的展望、新产品发布以及多协议无线通信趋势等话题进行了深入探讨。
原厂动态 发布时间 : 2024-07-23
EFR32FG28 Wireless SoC Family Data Sheet
型号- EFR32FG28A120F1024GM48-A,EFR32FG28A010F1024GM48-A,EFR32FG28B310F1024IM48-A,EFR32FG28A110F1024GM48-A,EFR32FG28A110F1024GM68-A,EFR32FG28B310F1024IM68-A,EFR32FG28A322F1024IM68-AR,EFR32FG28B320F1024IM68-A,EFR32FG28A122F1024GM68-A,EFR32FG28A112F1024GM68-A,EFR32FG28B312F1024IM68-A,EFR32FG28A122F1024GM48-A,EFR32FG28B312F1024IM48-A,EFR32FG28,EFR32FG28B322F1024IM68-A,EFR32FG28B320F1024IM48-A,EFR32FG28A112F1024GM48-A,EFR32FG28B322F1024IM48-A,EFR32FG28A120F1024GM68-A,EFR32FG28A010F1024GM68-A
Ambient IoT – The Future of Sustainable IoT
To help ensure the future of IoT is ecologically responsible, Silicon Labs has now optimized the xG22 line of SoCs (BG22E SoC, MG22E SoC, and FG22E SoC) to include features that will support energy harvesting.
技术探讨 发布时间 : 2024-07-18
电子商城
现货市场
品牌：SILICON LABS
品类：Switch Hall Effect Magnetic Position Sensor
价格：￥2.2924
现货：126,000
服务
可定制显示屏的尺寸0.96”~15.6”，分辨率80*160~3840*2160，TN/IPS视角，支持RGB、MCU、SPI、MIPI、LVDS、HDMI接口，配套定制玻璃、背光、FPCA/PCBA。
最小起订量： 1000 提交需求>
可烧录IC封装SOP/MSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN；IC包装Tray/Tube/Tape；IC厂商不限，交期1-3天。支持IC测试（FT/SLT），管装、托盘装、卷带装包装转换，IC打印标记加工。
最小起订量： 1pcs 提交需求>
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
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