Silicon Labs‘ Most Energy-efficient Wireless SoC New xG22E Family to Date with Energy Harvesting-ready Capabilities

2024-04-25 SILICON LABS News
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SILICON LABS (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E. As Silicon Labs' most energy-efficient SoCs to date, all three SoCs will enable IoT device makers to build high-performance, Bluetooth Low Energy (LE), 802.15.4-based, or Sub-Ghz wireless devices for battery-optimized and battery-free devices that can harvest energy from external sources in their environments like indoor or outdoor ambient light, ambient radio waves, and kinetic motion.

To help device manufacturers build a complete energy harvesting solution, Silicon Labs is also announcing their partnership with e-peas, a provider of industry-leading Power Managed Integrated Circuits (PMICs) designed for energy harvesting. Through this partnership, Silicon Labs and e-peas co-developed two energy harvesting shields for Silicon Labs' new, energy-optimized xG22E Explorer Kit. To better develop within the tight constraints that energy harvesting requires, the new xG22E Explorer Kit allows developers to customize the peripherals and debugging options that best match their application and get highly accurate measurements to better build their applications and devices with the energy harvesting shields. The energy harvesting shields are each tuned and optimized for different energy sources and energy storage technologies. They are custom-fit to slot onto the Explorer Kit. Notably, one of the shields uses e-peas' latest AEM13920 dual-harvester, which allows it to pull energy simultaneously from two distinct energy sources, like indoor or outdoor light, thermal gradients, and electromagnetic waves without sacrificing on energy conversion efficiency. The second co-developed shield is based on e-peas' AEM00300 shield, and is dedicated to harvesting power from random pulsed energy sources.


"As the market for energy harvesting and low-power solutions grows, Silicon Labs remains dedicated to enhancing our wireless MCU and radio stack capabilities to advance the development of battery-free IoT solutions," said Ross Sabolcik, Senior Vice President for the Industrial and Commercial Business Unit at Silicon Labs. "Our efforts to prioritize energy efficiency and increase device longevity underscore our commitment to fostering a more sustainable IoT ecosystem."

xG22E Designed to Address Energy Efficiency Challenges for the IoT

The evolution and widespread deployment of the Internet of Things (IoT) faces a significant challenge related to powering low-complexity, small-form-factor devices. Traditional sources like mains power or batteries pose scalability and maintenance issues. The emergence of the Ambient IoT addresses this challenge by introducing a class of connected devices primarily powered through energy harvesting from ambient sources like radio waves, light, motion, and heat.


Silicon Labs aims to build a device that can address one of the significant challenges in Ambient IoT: creating a platform that can optimize its energy consumption and prolong its lifespan. The xG22E family comes equipped with several features designed to minimize energy use and make it the platform of choice for energy harvesting, including:

  • Ultra-fast, low-energy cold start for applications starting from a zero-energy state to transmit packets and then rapidly return to sleep. An xG22E device wakes up in only eight milliseconds and uses only 150 micro-Joules, or roughly 0.003% of the energy needed to power a 60-watt equivalent LED lightbulb for one second.

  • Energy conserving deep sleep swift wake-up reduces wake-up energy by 78% compared to other Silicon Labs devices.

  • Power-efficient energy mode transition to smoothly transition in and out of energy modes by mitigating current spikes or inrush, which can harm energy storage capacity.

  • Multiple deep sleep wake-up options, such as RFSense, GPIO, and RTC wake-up sources from the deepest EM4 sleep mode, are ideal for extended storage.


Energy Harvesting Applications Enable a More Sustainable IoT

Energy harvesting and conservation technologies offer significant benefits across industries, including reduced energy costs, elimination of battery dependence, and reduced operational carbon footprint by changing energy consumption sources and minimizing battery waste. It also complements many existing IoT applications. For example, electronic shelf labels are being rapidly adopted by retailers across the globe to allow for more accurate pricing, inventory management, and even loss prevention. However, with a single location having as many as thousands of labels, they require a lot of batteries. Fortunately, electronic shelf labels do not need a lot of power, nor do they require always-on connectivity, making them an excellent fit for energy harvesting. By using Ambient IoT energy sources, retailers can reduce or eliminate their need for batteries for shelf labels. Other examples in the consumer space include television remote controls that use solar energy and movable, wireless light or appliance switches.


Silicon Labs actively supports companies developing successful low-power devices and pursuing battery-free designs, fostering an environmentally sustainable leadership within their respective fields.

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本文由玄子转载自SILICON LABS News,原文标题为:Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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描述- Silicon Labs宣布,为满足对无线SoC和MCU的需求增长,将增加EFR32BG21和EFR32MG21 SoC(统称为xG21)的产能,从TSMC转移到SMIC。此次变更不影响外形、尺寸、质量或可靠性,但功能影响将在勘误和迁移指南中说明。所有现有OPN将更新,以“D”替换修订字符以识别来自SMIC晶圆厂的IC。资料包括更新的数据表和勘误表,以及产品识别和客户响应信息。

型号- EFR32MG21B020F768IM32-DR,EFR32BG21B020F768IM32-DR,EFR32BG21A010F512IM32-B,EFR32BG21B020F768IM32-D,EFR32BG21B020F768IM32-B,EFR32BG21A010F512IM32-D,EFR32MG21B020F1024IM32-DR,EFR32BG21A010X1652IM32-BR,EFR32MG21B010F1024IM32-BR,EFR32MG21A010F512IM32-BR,EFR32BG21B010F1024IM32-DR,EFR32MG21A010F512IM32-B,EFR32BG21B010X1653IM32-B,EFR32BG21A020F1024IM32-B,EFR32BG21A010F1024IM32-D,EFR32MG21A020F512IM32-BR,EFR32MG21B010F768IM32-DR,EFR32BG21A010F1024IM32-B,EFR32MG21A020PZ024IM32-B,EFR32BG21B020P1693IM32-B,EFR32MG21B020F768IM32-B,EFR32MG21A010F1024IM32-DR,EFR32MG21B020F768IM32-D,EFR32BG21B010F768IM32-DR,EFR32BG21A010F512IM32-BR,EFR32BG21A020F512IM32-BR,EFR32BG21A020F1024IM32-BR,EFR32BG21A020F768IM32-B,EFR32BG21B020F768IM32-BR,EFR32BG21A020F768IM32-D,EFR32BG21B020P1689IM32-BR,EFR32BG21B010F1024IM32-BR,EFR32MG21A010F512IM32-DR,EFR32BG21A010X1652IM32-B,EFR32MG21A020PZ013IM32-BR,EFR32MG21B010F512IM32-B,EFR32MG21A020F512IM32-DR,EFR32BG21A020F512IM32-B,EFR32BG21A020F512IM32-D,EFR32MG21B010F1024IM32-DR,EFR32BG21A010F768IM32-BR,EFR32BG21A020F768IM32-BR,EFR32BG21A020F1024IM32-D,EFR32MG21B010F512IM32-D,EFR32MG21A020F1024IM32-BR,EFR32MG21B020F512IM32-BR,EFR32MG21B010F512IM32-BR,EFR32BG21A010F768IM32-D,EFR32BG21B010F768IM32-BR,EFR32BG21A010F768IM32-B,EFR32MG21A010M1475IM32-B,EFR32BG21B010F1024IM32-D,EFR32BG21B020F1024IM32-B,EFR32BG21B020F1024IM32-D,EFR32BG21B010F1024IM32-B,EFR32BG21A020F1024IM32-DR,EFR32BG21B020P1693IM32-BR,EFR32BG21B010F512IM32-BR,EFR32BG21A010F1024IM32-BR,EFR32MG21B020F512IM32-D,EFR32MG21A020PZ013IM32-B,EFR32BG21B020P1697IM32-BR,EFR32MG21B020F512IM32-B,EFR32BG21B020P1712IM32-BR,EFR32BG21B020P1697IM32-B,EFR32BG21B020P1712IM32-B,EFR32BG21B020F1024IM32-BR,EFR32BG21B020F512IM32-BR,EFR32BG21B020F512IM32-D,EFR32MG21B010F768IM32-D,EFR32MG21B010F1024IM32-B,EFR32MG21B020F1024IM32-B,EFR32MG21B010PZ045IM32-BR,EFR32MG21B010F1024IM32-D,EFR32BG21B020F512IM32-B,EFR32MG21B010F768IM32-B,EFR32MG21A010M1475IM32-BR,EFR32BG21,EFR32MG21A020PZ024IM32-BR,EFR32MG21B020F1024IM32-D,EFR32BG21A020F768IM32-DR,EFR32MG21A020F1024IM32-DR,EFR32BG21A010F768IM32-DR,EFR32MG21A020F768IM32-D,EFR32MG21A020F768IM32-B,EFR32MG21B010F512IM32-DR,EFR32MG21A020F768IM32-DR,EFR32MG21B020F512IM32-DR,EFR32MG21A010F768IM32-DR,EFR32MG21B010F768IM32-BR,EFR32BG21A010F1024IM32-DR,EFR32MG21A020F512IM32-B,EFR32MG21B020F768IM32-BR,EFR32BG21B010X1653IM32-BR,EFR32BG21B010F512IM32-DR,EFR32BG21B010F512IM32-B,EFR32BG21B010F512IM32-D,EFR32BG21B020F1024IM32-DR,EFR32MG21A010F768IM32-D,EFR32BG21B020F512IM32-DR,EFR32BG21B020P1689IM32-B,EFR32MG21A010F768IM32-B,EFR32MG21B020F1024IM32-BR,EFR32MG21B010PZ045IM32-B,EFR32MG21A010F768IM32-BR,EFR32MG21,EFR32MG21A020F768IM32-BR,EFR32MG21A010F512IM32-D,EFR32MG21A010F1024IM32-BR,EFR32BG21A020F512IM32-DR,EFR32BG21A010F512IM32-DR,EFR32BG21B010F768IM32-B,EFR32MG21A020F512IM32-D,EFR32BG21B010F768IM32-D,EFR32MG21A020F1024IM32-D,EFR32MG21A010F1024IM32-B,EFR32MG21A010F1024IM32-D,EFR32MG21A020F1024IM32-B

May 01, 2024  - SILICON LABS  - 产品变更通知及停产信息 代理服务 技术支持 批量订货

EFR32MG24无线SoC系列数据表

描述- EFR32MG24无线SoC系列专为mesh物联网无线连接设计,适用于Matter、OpenThread和Zigbee协议。该系列具备高性能2.4GHz射频、低功耗、AI/ML硬件加速器和Secure Vault等功能,旨在为物联网设备制造商提供智能、可靠且节能的产品。其核心采用最高78MHz频率运行的ARM Cortex-M33处理器,配备1536KB闪存和256KB RAM,适合于需求较高的应用。

型号- EFR32MG24A020F1536IM48-B,EFR32MG24A410F1536IM40-B,EFR32XG24,EFR32MG24B020F1024IM48-B,EFR32MG24A420F1536IM48-B,EFR32MG24A010F1536IM40-B,EFR32MG24A410F1536IM48-B,EFR32MG24B010F1024IM48-B,EFR32MG24A420F1536IM40-B,EFR32MG24A020F1536IM40-B,EFR32,EFR32MG24A010F1536IM48-B,EFR32MG24A110F1024IM48-B,EFR32MG24A010F1024IM48-B,EFR32MG24,EFR32MG24B010F1536IM40-B,EFR32MG24A020F1024IM48-B,EFR32MG24B020F1536IM40-B,EFR32MG24A010F1024IM40-B,EFR32MG24B210F1536IM48-B,EFR32MG24B310F1536IM48-B,EFR32MG24A020F1024IM40-B,EFR32MG24 FAMILY,EFR32MG24B220F1536IM48-B,EFR32MG24B110F1536IM48-B,EFR32MG24B120F1536IM48-B,EFR32MG24B020F1536IM48-BR,EFR32MG24B010F1536IM48-B,EFR32MG24A021F1024IM40-B,EFR32MG24B020F1536IM48-B

March, 2023  - SILICON LABS  - 数据手册  - Rev. 1.1 代理服务 技术支持 批量订货 查看更多版本

UG582:EFR32XG22E浏览器套件用户指南

描述- 该资料介绍了EFR32xG22E Explorer Kit,一款基于EFR32MG22E无线 Gecko系统级芯片的超低成本、小型开发平台。该平台适用于快速原型设计和物联网应用的构思。主要特点包括USB接口、板载SEGGER J-Link调试器、用户LED和按钮,以及通过mikroBus插座和Qwiic连接器支持硬件扩展板。资料详细介绍了平台的功能、硬件布局、电源供应、调试方法和无线射频部分。

型号- EFR32MG22,EFR32XG22E,XG22-EK2710A,EFR32MG22E,EFR32MG22E224F512IM40

June 2024  - SILICON LABS  - 用户指南  - Rev. 1.0 代理服务 技术支持 批量订货
Wednesday, April 14, 2021  - SILICON LABS  - 电路原理图  - Revision A01 代理服务 技术支持 批量订货
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可定制显示屏的尺寸0.96”~15.6”,分辨率80*160~3840*2160,TN/IPS视角,支持RGB、MCU、SPI、MIPI、LVDS、HDMI接口,配套定制玻璃、背光、FPCA/PCBA。

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可烧录IC封装SOP/MSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN;IC包装Tray/Tube/Tape;IC厂商不限,交期1-3天。支持IC测试(FT/SLT),管装、托盘装、卷带装包装转换,IC打印标记加工。

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