RF-star’s Development Kits of CC2340 BLE Modules Accelerate Projects

2024-05-16 RF-Star
BLE Module,wireless RF modules,development board,development kits BLE Module,wireless RF modules,development board,development kits BLE Module,wireless RF modules,development board,development kits BLE Module,wireless RF modules,development board,development kits

How to use the CC2340 module for the test? The brief guide to RF-star development kits for CC2340R5 BLE Modules helps developers quickly evaluate their projects.

 

How to use the CC2340 module for development or debugging? Here is a brief guide to RF-star development kits (Dev kits) designed for CC2340R5 BLE modules, helping developers to efficiently evaluate their projects and accelerate the design process.

Fig.1

First of all, let’s have a look at RF-star wireless modules based on TI CC2340 SoCs.

 

RF-BM-2340xx are wireless RF modules integrated with TI CC2340R5 SoC with superior RF performance, rich resources and peripherals, flexible RF output modes, and available dimensions. Embedding the module into your application can reduce the development workload and save time in antenna matching and PCB design. Moreover, the BLE5.0 transparent transmission protocol (UART serial port protocol) of the module allows for quick development initiation. Of course, the module provides access to self-development.

 

The models are available:

RF-BM-2340B1

RF-BM-2340B1I

●RF-BM-2340A2

RF-BM-2340A2I

RF-BM-2340C2

RF-BM-2340T1

RF-BM-2340T2

RF-BM-2340T3

 

During debugging or development, the challenge often lies in soldering and designing a PCB test board. Soldering pins are too cumbersome to distinguish each other, and wiring errors may pose a risk of damaging the chip. Furthermore, designing a specific PCB can be laborious.

 

To enable developers to create applications efficiently, RF-star development kits offer the following key features:

 

●The kits include a BLE module RF-BM-2340xx, and a development board. Two development boards are ready: RF-BT02 (compatible with RF-BM-2340A2 and RF-BM-2340A2I) and RF-BT03 (compatible with RF-BM-2340B1 and RF-BM-2340B1I). 

Fig.2 RF-BM-2340A2 module and RF-BT02 development board

Fig.3 RF-BM-2340B1 module and RF-BT03 development board

●It supports Type-C wire for a PC and OTG wire for a mobile phone.

●The default RF-star Bluetooth 5.0 master-slave transparent transmission firmware is integrated, facilitating parameter configuration and communication testing using DuPont wires, wire jumpers, Type-C or OTG wire, and UART assistant.

 

The dev kits are also convenient for developers who wish to develop their own firmware. All module pins are lead out on the development baseboard, with power supply and burning pins integrated with adjacent positions. Simply connecting the necessary header pins allows for simulation debugging.

 

For the self-development of CC2340 series modules, the develop environment and hardware should be prepared.

1. Integrated Development Environment (IDE): Code Composer Studio(CCS), IAR

2. Burning Software: UniFlash

3. Burning Tool: XDS110

4. SDK: https://www.ti.com/product/CC2340R5?keyMatch=&tisearch=search-everything&usecase=partmatches#software-development

 

Once getting the dev kits, developers can proceed directly with development or testing combined with our module datasheet or chip manual.

 

To sum up, the tool eliminates the need to code everything from scratch, providing developers with enough time to focus on core applications and accelerate the design process.

 

The CC2340 development kits and modules are in stock NOW. 


For those using the default firmware, kindly refer to CC2340x Master-Slave Module and Protocol V1.0.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
  • +1 赞 0
  • 收藏
  • 评论 0

本文由三年不鸣转载自RF-Star,原文标题为:RF-star’s Development Kits of CC2340 BLE Modules Accelerate Projects,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

评论

   |   

提交评论

全部评论(0

暂无评论

相关推荐

为什么蓝牙信道探测技术将引领高精度定位服务?

本文信驰达(RF-star)将介绍蓝牙信道探测技术定义、工作原理 、在定位服务中的优势、以及Channel Sounding的主要应用场景。最后,我们还将为您介绍蓝牙信道探测技术与UWB超宽带技术的混合解决方案在高精度定位服务领域的应用。

设计经验    发布时间 : 2024-04-12

【经验】信驰达RF-BM-2340B1蓝牙模块手把手透传指南

RF-BM-2340B1 是信驰达科技基于美国TI的 CC2340为核心设计的一款SimpleLink 2.4 GHz 无线模块,RF-BM-2340B1支持蓝牙5.0串口透传协议,本文以RF-BM-2340B1为例,讲述如何使用RF-BM-2340B1蓝牙模块实现手机App到蓝牙模块之间的透传,和模块到模块之间实现串口透传,适用于信驰达RF-BM-2340xx系列蓝牙模块。

设计经验    发布时间 : 2023-08-11

【经验】解析信驰达RF-BM-BG22系列模块作openmcu开发时无法烧录固件如何解决

信驰达RF-BM-BG22系列模块使用的是Silicon Labs的EFR32BG22系列芯片,不少开发者为了省去硬件开发周期,会直接选择使用信驰达的模块进行openmcu开发,但会出现无法正常烧写程序的情况,本文将介绍如何将模块恢复为可正常可烧写状态。

设计经验    发布时间 : 2022-03-09

选型表  -  信驰达 立即选型

信驰达(RF-star)无线通信模块选型指南

描述- 信驰达(RF-star)是一家专注于低功耗无线射频应用的高新技术企业,致力于为客户提供基于 BLE、Wi-Fi、 UWB、Zigbee、Thread、Matter、Sub-1G、Wi-SUN、LoRa等核心技术的软硬件设计与制造,APP及物联网云后台开发、大数据分析、以及OEM与ODM服务,其产品及服务广泛分布于新能源汽车、消费电子、医疗电子、工业物联网、智慧能源等领域。公司于2010年在深圳成立,并陆续在香港、成都、北京,苏州设立分部。

型号- RF-BMPA-2541B1,RF-DG-52PA,RF-WM-20DNB1,RSBRS02AI,RF-WM-3235A1S,RF-SM-1277B2,RF-SM-1277B1,RF-BM-ND04I,RSBRS02AA,RF-WM-10AFB1,RF-BM-ND04C,RF-BM-S01,RF-BM-S02,RF-BM-2652P2I,RF-WM-3200B3,RF-WM-3200B1,3B32_V102,RF-BM-4044B5,RF-WM-20CMB1,RF-BM-ND05I,RF-BM-4044B2,RF-BM-4044B4,RF-SM-1077B2,RF-BM-4044B3,RF-SM-1077B1,RF-BM-2642B2,RF-BM-2642B1,RF-DG-40A,RF-BM-BG22B1,RF-ZM-2530P1I,RF-BM-BG22B3,RF-BM-BG22A3,RF-WM-3235B1S,RF-B-SR1,RF-BM-ND02C,RF-BM-4077B1,RF-BM-4077B2,RF-BM-MG24B2,RF-BM-MG24B1,RF-BM-ND04A,RF-BM-2652P7,VL-LE01B,VL-LE01A,RF-BM-2340T1,WE1005,RF-BM-2340T3,RF-BM-2340T2,RF-BM-BG22C3,RF-BM-2652P2,RF-BM-2652P3,RF-BM-2652P4,RF-BM-4077B1L,RF-BM-2652P1,RF-ZM-2530B1,RF-WM-ESP32B1,RSBRS02ABR-01,RF-BM-ND09A,RF-WM-11AFB1,RF-DG-22A,RF-BM-4055B1L,RF-BM-2340QB1,RF-BM-ND04CI,RF-BM-2340C2,RF-DG-52PAS,RF-B-AR3,RF-B-AR4,RF-B-AR1,RF-B-AR2,RF-BM-2652B1,RF-ZM-2530P1,RF-BM-2642QB1I,RF-BM-2652B2,RF-BM-BG22A1,RF-TI1352B1,RF-ZM-2530B1I,RF-NBE01,RF-BM-2340A2I,RF-BM-BG22A1I,RF-BM-2340B1,RF-BM-2652RB2,RF-WM-3235B1,RF-BM-2340B1C,RF-BM-S02A,RF-CC2540A1,RSBRS02ABR,RF-BM-ND10,RF-BM-S02I,RF-DG-32B,RF-BM-BG24B1,RF-BM-ND01,RF-BM-ND02,RF-BM-ND04,RF-BM-ND05,RF-BM-ND06,RF-BM-ND07,RF-BM-ND08,RF-BM-ND09,RF-SM-1044B2,RF-SM-1044B1,RF-BM-2340A2,RF-BM-2340B1I,RF-SM-1044B4,RF-TI1352P1,RF-WM-3235A1,RF-TI1352P2,RF-BM-2652P4I,RF-BM-ND08C,RF-BM-S01A,RF-BM-ND08A,RF-WM-3220B1,RF-BM-2651B1,RF-BM-BG24B2,RF-BM-BG22A3I,RSBRS02ABRI

选型指南  -  信驰达  - 2024/3/6 PDF 中文 下载

蓝牙芯片vs蓝牙模块:如何为蓝牙方案做出最佳选择?

不论您是设计全新的低功耗蓝牙产品,还是升级现有产品,开发者都面临的一个关键的选择:是采用蓝牙芯片还是蓝牙模块呢?作为蓝牙技术领域的资深专家,信驰达将从蓝牙芯片与蓝牙模块的各自优缺点进行分析,帮助您在选择蓝牙方案时考虑项目规模、具体需求、技术能力、成本预算、上市时间及供应链管理等多重因素。

技术探讨    发布时间 : 2024-08-27

信驰达(RF-star)物联网射频模组选型指南

目录- 公司介绍    产品型号总览表    行业应用    物联网射频模组   

型号- RF-BM-ND09A,RF-WM-11AFB1,RF-DG-22A,RF-WM-20DNB1,RF-WM-3235A1S,RF-BM-ND04CI,RF-SM-1277B2,RF-WM-RTL8720DNB1,RF-BM-ND04I,RF-SM-1277B1,RF-BM-2340C2,RF-BM-ND04C,RF-DG-52PAS,RF-BM-2652P2I,RF-WM-3200B3,RF-WM-3200B1,RF-B-AR4,RF-B-AR1,RF-BM-2652B1,RF-ZM-2530P1,RF-BM-BG22A1,RF-BM-2652B2,RF-TI1352B1,RF-BM-4044B5,RF-ZM-2530B1I,RF-WM-20CMB1,RF-BM-2340A2I,RF-BM-BG22A1I,RF-BM-ND05I,RF-BM-2340B1,RF-BM-4044B2,RF-BM-4044B4,RF-SM-1077B2,RF-BM-4044B3,RF-SM-1077B1,RF-WM-3235B1,RF-BM-2642B2,RF-DG-40A,RF-BM-BG22B1,RF-BM-ND10,RF-BM-BG24B1,RF-ZM-2530P1I,RF-DG-32B,RF-BM-BG22A3,RF-BM-ND04,RF-WM-3235B1S,RF-BM-ND05,RF-BM-ND06,RF-BM-ND08,RF-B-SR1,RF-BM-2340B1I,RF-BM-2340A2,RF-BM-4077B1,RF-BM-4077B2,RF-BM-MG24B2,RF-BM-MG24B1,RF-TI1352P1,RF-WM-3235A1,RF-BM-ND08C,RF-BM-2652P4I,RF-BM-ND08A,RF-BM-2652P7,RF-WM-3220B1,RF-BM-2651B1,RF-BM-BG22C3,RF-BM-BG24B2,RF-BM-2652P2,RF-WM-RTL8720CMB1,RF-BM-2652P3,RF-BM-BG22A3I,RF-BM-2652P4,RF-ZM-2530B1

选型指南  -  信驰达  - 2023/8/4 PDF 中文 下载

数据手册  -  信驰达  - V1.1  - 2023.02.22 PDF 英文 下载

Wi-SUN: The Future of Secure and Scalable IoT Wireless Networks

Wi-SUN‘s unique mesh network architecture, combined with its low latency, high data throughput, low power consumption, ease of deployment and scalability, high security, interoperability, and long-range transmission capabilities, makes it an ideal solution for wide-area large-scale IoT applications. This article explores the Wi-SUN technology market, its main benefits, use cases and applications, and RF-star‘s implementation of Wi-SUN.

技术探讨    发布时间 : 2024-07-30

【IC】信驰达科技推出多款基于TI CC2340R5系列的低功耗蓝牙模块,支持多种天线输出形式

信驰达科技基于TI CC2340R5推出了多款蓝牙串口模块,包括RF-BM-2340B1、RF-BM-2340B1I、RF-BM-2340A2、RF-BM-2340A2I、RF-BM-2340C2,RF-BM-2340x系列低功耗蓝牙模块。

产品    发布时间 : 2024-02-19

CC2340R5 Bluetooth 5.3 LE Modules Deliver Industrial-grade Performance, Ultra-low-power Consumption and Robust Connection

New CC2340R5 Bluetooth 5.3 Low Energy (BLE) modules are now in stock with four types - RF-BM-2340B1I, RF-BM-2340A2, RF-BM-2340A2I and RF-BM-2340C2.

产品    发布时间 : 2024-03-14

RF-star Launches Bluetooth UART Protocol for CC2652P High-Power BLE Modules RF-BM-2652P2/P2I

RF-star has released its latest Bluetooth UART transparent transmission protocol for CC2652P-based BLE modules RF-BM-2652P2 and RF-BM-2652P2I. This new offering is set to revolutionize the landscape of high-power Bluetooth Low Energy (BLE) modules, by providing developers with robust, long-range wireless solutions tailored for multi-connectivity needs.

产品    发布时间 : 2024-07-30

数据手册  -  信驰达  - 2024 年 03 月 05 日 PDF 中文 下载

8 High-Power Bluetooth LE Modules and Their Applications

Bluetooth Low Energy (BLE) technology is renowned for its low power consumption and ease of use in short-range wireless communication. High-power BLE modules are essential for applications requiring extended range and robust connectivity. They integrate advanced wireless technologies and offer flexible output options, making them ideal for smart homes, industrial automation and more. This article introduces 8 high-power bluetooth LE modules and their applications.

技术探讨    发布时间 : 2024-07-16

RF-star Redefines Automotive Wireless Solutions with New BLE Module Lineup RF-BM-2642QB1I and RF-BM-2340QB1

“We are thrilled to introduce our latest BLE modules tailored for automotive applications,“ said King Kang, CEO of RF-star. “With the CC2642R-Q1 and CC2340R5-Q1 modules, we aim to empower automakers with robust, secure, and easy-to-integrate solutions that enhance connectivity and user experience in modern vehicles.”

产品    发布时间 : 2024-06-14

展开更多

电子商城

查看更多

品牌:信驰达

品类:开发板

价格:¥28.1556

现货: 10

品牌:信驰达

品类:SimpleLink Multi-Protocol系列模组

价格:

现货: 0

品牌:信驰达

品类:SimpleLink Multi-Protocol系列模组

价格:¥13.6889

现货: 0

品牌:信驰达

品类:无线模块

价格:

现货: 0

品牌:Ignion

品类:虚拟天线芯片

价格:¥3.0263

现货: 2,465

品牌:Dusun

品类:Bluetooth云模组

价格:¥49.5000

现货: 5

品牌:EPC

品类:Development Board

价格:¥1,586.6895

现货: 2

品牌:EPC

品类:Development Board

价格:¥9,482.5080

现货: 1

品牌:EPC

品类:Development Board

价格:¥4,665.9960

现货: 1

品牌:EPC

品类:Development Board

价格:¥8,152.9500

现货: 1

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

现货市场

查看更多

暂无此商品

海量正品紧缺物料,超低价格,限量库存搜索料号

服务

查看更多

中高端PCB/FPC打样定制

可加工2-32层PCB/1-5阶HDI/FPC柔性线路板/Rigid-Flex Board软硬结合板,最小线宽线距:2mil;最小孔:3mil;铜厚:1-10OZ。

最小起订量: 1 提交需求>

查看更多

授权代理品牌:接插件及结构件

查看更多

授权代理品牌:部件、组件及配件

查看更多

授权代理品牌:电源及模块

查看更多

授权代理品牌:电子材料

查看更多

授权代理品牌:仪器仪表及测试配组件

查看更多

授权代理品牌:电工工具及材料

查看更多

授权代理品牌:机械电子元件

查看更多

授权代理品牌:加工与定制

世强和原厂的技术专家将在一个工作日内解答,帮助您快速完成研发及采购。
我要提问

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

研发客服
商务客服
服务热线

联系我们

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

投诉与建议

E-mail:claim@sekorm.com

商务合作

E-mail:contact@sekorm.com

收藏
收藏当前页面