BLE Connection Roles Central/Master vs. Peripheral/Slave

2024-05-15 RF-Star
BLE Modules,SoCs,Bluetooth Low Energy modules,EFR32BG22 BLE Modules,SoCs,Bluetooth Low Energy modules,EFR32BG22 BLE Modules,SoCs,Bluetooth Low Energy modules,EFR32BG22 BLE Modules,SoCs,Bluetooth Low Energy modules,EFR32BG22

Learn the nuances between Central and Peripheral roles in BLE devices to optimize energy efficiency and functionality for your projects. Unlock how to select the most suitable BLE Modules based on your specific needs.

 

In the world of Bluetooth Low Energy (BLE), BLE devices are designed to play specific roles that dictate how they interact within the BLE ecosystem. To fully leverage the benefits of BLE technology, it is essential to understand the roles of BLE devices in the communication process.

Fig.1

In this article, we introduce the common roles in BLE connection, the differences between Central and Peripheral roles, and how to choose well-suited BLE modules for your projects. The two primary BLE roles are the Central and Peripheral roles.


Central / Master vs. Peripheral / Slave

The Central is a device with powerful and rich resources. The BLE central device initiates an outgoing connection request to an advertising peripheral device, and processes data provided by the peripheral. In a way, it can be regarded as the active role, also referred to as a “master”.  A typical example of a central device is a smartphone, which can connect to several peripherals simultaneously, collecting, and processing data from each.

 

On the other hand, the Peripheral is a typically low-power, resource-constrained device that provides data. It accepts an incoming connection request after advertising its presence to other devices in the vicinity. Generally, the Peripheral is meant to stay put until someone decides to connect with it. Hence, it is also called a “slave”. A peripheral is usually a small device like a smartwatch, a temperature sensor, a heart rate monitor, etc.

 

The BLE specification does not limit the number of slaves a master may connect to, but there is always a practical limitation, especially on different models of modules. For instance, RF-star’s BLE modules based on TI CC2642R, CC2340, SILICON LABS EFR32BG22 and Nordic nRF52840 nRF52832 SoCs play a master and multi-slave roles. Support at most 8 simultaneous and stable connection devices, that is 7 slaves and 1 master. Furthermore, the EFR32BG22 and CC2340-based Bluetooth Low Energy modules can connect simultaneously to multiple masters and slave devices.


After knowing the definition of connection roles in BLE communication, let’s move to their distinction.


Differences Between Central and Peripheral

While BLE Peripherals and Centrals both contribute to BLE communication, they have unique features, capabilities, and requirements. Here is a table for you to clearly distinguish each other.

Table.1

As the above shows, a Peripheral in BLE is a low-power device, mainly providing data. It wakes up only to advertise or transmit data while spending most of the time in a low-power sleep mode. A Central, in contrast, is power-hungry, continuously scanning for peripherals and managing multiple connections. Some Central devices, like smartphones, can maintain several connections simultaneously, making them suitable for data aggregation and processing, whereas peripherals are commonly found in battery-powered devices like sensors, wearables, and beacons.

 

Knowing these differences, is it clear how to choose between a master and slave role for your BLE device? Don’t worry! RF-star lists some useful suggestions for a better choice of your specific needs.


Tips for Choosing Master and Slave BLE Modules

Energy Efficiency Priority: Determine if energy conservation is a top priority for your device. If so, opting for a BLE module acting as a slave may be advantageous, because it primarily operates in a low-power mode.

 

Data Role: Assess whether your device primarily generates data for consumption by other devices or needs to collect and process data from peripherals. Devices that generate data are better embedded by slave BLE modules, while those that collect data are more apt as masters.

 

Multi-Device Connectivity: Consider whether your device needs to connect with multiple other devices simultaneously. If so, functioning as a master device would be more effective in managing multiple connections concurrently.

 

Resource Allocation: Evaluate the processing power and resources available on your device. If resources are limited, choosing a slave module may be more feasible as a master BLE module typically requires more processing power and resources to manage multiple connections.

 

Tailored Application Needs: Analyze the specific requirements of your application to determine the most suitable role for your device. For example, a health tracker (peripheral) needs to transmit data to a smartphone (central), while a smart home hub (central) must gather data from various home automation sensors (peripherals).

 

Consider Scalability: Think about potential future requirements and the scalability of your device. If your device will need to connect to more peripherals or handle increased data processing in the future, a BLE module operating as a master role might offer greater flexibility.

 

Ease of Integration: Consider how seamlessly your device needs to integrate into existing BLE ecosystems. Depending on the ecosystem and compatibility requirements, choosing the appropriate role can facilitate smoother integration and interoperability with other devices.

 

User Interaction Patterns: Estimate the typical user interaction patterns with your device. If users are more likely to interact directly with your device (e.g., through a smartphone app), it may be better suited as a master. Conversely, if the device operates autonomously with minimal user interaction, a slave role might be better.

 

Fortunately, as diverse demands grow and BLE technology advances, more and more master-slave Bluetooth modules have emerged on the market. With their dual-role capability, these modules can reduce overall application costs and enhance usability, making project optimization easier.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
  • +1 赞 0
  • 收藏
  • 评论 0

本文由三年不鸣转载自RF-Star,原文标题为:BLE Connection Roles Central/Master vs. Peripheral/Slave,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

评论

   |   

提交评论

全部评论(0

暂无评论

相关推荐

Application of BLE Module in Forest Rescue System

With the development of Bluetooth technology, low power consumption, small size and low-cost chip solutions enable BLE modules to be used even in extremely small devices. The BLE module is not only used in our daily life, but also plays an important role in the forest rescue system.

技术探讨    发布时间 : 2024-07-26

Breaking Boundaries: Wi-Fi BLE IoT Module Innovations

In the fast-paced world of technology, the evolution of Wi-Fi BLE IoT modules has been a game-changer, breaking boundaries and opening up new possibilities for connectivity and automation.

技术探讨    发布时间 : 2024-07-25

8 High-Power Bluetooth LE Modules and Their Applications

Bluetooth Low Energy (BLE) technology is renowned for its low power consumption and ease of use in short-range wireless communication. High-power BLE modules are essential for applications requiring extended range and robust connectivity. They integrate advanced wireless technologies and offer flexible output options, making them ideal for smart homes, industrial automation and more. This article introduces 8 high-power bluetooth LE modules and their applications.

技术探讨    发布时间 : 2024-07-16

Silicon Labs(芯科科技) 物联网无线产品选型指南

目录- Company and product overview    Bluetooth Modules    proprietary wireless devices    Wi-Fi Modules    Mighty Gecko Modules    Z-Wave Modules   

型号- EBWT41U,ZDB5202,SLEXP8027A,EFR32FG13P233F512GM48,EFR32™,SLWSTK6061B,MGM12P,EZR32WG,EFR32FG13P231F512GM32,EFR32BG12P232F1024GM68,EFR32MG13P733F512GM48,EFR32BG13P532F512GM32,WT12,AMW007-E04,EFR32,WT32I,EZR32™,BGM121,BGM11S,WT11U,EFR32FG,EFR32FG14P233F256GM48,SLWSTK6062B,RBK-ZW500DEV-CON2,SLWSTK6120A,SLWSTK6063B,RBK-ZW500,EFR32BG12P132F1024GL125,SI4XXX,ZM5101,ZM5304,ZDB5101,ACC-UZB3-U-BRG,BGM111,EBWT11U,EFR32FG14P233F128GM48,ACC-UZB3-U-STA,MGM111,ZDB5304,SLWSTK6000B,SLWSTK6020B,WT32,SI10XX,SLWSTK6101C,EFR32MG13P632F512GM32,AMW037,EFR32FG12P433F1024GM48,DKWT32I-A,EFR32MG12P132F1024GL125,EFR32MG1P133F256GM48,BGM13S,EZR32HG,BGM13P,BGX13P,EZR32LG,MGM13P,WT41U,EFR32BG13P733F512GM48,BGX13S,SLWSTK6060B,MGM13S,SLWSTK6065B,WGM110,RBK-ZW500DEV-EMB2,EFR32BG12P433F1024GL125,EBWT12-A,ZM5202,AMW007,SLTB004A,EFR32MG14P733F256GM48

选型指南  -  SILICON LABS  - REV A  - SEPTEMBER 2018 PDF 英文 下载

2406121553 Addendum to 2405011529 Additional Source for EFR32xG21 SoCs Process Change Notice

型号- EFR32MG21B020F768IM32-DR,EFR32BG21B020F768IM32-DR,EFR32BG21A010F512IM32-B,EFR32BG21B020F768IM32-D,EFR32BG21B020F768IM32-B,EFR32BG21A010F512IM32-D,EFR32MG21B020F1024IM32-DR,EFR32BG21A010X1652IM32-BR,EFR32MG21B010F1024IM32-BR,EFR32MG21A010F512IM32-BR,EFR32BG21B010F1024IM32-DR,EFR32MG21A010F512IM32-B,EFR32BG21B010X1653IM32-B,EFR32BG21A020F1024IM32-B,EFR32BG21A010F1024IM32-D,EFR32MG21A020F512IM32-BR,EFR32MG21B010F768IM32-DR,EFR32BG21A010F1024IM32-B,EFR32MG21A020PZ024IM32-B,EFR32BG21B020P1693IM32-B,EFR32MG21B020F768IM32-B,EFR32MG21A010F1024IM32-DR,EFR32MG21B020F768IM32-D,EFR32BG21B010F768IM32-DR,EFR32BG21A010F512IM32-BR,EFR32BG21A020F512IM32-BR,EFR32BG21A020F1024IM32-BR,EFR32BG21A020F768IM32-B,EFR32BG21B020F768IM32-BR,EFR32BG21A020F768IM32-D,EFR32BG21B020P1689IM32-BR,EFR32BG21B010F1024IM32-BR,EFR32MG21A010F512IM32-DR,EFR32BG21A010X1652IM32-B,EFR32MG21A020PZ013IM32-BR,EFR32MG21B010F512IM32-B,EFR32MG21A020F512IM32-DR,EFR32BG21A020F512IM32-B,EFR32BG21A020F512IM32-D,EFR32MG21B010F1024IM32-DR,EFR32BG21A010F768IM32-BR,EFR32BG21A020F768IM32-BR,EFR32BG21A020F1024IM32-D,EFR32MG21B010F512IM32-D,EFR32MG21A020F1024IM32-BR,EFR32MG21B020F512IM32-BR,EFR32MG21B010F512IM32-BR,EFR32BG21A010F768IM32-D,EFR32BG21B010F768IM32-BR,EFR32BG21A010F768IM32-B,EFR32MG21A010M1475IM32-B,EFR32BG21B010F1024IM32-D,EFR32BG21B020F1024IM32-B,EFR32BG21B020F1024IM32-D,EFR32BG21B010F1024IM32-B,EFR32BG21A020F1024IM32-DR,EFR32BG21B020P1693IM32-BR,EFR32BG21B010F512IM32-BR,EFR32BG21A010F1024IM32-BR,EFR32MG21B020F512IM32-D,EFR32MG21A020PZ013IM32-B,EFR32BG21B020P1697IM32-BR,EFR32MG21B020F512IM32-B,EFR32BG21B020P1712IM32-BR,EFR32BG21B020P1697IM32-B,EFR32BG21B020P1712IM32-B,EFR32BG21B020F1024IM32-BR,EFR32BG21B020F512IM32-BR,EFR32BG21B020F512IM32-D,EFR32MG21B010F768IM32-D,EFR32MG21B010F1024IM32-B,EFR32MG21B020F1024IM32-B,EFR32MG21B010PZ045IM32-BR,EFR32MG21B010F1024IM32-D,EFR32BG21B020F512IM32-B,EFR32MG21B010F768IM32-B,EFR32MG21A010M1475IM32-BR,EFR32BG21,EFR32MG21A020PZ024IM32-BR,EFR32MG21B020F1024IM32-D,EFR32BG21A020F768IM32-DR,EFR32MG21A020F1024IM32-DR,EFR32BG21A010F768IM32-DR,EFR32MG21A020F768IM32-D,EFR32MG21A020F768IM32-B,EFR32MG21B010F512IM32-DR,EFR32MG21A020F768IM32-DR,EFR32MG21B020F512IM32-DR,EFR32MG21A010F768IM32-DR,EFR32MG21B010F768IM32-BR,EFR32BG21A010F1024IM32-DR,EFR32MG21A020F512IM32-B,EFR32MG21B020F768IM32-BR,EFR32BG21B010X1653IM32-BR,EFR32BG21B010F512IM32-DR,EFR32BG21B010F512IM32-B,EFR32BG21B010F512IM32-D,EFR32XG21X010,EFR32BG21B020F1024IM32-DR,EFR32MG21A010F768IM32-D,EFR32BG21B020F512IM32-DR,EFR32BG21B020P1689IM32-B,EFR32MG21A010F768IM32-B,EFR32MG21B020F1024IM32-BR,EFR32MG21B010PZ045IM32-B,EFR32MG21A010F768IM32-BR,EFR32MG21,EFR32MG21A020F768IM32-BR,EFR32MG21A010F512IM32-D,EFR32MG21A010F1024IM32-BR,EFR32BG21A020F512IM32-DR,EFR32BG21A010F512IM32-DR,EFR32XG21X020,EFR32BG21B010F768IM32-B,EFR32MG21A020F512IM32-D,EFR32BG21B010F768IM32-D,EFR32XG21,EFR32MG21A020F1024IM32-D,EFR32MG21A010F1024IM32-B,EFR32MG21A010F1024IM32-D,EFR32MG21A020F1024IM32-B

产品变更通知及停产信息  -  SILICON LABS  - Jun 12, 2024 PDF 英文 下载

Can Bluetooth Low Energy modules from LAPIS Technology communicate with each other?

Yes, they can. Since "Serial communication sample software" by LAPIS Technology implements peripheral and central functions, data communication can be established between modules.

技术问答    发布时间 : 2024-08-30

开发环境(软件/固件)  -  MEIG  - V1.2  - 2021-12-03 PDF 英文 下载

2405011529 Additional Source for EFR32xG21 SoCs, Datasheet and Errata Updates

型号- EFR32MG21B020F768IM32-DR,EFR32BG21B020F768IM32-DR,EFR32BG21A010F512IM32-B,EFR32BG21B020F768IM32-D,EFR32BG21B020F768IM32-B,EFR32BG21A010F512IM32-D,EFR32MG21B020F1024IM32-DR,EFR32BG21A010X1652IM32-BR,EFR32MG21B010F1024IM32-BR,EFR32MG21A010F512IM32-BR,EFR32BG21B010F1024IM32-DR,EFR32MG21A010F512IM32-B,EFR32BG21B010X1653IM32-B,EFR32BG21A020F1024IM32-B,EFR32BG21A010F1024IM32-D,EFR32MG21A020F512IM32-BR,EFR32MG21B010F768IM32-DR,EFR32BG21A010F1024IM32-B,EFR32MG21A020PZ024IM32-B,EFR32BG21B020P1693IM32-B,EFR32MG21B020F768IM32-B,EFR32MG21A010F1024IM32-DR,EFR32MG21B020F768IM32-D,EFR32BG21B010F768IM32-DR,EFR32BG21A010F512IM32-BR,EFR32BG21A020F512IM32-BR,EFR32BG21A020F1024IM32-BR,EFR32BG21A020F768IM32-B,EFR32BG21B020F768IM32-BR,EFR32BG21A020F768IM32-D,EFR32BG21B020P1689IM32-BR,EFR32BG21B010F1024IM32-BR,EFR32MG21A010F512IM32-DR,EFR32BG21A010X1652IM32-B,EFR32MG21A020PZ013IM32-BR,EFR32MG21B010F512IM32-B,EFR32MG21A020F512IM32-DR,EFR32BG21A020F512IM32-B,EFR32BG21A020F512IM32-D,EFR32MG21B010F1024IM32-DR,EFR32BG21A010F768IM32-BR,EFR32BG21A020F768IM32-BR,EFR32BG21A020F1024IM32-D,EFR32MG21B010F512IM32-D,EFR32MG21A020F1024IM32-BR,EFR32MG21B020F512IM32-BR,EFR32MG21B010F512IM32-BR,EFR32BG21A010F768IM32-D,EFR32BG21B010F768IM32-BR,EFR32BG21A010F768IM32-B,EFR32MG21A010M1475IM32-B,EFR32BG21B010F1024IM32-D,EFR32BG21B020F1024IM32-B,EFR32BG21B020F1024IM32-D,EFR32BG21B010F1024IM32-B,EFR32BG21A020F1024IM32-DR,EFR32BG21B020P1693IM32-BR,EFR32BG21B010F512IM32-BR,EFR32BG21A010F1024IM32-BR,EFR32MG21B020F512IM32-D,EFR32MG21A020PZ013IM32-B,EFR32BG21B020P1697IM32-BR,EFR32MG21B020F512IM32-B,EFR32BG21B020P1712IM32-BR,EFR32BG21B020P1697IM32-B,EFR32BG21B020P1712IM32-B,EFR32BG21B020F1024IM32-BR,EFR32BG21B020F512IM32-BR,EFR32BG21B020F512IM32-D,EFR32MG21B010F768IM32-D,EFR32MG21B010F1024IM32-B,EFR32MG21B020F1024IM32-B,EFR32MG21B010PZ045IM32-BR,EFR32MG21B010F1024IM32-D,EFR32BG21B020F512IM32-B,EFR32MG21B010F768IM32-B,EFR32MG21A010M1475IM32-BR,EFR32BG21,EFR32MG21A020PZ024IM32-BR,EFR32MG21B020F1024IM32-D,EFR32BG21A020F768IM32-DR,EFR32MG21A020F1024IM32-DR,EFR32BG21A010F768IM32-DR,EFR32MG21A020F768IM32-D,EFR32MG21A020F768IM32-B,EFR32MG21B010F512IM32-DR,EFR32MG21A020F768IM32-DR,EFR32MG21B020F512IM32-DR,EFR32MG21A010F768IM32-DR,EFR32MG21B010F768IM32-BR,EFR32BG21A010F1024IM32-DR,EFR32MG21A020F512IM32-B,EFR32MG21B020F768IM32-BR,EFR32BG21B010X1653IM32-BR,EFR32BG21B010F512IM32-DR,EFR32BG21B010F512IM32-B,EFR32BG21B010F512IM32-D,EFR32BG21B020F1024IM32-DR,EFR32MG21A010F768IM32-D,EFR32BG21B020F512IM32-DR,EFR32BG21B020P1689IM32-B,EFR32MG21A010F768IM32-B,EFR32MG21B020F1024IM32-BR,EFR32MG21B010PZ045IM32-B,EFR32MG21A010F768IM32-BR,EFR32MG21,EFR32MG21A020F768IM32-BR,EFR32MG21A010F512IM32-D,EFR32MG21A010F1024IM32-BR,EFR32BG21A020F512IM32-DR,EFR32BG21A010F512IM32-DR,EFR32BG21B010F768IM32-B,EFR32MG21A020F512IM32-D,EFR32BG21B010F768IM32-D,EFR32MG21A020F1024IM32-D,EFR32MG21A010F1024IM32-B,EFR32MG21A010F1024IM32-D,EFR32MG21A020F1024IM32-B

产品变更通知及停产信息  -  SILICON LABS  - May 01, 2024 PDF 英文 下载

RF-star Launches Bluetooth UART Protocol for CC2652P High-Power BLE Modules RF-BM-2652P2/P2I

RF-star has released its latest Bluetooth UART transparent transmission protocol for CC2652P-based BLE modules RF-BM-2652P2 and RF-BM-2652P2I. This new offering is set to revolutionize the landscape of high-power Bluetooth Low Energy (BLE) modules, by providing developers with robust, long-range wireless solutions tailored for multi-connectivity needs.

产品    发布时间 : 2024-07-30

CC2541 Bluetooth Low Energy SlaveModule and Protocol

型号- RF-BM-S01A,RF-BM-S02A,RF-BM-S02AI,RF-CC2541A1,CC2541

数据手册  -  信驰达  - Version: V2.32u  - Nov.18th, 2019 PDF 英文 下载 查看更多版本

RF-STAR Has Launched RF Modules Support Zigbee, BLE, Thread, and Other Multi-protocol Operations

RF-STAR Technology has launched RF modules,support Zigbee, BLE, Thread, and other multi-protocol operations to cope with various flexible application scenarios. It simplifies equipment and facilitates centralized management.

新产品    发布时间 : 2022-02-23

CC2340R5 Bluetooth 5.3 LE Modules Deliver Industrial-grade Performance, Ultra-low-power Consumption and Robust Connection

New CC2340R5 Bluetooth 5.3 Low Energy (BLE) modules are now in stock with four types - RF-BM-2340B1I, RF-BM-2340A2, RF-BM-2340A2I and RF-BM-2340C2.

产品    发布时间 : 2024-03-14

Series 2 FG23 SoCs

型号- FG23-DK2600B,EFR32FG23A,EFR32FG23A020F512GM48-B,EFR32FG23A010F256GM48-B,XG13,EFM32,FG23-RB4265B,EFR32FG23B010F128GM40-B,EFR32FG23A020F512GM40-B,EFR32FG23A010F256GM40-B,EFR32FG23A020F256GM48-B,EFR32FG23A011F512GM40-B,XG23-RB4204D,XG23-RB4210A,EFR32FG23,EFR32FG23A020F256GM40-B,EFR32FG23B020F128GM40-B,EFR32FG23B,EFR32,EFR32FG23X0XXFXXXIM40,FG23,EFR32XG13,XG23-PK4210A,EFR32FG23B010F512IM40-B,XG23-PK4204D,XG23,EFR32FG23A021F512GM40-B,EFR32FG23B010F512IM48-B,SI4463,EFR32FG23B020F512IM40-B,SI4467,EFR32FG23A010F512GM48-B,EFR32FG23B020F512IM48-B,SI4468,EFR32FG23A010F512GM40-B

数据手册  -  SILICON LABS  - 2021 PDF 英文 下载

201027915 EFR32MG22, BG22, FG22 Virtual Secure Element Firmware Update

型号- EFR32BG22C224F512IM32-CR,EFR32BG22C222F352GM32-C,EFR32FG22C121F256GM32-C,EFR32BG22C224F512GM40-CR,EFR32MG22C224F512GN32-C,EFR32BG22C224F512IM40-CR,EFR32BG22C224F512GM32-C,EFR32BG22C224F512IM32-C,EFR32BG22C224F512GN32-CR,EFR32FG22C121F256GM32-CR,EFR32MG22C224F512IM40-C,EFR32BG22C222F352GM40-CR,EFR32FG22C121F512GM40-C,EFR32BG22C222F352GN32-C,EFR32MG22C224F512GN32-CR,EFR32BG22C222F352GM32-CR,EFR32BG22C112F352GM32-CR,EFR32BG22C112,EFR32FG22,EFR32MG22C224F512IM32-CR,EFR32BG22,EFR32FG22C121F256GM40-CR,EFR32FG22C121F256GM40-C,EFR32MG22,EFR32FG22C121F512GM32-CR,EFR32BG22C222F352GM40-C,EFR32BG22C224F512IM40-C,EFR32MG22C224F512IM32-C,EFR32BG22C222F352GN32-CR,EFR32BG22C112F352GM32-C,EFR32MG22C224F512IM40-CR,EFR32BG22C224F512GM32-CR,EFR32BG22C224F512GM40-C,EFR32FG22C121F512GM40-CR,EFR32FG22C121F512GM32-C,EFR32BG22C224F512GN32-C

产品变更通知及停产信息  -  SILICON LABS  - 10/27/2020 PDF 英文 下载

Interfacing with LoRaWAN RM191 LoRa + BLE Module

型号- SX1272,RM1XX,RM186,EU863,RM191

应用笔记或设计指南  -  LAIRD  - v1.2  - 2017/12/14 PDF 英文 下载

展开更多

电子商城

查看更多

只看有货

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥8.1764

现货: 110,879

品牌:SILICON LABS

品类:Wireless SoC

价格:¥9.1982

现货: 88,300

品牌:SILICON LABS

品类:wireless SoCs

价格:¥17.1890

现货: 2,500

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥17.5602

现货: 2,250

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥14.1226

现货: 490

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥16.2591

现货: 479

品牌:SILICON LABS

品类:WIFI模块

价格:¥121.6203

现货: 30

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥55.6542

现货: 10

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥17.9315

现货: 3

品牌:SILICON LABS

品类:ZigBee SoCs

价格:

现货: 0

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

现货市场

查看更多

品牌:SKYWORKS

品类:Dual-Channel Analog Interface ProSLIC®

价格:¥18.6975

现货:240

品牌:SILICON LABS

品类:Switch Hall Effect Magnetic Position Sensor

价格:¥2.2924

现货:150,000

品牌:SILICON LABS

品类:Light Sensor

价格:¥20.3400

现货:28,003

品牌:SILICON LABS

品类:Position Sensor

价格:¥3.0897

现货:12,568

品牌:SILICON LABS

品类:8位MCU

价格:¥4.9000

现货:12,000

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥10.1700

现货:10,000

品牌:SILICON LABS

品类:Gecko MCU

价格:¥15.6000

现货:5,353

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥3.7900

现货:3,451

品牌:SILICON LABS

品类:Wireless SoC

价格:¥15.1400

现货:1,455

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥11.1200

现货:1,201

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

服务

查看更多

物联网天线方案设计/虚拟天线芯片方案设计

Ignion可支持多协议、宽频段的物联网天线方案设计,协议:Wi-Fi、Bluetooth、UWB、Lora、Zigbee、2G、3G、4G、5G、CBRS、GNSS、GSM、LTE-M、NB-IoT等,频段范围:400MHz~10600MHz。

最小起订量: 2500 提交需求>

蓝牙射频及通信协议测试

根据用户的蓝牙模块,使用Bluetooth 蓝牙测试装置MT8852B,测试蓝牙1.0至5.1,包括传输速率、功率、频率、调制和接收机灵敏度,生成测试报告。支持到场/视频直播测试,资深专家全程指导。

实验室地址: 深圳 提交需求>

世强和原厂的技术专家将在一个工作日内解答,帮助您快速完成研发及采购。
我要提问

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

研发客服
商务客服
服务热线

联系我们

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

投诉与建议

E-mail:claim@sekorm.com

商务合作

E-mail:contact@sekorm.com

收藏
收藏当前页面