New products: Heatspreader ＆ Mycro Direct Die for Intel CPUs

Today we are introducing two new products that are already available in our store and teasing a third. The Intel High Performance Heatspreader V1 offers a 207% larger surface area compared to the stock heatspreader, while the Intel Mycro Direct Die water cooler version 1 integrates beheaded Intel processors directly into the water cooling system.

INTEL HIGH PERFORMANCE HEATSPREADER V1: MORE VOLUME AND SURFACE AREA FOR BETTER TEMPERATURES

In internal tests*, the Intel High Performance Heatspreader V1 (HPHS) was able to convince with impressive results. An Intel Core i5-14600K was tested at a clock rate of 5.6 GHz and a core voltage of 1.4 volts (vCore) in Cinebench R23 in a custom loop with a Watercool MO-RA3, including four Noctua 200 mm fans. An Alphacool Core 1 was used as the water cooler. With the standard IHS and a contact frame, an average temperature of 92.1 degrees Celsius was measured. With the Intel High Performance Heatspreader V1, this average value was reduced by 14.8 °C to 77.3 degrees.

INTEL MYCRO DIRECT DIE V1: HIGH COOLING CAPACITY FOR HIGH PERFORMANCE

The combination of an Intel Mycro Direct-Die V1 (Mycro DD) and Conductonaut Extreme liquid metal clearly outperformed a normal water cooler in internal tests*. The comparison cooler used achieved an average temperature of 92.1 degrees Celsius at a pump speed of the Xylem Lowara D5 of approx. 3,400 revolutions per minute with a flow rate of 2.2 liters per minute.

The Intel Mycro Direct-Die V1 was able to achieve an average temperature of 74.9 degrees Celsius at the same pump speed, which is 17.2 °C lower than the comparison cooler. The flow rate, on the other hand, has increased to 2.6 liters per minute, as the microfin structure of the Intel Mycro Direct-Die V1 is optimized to offer less resistance.

Internal testing was carried out with an Intel Core i9-13900KS in a custom loop with a Watercool MO-RA3, including four 200 mm fans from Noctua. A Keyence FD-X was used as the flow sensor, which has the advantage of not generating any resistance in the water circuit itself.

LIQUID METAL FOR MAXIMUM PERFORMANCE

We recommend using liquid metal between the CPU die and Intel High Performance Heatspreader V1 or Intel Mycro Direct-Die V1. Thermal pads such as KryoSheet between the CPU die and the HPHS/Mycro DD did not meet our expectations in our test series, so we cannot recommend thermal pads because their additional thickness can strongly influence the contact pressure and thus impair the function. Thermal conductors such as thermal paste, thermal pads and liquid metal can be used between the HPHS and the cooler.

INTEL MYCRO DIRECT DIE PRO RGB V1: MAXIMUM PERFORMANCE THANKS TO OPTIMIZED COOLER STRUCTURE

The Intel Mycro Direct Die Pro RGB v1 is currently in production and will be available in a few weeks. In addition to the RGB lighting, the Pro version offers a revised coldplate for increased performance.

NOTICE OF LOSS OF MANUFACTURER'S WARRANTY

We would like to point out that delidding the processor will void the warranty. Depending on the manufacturer, removing the Integrated Loading Mechanism (ILM) on the mainboard may also invalidate the warranty.

*It should be noted that the temperature improvements achieved depend on several factors. In addition to the quality of the individual processors (“Silicon Lottery”), test results are also influenced by the room temperature and the cooling system used. With a custom water cooling system, for example, the cooling performance depends on factors such as the pump speed and the fans and radiators used. The specified values are guide values that may be higher or lower in individual cases.