COMPUTEX 2024 Preview | Longsys will Showcase A Series of High-capacity SSD Products under the Theme “Embracing the Era of High-Capacity SSDs“
During the COMPUTEX 2024 exhibition from June 4th to 7th, Mnemonic Electronic Co., Ltd. (hereinafter referred to as Mnemonic), Longsys's Taiwan subsidiary, will showcase a series of high-capacity SSD products under the theme "Embracing the Era of high-capacity SSDs," providing solutions for global users of high-capacity SSD products.
The lineup of high-capacity products presented by Mnemonic includes the ORCA 4836 series enterprise NVMe SSDs and the UNCIA 3836 series enterprise SATA SSDs. These products are equipped with the latest enterprise-grade 128-layer TLC NAND flash memory, offering high performance, low latency, adjustable power consumption, and high reliability storage solutions for enterprise-grade users such as servers, cloud computing, and edge computing, with a maximum capacity of up to 7.68TB.
In addition to SSDs, high-stability enterprise-grade memory products such as 96GB DDR5 RDIMM and 192GB CXL 2.0 memory expansion modules will also be featured. These products support memory pooling and sharing to meet the growing data processing demands.
Addressing industry applications, Mnemonic is also introducing high-performance industry-grade memory products suitable for AI PCs and HPC, including 4TB/8TB PCIe Gen 4*4 M.2 2280 SSDs, 4TB XP2300 PCIe Gen4 SSDs, 2TB XP2200 PCIe Gen4 BGA SSDs, providing high-performance PC and laptop customers with a wider range of memory options.
Furthermore, the products showcased at this exhibition also include the Mnemonic MS90 8TB SATA SSD, FORESEE 512GB QLC eMMC, LPCAMM2, CXL 2.0 AIC memory expansion modules, among others.
The Mnemonic MS90 8TB SATA SSD supports speeds of up to 6Gb/s (Gen3) via the SATA interface, with backward compatibility to Gen1 and Gen2. It also supports various low-power consumption modes, making it suitable for applications such as near-line HDD replacement, monitoring, and high-speed rail systems.
The 512GB QLC eMMC adopts advanced processes with higher density and is equipped with Longsys's in-house WM6000 controller chip. Packaged in Longforce Suzhou, it can be applied in mainstream consumer smart devices like smartphones.
The new form of memory, LPCAMM2, integrates the latest LPDDR5/5x chips, potentially bridging the gap between mobile DRAM and PC applications. It unlocks new design possibilities for applications demanding high frequency, low power consumption, and compact packaging, catering to AI terminals, commercial equipment, and ultra-thin notebooks.
The CXL 2.0 AIC memory expansion module is packaged in a full-height and full-length PCIe Add-in Card (AIC) with 8 DDR4 RDIMM slots. Memory capacity can be expanded up to 512GB, supporting direct-plug memory pooling for multiple compute node server clusters and storage pool cable direct connections.
Mnemonic foresees the increasing demand for massive computational power in the AI era, prompting a significant focus on memory capacity. Hence, the low-power, high-capacity, and efficient cooling storage products are meticulously designed to seamlessly integrate into various application scenarios, notably in servers and AI terminals.
To create a high-quality communication environment and enhance visitor experience, Mnemonic will host a meet-and-greet session at the booth. The booth is located at Room 535, 5th Floor, Building 1, Nangang Exhibition Center, No. 32, Section 1, Nangang Road, Taipei City. We invite industry peers to explore Mnemonic’s cutting-edge product lineup and witness real-world application scenarios. We look forward to exploring the future of storage with you at the exhibition and embracing the era of high-capacity SSDs.
[Event Address] Room 535, 5th Floor, Building 1, Nangang Exhibition Center, No. 32, Section 1, Nangang Road, Taipei City
[Event Time] June 4th to June 7th, 9:00-18:00
- |
- +1 赞 0
- 收藏
- 评论 0
本文由sr转载自FORESEE News，原文标题为:COMPUTEX 2024 Preview | Embracing the Era of High-Capacity SSDs，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
相关研发服务和供应服务
相关推荐
江波龙自研eMMC主控芯片荣获 “中国芯”优秀技术创新产品奖
2024年11月7日，由中国电子信息产业发展研究院主办的2024年第十九届“中国芯”优秀产品评选结果揭晓，江波龙自研WM6000系列eMMC主控芯片凭借其先进工艺和优秀性能，在142款产品中脱颖而出，赢得了业界权威机构和专家的认可，再度荣获“中国芯”优秀技术创新产品奖。
轻薄实力！FORESEE XP2200 PCIe BGA SSD荣获2023年“中国芯”优秀技术创新产品奖
FORESEE XP2200 PCIe BGA SSD于今年5月发布，产品通过FC、WB、MUF、SDBG等行业先进的封测工艺，将NAND Flash、控制器和电子元器件高度集成，在确保产品性能的基础上，根据不同的堆叠层数，最大限度地实现轻薄化。
FORESEE直面车用环境挑战，提供工业级SSD和工业级DDR4内存模组等，打造优质车规级存储
如今，江波龙电子的汽车存储eMMC、UFS、工业级SSD、工业级DDR4 内存模组、工业级存储卡、汽车个人云存储、车载数据备份盘以及技术定制产品已在车用存储市场崭露头角。
FORESEE工业存储产品选型指南
目录- eMMC NAND Flash nMCP DDR3L SSD DDR4 DIMM Company Profile
型号- FS33ND04GS108TFI0,FISKRM032G-B2A43,FISQRM128G-B2A43,FEMDRW008G-88A43,FI4V26W008GSD5,F60C1A0004-M6AR,FISPRM128G-B2A43,FEMDMW008G-88A37,F35SQA512M-WWT,FEMDMW008G-88A39,FISKRW008G-B2A53,FISHRM001T-G8A56,FI4V26M008GSC3,FISPRM001T-G8A56,FSEIASLD-64G,F35SQA002G-WWT,FSEIASLD-32G,FEMDRW128G-88A19,FI4S26W016GSD5,FEMDRW032G-88A19,F35SQA001G-WWT,FI4S26W008GSD5,FEMDMW032G-88A19,FISQRM032G-B2A53,F70ME0101-RDWA,FEMDRW008G-88A39,FSNS8A002G-TWT,FEMDME004G-A8A39,FSNS8A001G-TWT,FS33ND04GS108BFI0,FISKRW032G-B2A43,FEMDMW016G-88A43,FI4S26M016GSC3,FISQRM064G-B2A43,FISHRW256G-G8A56,FEMDME008G-A8A39,FEMDME016G-A8A58,FISKRM008G-B2A53,FEMDME008G-A8A43,FEMDME032G-A8A58,FISPRM064G-B2A43,FI4V26W016GSD5,F35UQA002G-WWT,FS704B2R1CH6A2KAM,FISPRW064G-B2A43,FSNU8A002G-TWT,FEMDMW064G-88A19,FISQRW064G-B2A43,F70ME0101D-RDWA,FISKRW032G-B2A53,FISPRW256G-G8A56,FEMDME064G-A8A58,F35UQA001G-WWT,FEMDMW016G-88A37,F60C1A0004-M79W,F60C1A0004-M79R,FISKRM064G-B2A43,FISKRW016G-B2A53,FEMDRM016G-58A43,FISQRW032G-B2A53,FISKRW064G-B2A43,FSNU8A001G-TWT,FISHRM064G-B2A43,FISHRM256G-G8A56,FISHRW064G-B2A43,FISPRM512G-G8A56,FISKRM032G-B2A53,FS35ND04G-S2Y2QWFI000,FISPRW128G-B2A43,FISQRW128G-B2A43,FI4S26M008GSC3,FISHRW001T-G8A56,FISKRM016G-B2A53,FISPRW512G-G8A56,FS33ND01GS108BFI0,FISQRM016G-B2A53,FISQRW032G-B2A43,FEMDME016G-A8A43,FISHRW128G-B2A43,F60C1A0002-M69W,FSEIASLD-128G,FISKRM128G-B2A43,FISQRM032G-B2A43,FISHRM128G-B2A43,FISPRW001T-G8A56,FEMDRM008G-58A39,FISQRW016G-B2A53,FISHRW512G-G8A56,FISKRW128G-B2A43,F60C1A0002-M6AR,FISPRM256G-G8A56,FEMDRW016G-88A43,F35UQA512M-WWT,FISHRM512G-G8A56,FEMDRW064G-88A19
【应用】国产工业级宽温EMMC FEMDRW008G-88A39用于风电变流器，传输速度可达HS400
FORESEE的工业宽温级EMMC FEMDRW008G-88A39，可以提供较高的数据传输速率，以满足风电变流器对于数据处理和存储的高要求。在严苛工作环境下可保证设备全天候长期工作。
FEMDNN128G-A3V01 FEMDNN256G-A3V01FORESEEeMMC规格书
描述- 本资料为LONGSYS公司生产的eMMC存储解决方案的详细数据手册。资料详细介绍了FEMDNNxxxG-A3V01型号eMMC的特性、规格、技术细节和应用。资料涵盖了产品概述、规格参数、技术说明、接口时序、分区管理、现场固件更新等内容。
型号- FEMDNN128G-A3V01,FEMDNNXXXG-A3V01,FEMDNNXXXG-XXXXX,FEMDNN256G-A3V01
SMART（世迈科技）DuraFlash™闪存产品选型指南
目录- Company Portfolio/Products Applications Flash Storage Product Introduction 2.5” SATA M.2 SATA mSATA Slim SATA M.2 PCIe NVMe U.2 PCIe NVMe EDSFF / U.2 PCIe NVMe (Enterprise and Data Center SSDs) BGA eMMC 5.1 Memory Cards CF Cards/CFast Cards eUSB Flash Drives/USB Flash Drives RUGGED SSD LINE-UP
型号- N200,R800,RU350,SP2800,S5E,RU150,T5E,M4,R800V,BGAE440,S1800,BGAE240,RD130M,ME2,M1HC,H9 CF,M1400,HU250E,M4P,T5EN,T5PFL,RU150E,N200V,T5PF,RD230M,MDC7000,XL+,RD230
【应用】国产64G车规级EMMC FEMDME064G-A8A58用于车载CMS，传输速度高达HS400
在车载CMS中，由于图像处理时，需要存储部分图像，所以需要有EMMC存储，一般选择128G/64G大小，本文介绍江波龙车规级EMMC，FEMDME064G-A8A58，容量体积64G，宽压输入1.8/3.3V；传输速率HS4004。
【应用】国产江波龙车规EMMC FEMDMW032G助力汽车网关设计，容量最大达64GB
在汽车的网关设计中，需要大容量的存储设备来存储数据，同时对封装要求比较高，单纯的NAND FLASH，体积大，而且接口和时序不标准，不同场景不能通用。本文将介绍国产江波龙车规级EMMC在汽车网关中的应用优势。
UNCIA 3836系列企业级SATA固态硬盘
描述- UNCIA 3836系列企业级SATA SSD支持SATA3.2接口，提供高达3.84TB的容量和560MB/s的顺序读取速度。该系列SSD具备多种高级功能，包括增强的电源保护、端到端数据保护和固件升级等，适用于互联网、云计算、金融等行业。产品具有出色的性能、可靠的数据存储和低功耗特点，适用于服务器、分布式存储、边缘计算和工作站等多种应用场景。
型号- UNCIA 3836,UNCIA 3836 SERIES
FEMDRW016G-88A43 FORESE®工业级eMMC规格书
描述- 本资料为LONGSYS生产的工业级eMMC存储解决方案的技术文档。介绍了产品的基本功能、技术规格、接口时序模式、系统架构、分区管理、电源消耗等技术细节。
型号- FEMDRW016G-88A43
Orca 4836系列企业级NVMe固态硬盘
描述- ORCA 4836系列企业级NVMe SSD采用PCIe Gen4 U.2接口，支持NVMe 1.4，提供高达7.68TB的容量和高达1000K IOPS的随机读取性能。该系列SSD具备多种高级功能，包括NVMe MI 1.1、安全启动与下载、增强的断电保护等，适用于互联网、云计算、金融等行业。产品特点包括高性能、低延迟、高可靠性和灵活的电源调整。主要应用领域包括云计算、服务器、分布式存储、边缘计算和工作站。
型号- ORCA 4836,ORCA 4836 SERIES,ORCA 4836 MAX,ORCA 4836 PRO
电子商城
现货市场
服务
深圳市启威测实验室，面向所有企业提供信号完整性测试服务，主要包括USB、HDMI 、DP、MIPI、PCIe 、SD/EMMC、DDR接口信号测试。测试手段有波形测试、眼图测试、抖动测试等。
提交需求>
可烧录MCU/MPU，EPROM,EEPROM,FLASH,Nand Flash, PLD/CPLD,SD Card,TF Card, CF Card,eMMC Card,eMMC,MoviNand, OneNand等各类型IC,IC封装：DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN.
最小起订量： 1 提交需求>
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
我要提问
登录 | 立即注册
提交评论