FORESEE LPCAMM2 Helps AI to Land, Leading a New Trend of High-Performance Memory
In today's rapidly advancing era of technology, high-performance computing and artificial intelligence (AI) have become key drivers of progress across various industries. Recently at CFMS2024, Longsys showcased a new form of memory, the FORESEE LPCAMM2. This innovative technology is poised to bridge the gap between mobile DRAM and PC applications, opening up new design possibilities for AI terminals, commercial devices, ultra-thin notebooks, and other applications that demand high frequency, low power consumption, and compact packaging. With deep validation and collaboration with major customers and ecosystem partners, LPCAMM2 will gradually gain prominence in the market, offering tremendous market potential and business opportunities for the industry.
FORESEE LPCAMM2 features the latest LPDDR5/5x chips, is compatible with 315-ball and 496-ball designs, and supports frequencies of up to 7500MT/s – and ultimately beyond – providing users with unprecedented performance. Offered in multiple capacity options of 16GB, 32GB, and 64GB, the product meets a range of diverse memory needs across different scenarios.
In terms of product technology, FORESEE LPCAMM2 adopts a brand-new design architecture, cleverly integrating 4x32 LPDDR5/5x memory chips directly onto a compressed connector, achieving a 128-bit memory bus on a single memory module. This cutting-edge design delivers a more efficient packaging process than standard memory modules. Moreover, with a 10-layer PCB design, in-house PCB optimization for signal integrity (SI) and power integrity (PI), and adherence to JEDEC JESD318 standards, it ensures high performance and stability.
New form factor, better performance
With innovative product design and advanced technology, the FORESEE LPCAMM2 achieves speeds of 7500MT/s and above, surpassing the performance of DDR5 SODIMM at 5600MT/s by more than 33%, thus breaking through traditional memory speed bottlenecks. In the future, through collaborative efforts with GPU, FPGA, and other accelerator cards, LPCAMM2 will deliver faster data transmission speeds and higher bandwidth, accelerating the training and inference processes of AI models, which will in turn facilitate the widespread adoption and innovation of AI technology among content creators.
A single LPCAMM2 replaces two SODIMMs, saving more space
As micro-PC and ultra-thin notebook technologies continue to advance, the demand for small-sized memory is increasing. Compared to conventional SODIMM form factors, the compact form of FORESEE LPCAMM2 (78 × 34 × 1.2mm) can save more than 60% of device space. The smaller embedded volume and dual-channel structure allow the use of a single LPCAMM2 instead of two SODIMMs, making device expansion, maintenance, and upgrades much easier. This provides end customers with greater flexibility in component configurations, and the saved space can be utilized for supplementing and enhancing other components such as SSDs, GPUs, batteries, etc. This helps customers manufacture lighter, thinner, longer-lasting, and higher-performing devices, and prepares and empowers them for the high-capacity, high-computing-power AI era.
Increased productivity with lower power consumption
In addition to the innovative memory form factor, FORESEE LPCAMM2 has been optimized for reduced power consumption. Equipped with power management integrated circuits (PMICs) and voltage regulation circuits, this product offers nearly 50% reduced power consumption and a nearly 70% increase in energy efficiency, compared to SODIMM. This highly efficient, low-power memory solution ensures that application devices do not consume excessive power during intensive tasks, enhancing the user experience of high-end PCs, laptops, and workstations. Future products are also expected to expand into AI, server, and other fields, which are crucial for building high-density computing environments and green data centers. It also provides significant opportunities for the sustainable development of green, low-carbon semiconductor storage.
Comprehensive and rigorous testing
FORESEE LPCAMM2 has successfully passed initial rigorous testing including SPD, hardware, functionality, burning, powercycle, performance, temperature, and compatibility, with outstanding results in all areas. Currently, Longsys is actively engaged in joint validation with multiple partners, tackling challenging issues in early product applications, with the goal to provide users with a more stable and efficient product experience.
As AI technology becomes more widespread and application scenarios continue to expand, high-performance, low-power memory solutions will become a more urgent market demand. With its unique product advantages, FORESEE LPCAMM2 demonstrates vast potential and prospects. It will not only play a crucial role in applications like PC design but also penetrate further into high-end computing fields such as AI and servers, providing robust support for building efficient, green, and sustainable computing environments. In the future, Longsys looks forward to collaborating with more partners to explore the possibilities of storage innovation and applications.
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FORESEE存储产品有内存模块、固态硬盘、闪存、eMMC等。工规MSATA SSD,工规 SATA M.2 2242 SSD,工规 SATA M.2 2280 SSD,商规DDR3L,用于工业电脑,轨道交通,工业设备,电力设备,服务器,POS机,医疗设备等。工规PPI SLC NAND FLASH,工规NMCP,工规PPI SLC NAND FLASH,工规SPI SLC NAND FLASH,用于电视,机顶盒,网通,IPC,行车记录仪,智能手环等。车规II EMMC,车规III EMMC,应用于车载前装,智能仪表,IVI,ADAS,域控,BMS,记录仪。工规EMMC,用于耐用性消费类电子,车载后装,商显,TV,黑白家电等。工业宽温EMMC,用于工业控制,通讯基站,智能电网,车载前装。
产品型号
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品类
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Density(Mb、Gb、GB、TB)
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Speed(MT/s、Gbps、MHz)
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Voltage (V)
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Memory
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Temp. Range (℃)
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Bus
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Interface
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Package
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Size (mm)
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FI4S26M016GSC3
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DDR4 DIMM
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16GB
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2666MT/s
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1.2V
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DDR4
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0℃ to 85℃
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64bits
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260pin
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SODIMM
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69.6 x 30mm
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