Vincotech at PCIM – Empowering Your Ideas

2024-06-18 VINCOTECH Official Website
SiC power module,power module,low inductive modules,Industrial Power Module SiC power module,power module,low inductive modules,Industrial Power Module SiC power module,power module,low inductive modules,Industrial Power Module SiC power module,power module,low inductive modules,Industrial Power Module

VINCOTECH, a supplier of module-based solutions for power electronics, returned to PCIM, the world's leading power electronics expo and conference to showcase its latest technologies and innovations, including GaN and many more products for Motion Control, Renewable and Power Supply use cases. In keeping with this year’s expo slogan “Empowering your ideas,” the company’s application-specific capabilities were on prominent display.


The highly anticipated PCIM Europe event drew thousands of visitors, and Vincotech was thrilled to be back. “Our fair booth featured all kinds of new tech, and we couldn’t wait to show customers and prospects how our solutions benefited their business. Hot topics, innovations, donations – expect all that and more,” said Edoardo Guiotto, VP Sales and Marketing.


This year's big talking point was the company’s commitment to application-specific solutions enabled by a wide range of industry standard and proprietary housings, multi-source chipsets, expedited time-to-market, and early sample availability. Highlights included a solution for SEW-EURODRIVE, showcased with a station displayed at the booth.


One spotlight was on GaN, a cutting-edge technology that had the industry abuzz. Vincotech, which was driving advances on this front, demonstrated the potential, benefits, and applications of GaN in power modules.


Innovations in motor control applications also figured prominently. Reliability and performance packed into a small footprint – that’s what sophisticated motor control use cases needed. Highly integrated and engineered to support complex electrical and thermal designs, Vincotech’s embedded drive solutions met these demands. For Industrial drives the tandem diode solutions were available for SixPack, Twin SixPack and PIM topologies including custom and industry standard power module housings.


Renewables were on the rise. Built on decades of experience in solar, Vincotech’s extensive portfolio of PV & ESS solutions was second to none. Residential, industrial, commercial – every use case and power range was well-covered.


Leading the way in power supply, Vincotech offered outstanding power module solutions. Highlights in DC fast charging included a built-to-boost 3-phase resonant converter, the fastPACK 1 GaN 2-in-1 featuring advanced Wide Bandgap (WBG) tech, and many ultra-compact, integrated solutions and low inductive modules. Enhancing the performance of Uninterruptible Power Supplies (UPS), Vincotech had a wide range of solutions from 20 kW – 250 kW power.


Like in previous years, Vincotech teamed up with Plan International Germany, bringing an exciting VR experience to the event. Visitors could challenge themselves by flying over the mountains in virtual reality, while knowing their participation supported a greater good. Vincotech matched all flights with a donation, targeting a Plan International project for teenagers in Ecuador.


Vincotech’s PCIM presentations at a glance:

Tuesday, June 11
11:15 Exhibitor forum
David Chilachava: NEW fastPACK 1 GaN – The Best Utilization of GaN Technology Benefits in an Industrial Power Module Package

Wednesday, June 12
11:20 Bodo's panel discussion on "SiC Wide Bandgap Design, the Future of Power")
Evangelos Theodossiu: SiC power module design: Why does it matter?
14:30 Conference, Room: München 2
A joint presentation with Siemens: Optimizing a Power Module for Electrical and Thermal Performance and Symmetry Using EDA Tools

Thursday June 13
11:15 Conference poster sessions
Tiago Jappe: Power Module Solutions with Improved Reliability for Elevator Drive Applications
14:35 Exhibitor forum
Matthias Tauer: flow E3 Full SiC Power Module with Direct Pressed Substrate for Superior Thermal Performance and Reliability


授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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目录- Introduction of Vincotech    Product Overview    RECTIFIER    SIXPACK    SIXPACK+RECTIFIER    SEVENPACK    PIM (CIB)    PIM+PFC (CIP)    IPM    HALF-BRIDG    H-BRIDG    SINGLE-PHASE-INVERTER    H6.5    BOOSTER    BUCK-BOOSTER    PFC    Three-Level NPC (I-Type)    Three-Level MNPC (T-Type)    Three-Level ANPC    Schematics/Housings    Naming System   

型号- 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