Smiths Interconnect New TSX Wire Bondable Fixed Chip Attenuator Series for Space and Defense Markets
Offers excellent performance and power from DC-50 GHz in a small 0404 package size qualified to MIL-PRF-55342
Smiths Interconnect has extended its offering of high frequency surface mount chip attenuators with the release of its new TSX Wire Bondable Fixed Chip Attenuator Series, a small, easy-to-implement, high-reliability product qualified for space and defence applications. The new TSX WB2 Series is qualified to MIL-PRF-55342 and designed to offer excellent broadband performance up to 50-GHz, while delivering increased power handling in a small 0404 wire bondable package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges. This allows the customer to use a single chip in multiple applications, reducing the Bill of Material (BOM) item count and consequently, the cost of ownership. The new TSX WB2 series can be ordered in group A, B or C testing based on MIL-PRF-55342. Qualification data is included with product delivery for program assurance.
“The TSX Wire Bondable series is a cost-effective wire bondable attenuator solution”, said Tullio Panerello, Vice President and General Manager of the Fibre Optics and RF Components Business Unit at Smiths Interconnect. "It provides another chip attenuator option with excellent attenuation performance, compact in size and provides MIL spec test data for program assurance”.
The chip attenuator designed for mission critical applications, offers 1 to 3 watts of power handling performance and multiple attenuation values. The use of a robust, proven all thin film process technology on an alumina nitride substrate provides a product suitable for harsh environments, such as those of Space and Defence applications.
Smiths Interconnect’s TSX WB2 Series is a compact qualified unique solution reducing the bill of material and offers the following features:
●Small form factor - Reduces overall footprint
●Space Qualified – Per MIL-PRF-55342
●Wire Bondable – Ideal for chip and wire applications
●Broad frequency range – Reduces BOM count
●Low VSWR – Increases transmitted power
●Wide range of attenuation values – 1-10, 15, 20 and 30dB
●Tight attenuation tolerance – For optimal performance
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本文由莫子若转载自Smiths Interconnect Official Website，原文标题为:New TSX Wire Bondable Fixed Chip Attenuator series for Space and Defense Markets，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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型号- 82 7013TC,32 1209,83 7017TC,33 1052,HPR2F,D3PP20F,CR0402D,33 1050,DS15D10,42WXX.00F,SMT2010TALN,32 1200,82 3003TC,32 1201,81 7042,32P7201F,31 7021,81 3012B,KTVA SERIES,HE298MF,12-0101,12-0102,13-125-T,82 7001TC,81 7021TC,83 7006TC,33 1041,4113P,33 1042,QTVA,8485 SERIES,82 3038TC,32 1212,SMT2010*A,42UW SERIES,32 1213,81 3001B,81 3001A,81 3033TC,42TVA,CR1010D50,5W2,SXUXXXX3F,DS15D20,SMT3737*ALN,CA0505D T,4112P,42KA,P2D50J,DN05W20F,811,812,49XX,83 1001TC,4111P,SD055-055-4-A,82 7025TC,SD055-055-4-B,SD065-035-3-B,5654 XXX,5,TS0710S,82 3039TC,CR1010D50,5TB,81 7031,32 1111,32 1117,81 3011B,81 3011A,5308 XXX,5,81 7028,31 7008,31 7006,5660 XXX,5,32-7172F,823,827,82 7002TC,HPP2F,HN05W03F,HRM,32 1002,32 1123,32 1121,HRT,SD130-105-4-040,83 3005TC,32 1001,32 1122,D3PPXXF,32 1006,32 1007,32 1004,82 7166TC,82 3001TC,32 1005,81 3001TC,CT3725,33 1009,33 1005,33 1006,33 1003,12-250-T,CA0505DXXFT,33 1004,SMT2010*ALN,CT2335TALN,4110J,33 1001,33 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可贴PCB板厚范围：0.6~2.0mm，也支持生产软硬接合板，拼板长宽：50*50mm~550*500mm，PCBA快速贴片支持01005CHIP元件。
最小起订量： 1片 提交需求>
可贴片PCB尺寸50*50mm-580*610mm；PCB厚度0.3-8mm；贴装精度CHIP元件+0.03,BGA Pitch 大于0.25mm；元件尺寸0201-74*74BGA；元件高度：30mm。
最小起订量： 1 提交需求>
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