Understanding the Open Architecture of AI Hardware: OAI ＆ OAM

时间： 2024-06-22 来源：Nextron Official Website

技术问答

选型帮助

研发客服

商务客服

In the AI domain, the Open Accelerator Infrastructure (OAI) is a sub-organization established by one of the world's most influential open hardware organizations: the Open Compute Project (OCP). Since 2019, OAI has focused on defining AI accelerator card form factors suitable for large-scale deep learning training, addressing the issue of diverse AI accelerator card forms and interface incompatibility. By releasing the OAI-UBB (Universal Base Board) 1.0 design specification, OAI has promoted the standardization of AI acceleration hardware platforms, enabling support for products from different manufacturers without modification, significantly enhancing the scalability and flexibility of AI modules.

The Architecture Adopted by AI Giants - OAM (Open Accelerator Module)

For AI server developers, the Open Accelerator Module (OAM) brings significant benefits. Due to the diversity and specialization of AI accelerator chips, developers face higher development costs and longer development cycles. The emergence of OAM provides these developers with an efficient and scalable solution, making it easier to integrate new AI accelerators. This not only lowers the entry barrier but also accelerates the time-to-market for products.

Advantages and Challenges of OAM

OAM has three notable advantages, making it particularly important in today's rapidly developing AI market:

High Performance and Efficiency: OAM can significantly improve processing performance and efficiency, particularly for high-computing-demand applications such as deep learning and machine learning.

Scalability: OAM's design allows for flexible compatibility and scalability between different systems and baseboards, adapting to the advancing high-computing-load and technological developments.

Support for Diverse Application Scenarios: OAM is applicable to various fields, including AI inference, scientific simulations, and data analysis, enabling it to meet a wide range of business needs.

These advantages demonstrate OAM's potential and flexibility in modern data centers and high-performance computing environments.

However, adopting OAM also comes with several challenges:

Technical and Design Complexity: Current specialized AI hardware systems are technically and design-wise complex, often requiring 6 to 12 months to integrate new AI accelerators into the system, thus hindering the rapid adoption of new competitive technologies.

High Power Consumption Management: With OAM product design power exceeding 600W, the Base Specification already recommends the use of liquid cooling technology, indicating that managing high power consumption is a significant challenge, especially as future power may easily exceed 700W.

Standardization and Compatibility: The rapid evolution and diversity of AI accelerators demand higher standards for standardization and compatibility to support the scalability and high-speed communication links between various hardware acceleration solutions.

What Can NEXTRON Do for OAM Designers?

NEXTRON is one of the few market solution providers with expertise in high-speed transmission, structural design, and cooling modules. It has already provided high-speed I/O and OAM-related products to several leading AI chip designers. For OAM design, NEXTRON has identified two common challenges:

Structural Design for Cooling: Top Stiffener with Thermal Solution The Top Stiffener, though minimally covered in the Base Specification, requires good structural design to complement the OAM design; otherwise, it directly impacts cooling efficiency. A good Top Stiffener design includes solid support and thermal conduction, enabling air-cooling solutions like 3U or 4U height 3D VC to function effectively. Facing next-generation solutions with over 600W TDP, integration with a cold plate liquid cooling is also necessary. This tests the manufacturer's structural design, material selection, and understanding of cooling technology.

Challenges in Processing: OAM Bottom Stiffener Poor connection between OAM and UBB is a common issue in practice, often due to neglecting the OAM Bottom Stiffener. OAM generally uses the Mirror Mezz Pro Connector, and the Base Specification mentions that tolerances must be maintained at ±0.15mm. However, due to differences in assembly and processing capabilities, a poorly made Bottom Stiffener can lead to excessive final assembly tolerances or uneven ends, resulting in poor connections.

Conclusion

AI-related technologies have developed rapidly in recent years, bringing cross-disciplinary challenges. As NEXTRON collaborates with AI leaders to overcome various difficulties, it deeply realizes that every small detail is crucial for achieving impressive AI performance. NEXTRON hopes that the accumulated experiences and capabilities can help more AI product developers solve problems, making this civilization-changing technology more accessible to everyone.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由雪飘梦飞转载自Nextron Official Website，原文标题为:Understanding the Open Architecture of AI Hardware: OAI & OAM，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

Nextron’s Next Generation QSFP112 cage/connector system and Heat Dissipation Strategies

In this article we discuss 3 most popular types of thermal management, air cooling methods, liquid cooling systems, thermal conductive material and additions. Then Nextron tells the heat dissipation solutions based on QSFP112.

技术探讨发布时间 : 2022-09-02

探讨SD NAND/TF卡在AI领域的优势

在当今快速发展的科技时代，人工智能（AI）已经成为推动各行各业变革的重要力量。AI技术的进步不仅依赖于算法和模型的创新，更离不开底层硬件技术的支持。SD NAND技术作为一种高效、可靠的数据存储解决方案，在AI领域的应用日益广泛。

技术探讨发布时间 : 2024-08-22

认识AI硬体的开放架构

在AI领域，开放加速器基础设施（OAI）是由全球最具影响力的开源硬体组织之一：开放计算项目（OCP）所设立的一个子组织。自2019年起，OAI专注于定义适合大规模深度学习训练的AI加速卡形态，解决了多元AI加速卡形态和接口不统一的问题。

技术探讨发布时间 : 2024-05-22

研讨会2024高算力SOC/MCU新技术研讨会

描述- 9月26日直播，带来SOC，DSP，MCU，AFE，IMU等高算力及周边产品，分享在机器人，多模态感知，AI，低空无人机，自动驾驶，视觉惯性里程计，微型逆变器，光伏储能，智慧医疗，数字健康，光模块等领域应用，点击了解报名

活动发布时间 : 2024-07-04

正凌精密（Nextron）致力于高速连接器、圆形连接器和嵌入式系统方案及零组件的制造。其连接器可将PCB安装连接器提供给面向任务的计算系统标准，包括ATCA，MicroTCA，CompactPCI等，在医疗领域能提供塑料，金属甚至防水IP 68连接器功能的医疗级推拉自锁连接器。公司在汽车领域则拥有可应用于车内网络电缆、连接器、媒体模块、交换机和具有安全、稳定和数据传输等，具有极高要求的产品。

插拔自锁连接器线缆组件印刷电路板连接器光电连接器

授权代理商 - 世强控股有限公司线上商城技术资料

展开

AI语音芯片WT2605C赋予玩具语音对话的能力开发简单10分钟轻松对接AI大模型

AI语音芯片WT2605C在对话玩具上的应用方案，通过接入AI对话大模型，为玩具赋予了智能对话的能力，极大地提升了玩具的互动性和教育价值。随着技术的不断进步和应用的不断拓展，智能对话玩具将在未来发挥更加重要的作用，为孩子们的成长带来更多的乐趣和收获。

产品发布时间 : 2024-09-12

【产品】AI全生命周期开发平台“天工开物”，提供丰富的算法资源、灵活高效的开发工具和简单易用的开发框架

基于地平线自研AI芯片打造的“天工开物™” AI全生命周期开发平台，包括模型仓库、AI芯片工具链和AI应用开发中间件三大功能模块，为地平线芯片合作伙伴提供丰富的算法资源、灵活高效的开发工具和简单易用的开发框架。

新产品发布时间 : 2021-01-10

正凌连接器选型表

正凌连接器以下参数选型，工作温度：-55℃~+125℃；湿气敏感性等级：2a；安规/环境规范(Certification/Environmental specifications)：ROHS；应用等级(Application Level)：E级

产品型号	品类	安规/环境规范(Certification/Environmental specifications)	工作温度范围（°C）	应用等级(Application Level)	湿气敏感性等级
NX5ABBB70X01AA	连接器	ROHS	-55°C to 125°C	E级	2a

选型表 - 正凌立即选型

【产品】正凌提供400G高速连接与散热解决方案QSFP112，每条通道皆可支援112Gb/s

大型数据中心对资料传输速度的要求不断提升，正凌推出QSFP模组QSFP112，每条通道皆可支援112Gb/s并可向后兼容QSFP56及QSFP28；在不重建网路结构的前提下，该产品是升级频宽最具成本效益的方式，也是迈向800G通讯的垫脚石。

产品发布时间 : 2022-08-31

【选型】正凌（Nextron）应用于新能源汽车的连接器选型指南

目录- 核心技术/应用/案例板对线系列板对线&板对板系列&非防水系列板对线防水系列 & Power Element系列

型号- Z-C02C018510020,Z-C02FH0010****,Z-C09B501110361,Z-C10BA01110061,C11系列,Z-C08B001110091,Z-C10BE01110101,Z-C08B401110251,Z-C08B001110041,SBC系列,C08系列,Z-C12BC01110161,Z-C12B001110091,Z-C11B201110081,Z-C10B401110101,Z-C08B201110161,Z-C09B001110091,Z-C10BB01110081,Z-C09B201110091,Z-C08B501110361,Z-C09B401110251,Z-C08B301110161,Z-C02FC0*0**001,Z-C03M****00***,SIC系列,C11 SERIES,Z-C10B201110081,C08 SERIES,Z-C11B401110101,Z-C12B101110161,STC系列,Z-C02M0***00***,Z-C09B101110161,Z-C10B*0**1***1,Z-C11BA01110061,Z-C12BA01110091,Z-C12B401110251,Z-C11B501110121,Z-C11BB01110081,807系列,2.2MM,Z-C09B201110161,Z-C04M0********,C10系列,Z-C06FH00*00***,Z-C10B301110101,Z-C10BD01110101,Z-C12B*0**1***1,Z-C07FT0*0**001,Z-C08B*0**1***1,Z-C12BD01110251,Z-C02C009030020,Z-C11BF01110121,Z-C11B101110081,Z-C11BE01110101,Z-C12BB01110161,Z-C07M0********,Z-C09B601110361,Z-C06M0***00***,Z-C03FC0*0**001,Z-C09B101110091,Z-C08B101110161,C09系列,Z-C10BC01110081,Z-C11B001110061,Z-C07FH00*00***,Z-C04F0********,Z-C12B501110361,C12 SERIES,Z-C11B*0**1***1,Z-C11BD01110101,807 SERIES,Z-C02C013520020,C10 SERIES,Z-C12B201110161,Z-C09B301110251,Z-807B*0**0****,Z-C03FH00*00***,Z-C11BC01110081,C09 SERIES,C12系列,Z-C11B301110101,Z-C12B301110251,Z-C09B*0**1***1,Z-C10B001110061,Z-C10B101110081

选型指南 - 正凌 - 2019年10月 PDF 中文下载

博联智能携AI大模型全屋智能以及AI商业照明解决方案惊喜亮相2024中国建博会，引领智能体验新纪元！

7月8日，2024中国建博会（广州）在广交会展馆及保利世贸博览馆盛大启幕。BroadLink博联智能携AI大模型全屋智能以及AI商业照明解决方案惊喜亮相，全方位展示AI大模型在智能家居领域的前沿应用成果。

厂牌及品类发布时间 : 2024-08-22

【IC】美格推出综合AI算力高达48Tops的高算力AI模组SNM970，采用4nm高端制程

美格智能则基于高通QCS8550处理器，开发了旗舰级高算力AI模组SNM970，以技术和产品创新加速AI应用的落地生根。该模组芯片采用4nm高端制程，综合AI算力高达48Tops。SNM970模组凭借领先的设计研发能力和强大的AI算力。

新产品发布时间 : 2023-07-24

台达暖通空调AI群控方案：用“AI群控”之术，把中央空调的能耗降下来！

通过数据采集、传输、控制、AI 算法策略等暖通系统各链路的节能优化，台达暖通空调AI群控方案从系统管理与整体运营的角度，改变暖通系统目前亟待解决的“高耗能与高浪费”等一系列问题，最终实现降本增效。

应用方案发布时间 : 2024-08-16

正凌板对板大电流连接器，每个引脚的电流高达40A，工作温度-40~125°C

如果市场上的标准连接器不能满足你的电源要求，可以考虑正凌精工的大电流连接器解决方案。Nextron的大电流连接器是目前市面上唯一设计给板对板的大电流连接器。该产品采用高导电率铜材质的高密度印刷电路板可以提供稳定的电流，每个引脚的电流高达40A。此外，压装端子设计紧凑，以适应高密度印刷电路板。这种高度耐用的冠状弹簧可提供稳定的接触，并能够在高振动环境中工作。

厂牌及品类发布时间 : 2021-07-31