Meenyi Technology Selected as One of Chengdu Top 100 New Economy Enterprises Again
On October 20, 2021, the “Double 1000” and “Double 100” press conferences were held at the 2021 Chengdu Global Innovation and Entrepreneurship Fair in Chengdu. During the event, the list of 100 Chengdu New Economy Enterprises and 100 Outstanding Talents was announced officially. MEENYI Technology was selected as one of the "Chengdu Top 100 New Economy Enterprises in 2021", and Mao Yi, General Manager of Meenyi, was awarded as one of the "100 Chengdu New Economy Outstanding Talents in 2021".
Since 2017, the development of a new economy and the cultivation of new momentum have been a major strategy in Chengdu to promote the optimization and adjustment of the economic structure and the successive conversion of old and new growth drivers in Chengdu. New economy enterprises are classified into three levels: seed, quasi-unicorn, unicorn, or industry leader, and they are cultivated throughout their life cycle. The top 100 enterprises and top 100 outstanding talents will selected each year, which will be given special attention, services, and support.
At present, Meenyi has 4,000 square meters of office space and 4,000 square meters of production lines and laboratories, and has set up advanced R&D centers, sales service centers, and laboratories in Shanghai, Shenzhen, Xi'an, and Nanjing, and has created a service network covering China and some regions in the world.
The entry of "Top 100 Chengdu New Economy Enterprises" again recognizes the quality and rapid development of Meenyi Technology. In the future, Meenyi Technology will continue to keep in mind its mission of "Service makes differences, actions define the standard", and strive to become the top chip company in China in the field of Gigabit broadband and Gigabit Wi-Fi by realizing the development and import substitution of high-end chips for national 3 Gigabit new infrastructure.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由莫子若转载自MEENYI Official Website,原文标题为:Meenyi Technology selected as one of Chengdu Top 100 New Economy Enterprises again,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
Zhangjiang Innovation, Connecting the World of Chips: Zhangjiang Science City Pavilion Debuts at 2024 MWC Shanghai, Pioneering the Future Era
On June 26, 2024, the Mobile World Congress Shanghai Exhibition (hereinafter referred to as “2024 MWC Shanghai“) officially kicked off at the Shanghai New International Expo Center, N5 Hall, Booth B40.
厂牌及品类 发布时间 : 2024-08-31
NOVOSENSE Driver Chips Boost Industrial Automation and Automotive Applications
Read this article and learn how to choose the appropriate chip in system development from the three typical application scenarios of “three-phase inverter power drive“, “on-board charger electronic lock“ and “PLC digital output” based on the latest intelligent driver chips launched by NOVOSENSE.
厂牌及品类 发布时间 : 2023-07-01
How JoulWatt Creates High-Performance Analog Chips from All Aspects?
How to increase the brand value of a company through differentiation and high-quality competition are the key factors to keep a foothold in the industry. From the perspective of chip design and manufacturing, core technology, product layout, quality control and other dimensions will help to create high-performance analog chip.
厂牌及品类 发布时间 : 2024-05-21
NOVOSENSE Has Launched Multiple Automobile-qualified Chips with Breakthrough Innovation Technology In the first half of 2022!
In the first half of 2022, NOVOSENSE has released more than ten new products, which are widely used in automotive, industrial, information and communication and consumer electronics fields.
新产品 发布时间 : 2022-07-11
The Technologies Involved in Speech Recognition Chips
Compared with traditional voice chips, the biggest feature of voice recognition chips is that they can recognize voices. This post POROSVOC will introduce the technologies involved in speech recognition chips.
设计经验 发布时间 : 2022-02-12
Horizon Robotics, a Global Leader in Edge AI Chips, Announced a Distribution Agreement with Sekorm
The cooperation between Horizon Robotics and Sekorm has brought AI chips and a complete algorithm library and development toolchain to R&D engineers, which can help engineers effectively improve R&D efficiency and accelerate product iterative innovation.
公司动态 发布时间 : 2022-07-13
ADX111AMSOP10 ADX112AMSOP10 ADX113AMSOP10 ADX114AMSOP10 ADX121AMSOP10 ADX122AMSOP10 ADX128AMSOP10 ADX125AMSOP10 ADX126AMSOP10 ADX123AMSOP10 Chips RoHS(SGS)Test Report(SHAEC22001626401)
型号- ADX122AMSOP10,ADX123AMSOP10,ADX121AMSOP10,ADX128AMSOP10,ADX125AMSOP10,ADX126AMSOP10,ADX111AMSOP10,ADX112AMSOP10,ADX113AMSOP10,ADX114AMSOP10
ROHM‘s 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely Integration in Traction Inverters Extends The Cruising Range and Improves Performance
ROHM has announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker. Since 2023, these power modules have been mass produced and shipped from HAIMOSIC (SHANGHAI) Co., Ltd. - a joint venture between ROHM and Zhenghai Group Co., Ltd. to Viridi E-Mobility Technology (Ningbo) Co., Ltd, a Tier 1 manufacturer under Geely.
产品 发布时间 : 2024-09-05
爱仕特SiC Chips选型表
提供爱仕特SiC Chips选型,覆盖TO-247-3,TO247-4L,TO-247-4,DFN8*8,DFN 10*12等常规封装,覆盖常规功率段,电压650V-3300V,电流5A-100A
产品型号
|
品类
|
Package
|
Voltage(V)
|
RON(mohm)
|
Temperature Range(℃)
|
Status
|
ASC8N650MT3
|
SiC Chips
|
TO-247-3
|
650V
|
320mohm
|
-40~175℃
|
Development
|
选型表 - 爱仕特 立即选型
Real-Time Clock (RTC) Chips XBLW DS1302 & DS1307: Powerful And Reliable
XBLW DS1307 Is A Real-Time Clock Chip Characterized By High Accuracy, Low Power Consumption Design, Battery Backup, And Support For Multiple Formats. It Communicates With Other Devices Through The I2C Interface And Features A Flexible Supply Voltage Range. The Main Parameters Of DS1307 Include Supply Voltage, I2C Interface, Storage Capacity, And Temperature Compensation. As A Reliable Real-Time Clock Solution, DS1307 Finds Wide Applications In Fields Such As Computers, Communication Equipment, Industrial Control Systems, And Embedded Systems.
产品 发布时间 : 2024-04-30
ROHM‘s 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely
ROHM has announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Geely, extending the cruising range and improves performance.
应用方案 发布时间 : 2024-08-31
电子商城
品牌:EXXELIA
品类:Low and Medium Voltage Chips Capacitors
价格:¥34.2900
现货: 155
品牌:EXXELIA
品类:Low and Medium Voltage Chips Capacitors
价格:¥22.1955
现货: 90
品牌:EXXELIA
品类:Low and Medium Voltage Chips Capacitors
价格:¥66.8718
现货: 80
服务
可贴PCB板厚范围:0.6~2.0mm,也支持生产软硬接合板,拼板长宽:50*50mm~550*500mm,PCBA快速贴片支持01005CHIP元件。
最小起订量: 1片 提交需求>
可贴片PCB尺寸50*50mm-580*610mm;PCB厚度0.3-8mm;贴装精度CHIP元件+0.03,BGA Pitch 大于0.25mm;元件尺寸0201-74*74BGA;元件高度:30mm。
最小起订量: 1 提交需求>
登录 | 立即注册
提交评论