BOYD Created a Cost Effective and Timely Cooling Solution for PCIe Card

2024-06-30 BOYD Official Website
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Introduction

BOYD, took on the challenging task of cooling a high power PCIe card housed within a rack-mounted satellite tracking, telemetry and telecommand (TT&C) unit. This product functions as a critical bridge between the satellite control center and the satellite itself.


Challenge

The PCIe card in question needed to dissipate 40-50W of power,depending on operating conditions. A customer limitation on additional active cooling required that Boyd find a passive solution that utilized the existing fan array in the system.


The primary focus of the cooling solution was to maximize MTBF of the PCIe card by keeping BGA device temperatures at a minimum.


Solution

For this level of power dissipation, a heat pipe / radiator fin design was the most effective choice. Today’s high end computer graphics cards utilize a similar system to dump their heat; however, most of these are actively cooled with a small on board fan. In order to keep the system passive, Boyd decided to look at a dual slot design where a larger fin stack would occupy the second slot.

Boyd created a detailed CFD base model which included FPGA, PHY,DDR, DDS, Omap, Bridge and LTM packages. The PCB thermal properties were defined by the number of ground and power layers specified by the customer. Other components in the system, such as the RF and HeatSink boards, were modeled as heat dissipating PCB boards. The system was then analyzed at an ambient temperature of 55℃ with an altitude pressure of 750 hPa and a flow rate of 300LFM.

From the base CFD simulation, Boyd was able to determine flow and temperature maps over the board, component junction temperatures and case thermals at the above conditions. This base model was then altered by the following to finalize the thermal solution:

• For components at or above their thermal limit, calculations were done to find the minimum required heat sink thermal resistance to bring them into safe operating ranges.
• Designed the thermal solution for all the components exceeding the minimum junction temperature requirements.
• Optimized the heat sink for DFM, cost and performance.


The Deliverables/Results

A complete thermal report and sample units were provided to the customer for testing. These sample units, produced at Boyd’s rapid prototyping facility in Laconia, NH, allowed the customer quickly and effectively validate the thermal solution. After the successful sample tests, Boyd set forth on a full production run of the PCIe card cooling solution for use in the final product. From concept to production – and everything in between – Boyd was able to deliver a cost effective and timely solution for this difficult thermal problem.


• At the above tested conditions (55℃, 750hPa and 300LFM), all of the components stayed be low the maximum junction temperature limits.
• The ambient temperature inside the enclosure is well below 85℃ with the proposed heat sink design at 55℃ ambient.
• Side baffles were recommended because,if included, they would prevent air bypass and improve the junction temperatures further.
• The strategic 3D routing of heat pipes allowed heat to spread across the surface of the pcb as well as up into the fins.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
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本文由莫子若转载自BOYD Official Website,原文标题为:PCIe Card,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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型号- 6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 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ATP(华腾国际)DRAM存储模块和NAND闪存产品选型指南(英文)

目录- Company Profile    Segment Challenges and Solutions    Thermal Solutions    Endurance Solutions    Security Solutions    CFexpress & USB 3.0    Value Line SSDs    DDR5    DRAM SOLUTIONS    FLASH SOLUTIONS    Flash Products Naming Rule    Solutions & Technologies    Flash Technology Overview table    Complete Flash Spec Overview & Product Dimensions   

型号- A750PI,E650SC SERIES,S600SC,B800PI,S750 SERIES,S600SI,S600SCA,E750PC SERIES,B600SC,N700PC,S700SC,E650SC,A750 SERIES,E600VC,S800PI,A750PI SERIES,I800PI,A600VC,A650SI,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,N650 SERIES,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E650SI SERIES,N750 SERIES,E700PIA,TR-03153,N600SI,S650,S650SC,E700PAA,N650SIA,E600SI,B600SC SERIES,S750SC,S600SIA,I700SC,N650SI,N600VI,E600SIA,E750PI,N650SC,N750PI SERIES,N600VC,I600SC,E750PC,S700PI,A650 SERIES,N650,N600 SERIES,N600VC SERIES,S650 SERIES,A650,AES-256,E700PI,A600SI,E750PI SERIES,N700PI,E700PA,S750,S750PI,E700PC,A600SC

012023  - ATP  - 选型指南  - v1.0 代理服务 技术支持 采购服务

行内冷却液分配装置液体冷却解决方案

描述- 该资料介绍了Boyd公司生产的In-Row冷却解决方案,这是一种高性能的冷却分配单元(CDU),适用于服务器、数据中心、医疗、半导体和一般工业应用。该CDU利用设施水提供高效的冷却能力,具有305-850 kW的制冷能力和支持多个机架的能力。它具备冗余泵、先进的监测传感器和其他智能可靠的特点。

2022/5/5  - BOYD  - 数据手册 代理服务 技术支持 采购服务

热管理和工程材料解决方案

描述- Boyd公司提供全面的芯片冷却解决方案,包括热沉、热管、液体冷却系统和空气冷却系统。其产品涵盖从标准板级解决方案到集成系统,旨在优化芯片冷却,提高性能和效率。公司拥有丰富的热管理经验和设计专业知识,提供定制化解决方案以满足不同应用需求。

2023/3/15  - BOYD  - 应用及方案 代理服务 技术支持 采购服务

10U冷却液分配装置液体-空气冷却解决方案

描述- Boyd公司推出的10U液冷散热单元(CDU)是为数据中心或边缘服务器提供高效液体冷却解决方案的系统。该系统适用于没有设施水的场所,具有超过30kW的容量,支持快速现场安装和操作。它具备N+1冗余功能,内置泄漏检测,并支持多种通信协议。

2022/4/29  - BOYD  - 数据手册 代理服务 技术支持 采购服务
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丙烯酸/光固化&双固化UV胶定制

可定制UV胶的粘度范围:150~25000cps,粘接材料:金属,塑料PCB,玻璃,陶瓷等;固化方式:UV固化;双固化,产品通过ISO9001:2008及ISO14000等认证。

最小起订量: 1支 提交需求>

PCB插座连接器定制

可定制插座连接器的间距1.25mm~2.54mm;列数:单列/双列/三列/四列;端子类型:直焊针、直角焊针、表面贴装式、无焊柔性针压接、绕接、载体.;镀层、车针长度/直径、连接针长度等参数可按需定制。

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