BOYD Created a Cost Effective and Timely Cooling Solution for PCIe Card

2024-06-30 BOYD Official Website
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Introduction

BOYD, took on the challenging task of cooling a high power PCIe card housed within a rack-mounted satellite tracking, telemetry and telecommand (TT&C) unit. This product functions as a critical bridge between the satellite control center and the satellite itself.


Challenge

The PCIe card in question needed to dissipate 40-50W of power,depending on operating conditions. A customer limitation on additional active cooling required that Boyd find a passive solution that utilized the existing fan array in the system.


The primary focus of the cooling solution was to maximize MTBF of the PCIe card by keeping BGA device temperatures at a minimum.


Solution

For this level of power dissipation, a heat pipe / radiator fin design was the most effective choice. Today’s high end computer graphics cards utilize a similar system to dump their heat; however, most of these are actively cooled with a small on board fan. In order to keep the system passive, Boyd decided to look at a dual slot design where a larger fin stack would occupy the second slot.

Boyd created a detailed CFD base model which included FPGA, PHY,DDR, DDS, Omap, Bridge and LTM packages. The PCB thermal properties were defined by the number of ground and power layers specified by the customer. Other components in the system, such as the RF and HeatSink boards, were modeled as heat dissipating PCB boards. The system was then analyzed at an ambient temperature of 55℃ with an altitude pressure of 750 hPa and a flow rate of 300LFM.

From the base CFD simulation, Boyd was able to determine flow and temperature maps over the board, component junction temperatures and case thermals at the above conditions. This base model was then altered by the following to finalize the thermal solution:

• For components at or above their thermal limit, calculations were done to find the minimum required heat sink thermal resistance to bring them into safe operating ranges.
• Designed the thermal solution for all the components exceeding the minimum junction temperature requirements.
• Optimized the heat sink for DFM, cost and performance.


The Deliverables/Results

A complete thermal report and sample units were provided to the customer for testing. These sample units, produced at Boyd’s rapid prototyping facility in Laconia, NH, allowed the customer quickly and effectively validate the thermal solution. After the successful sample tests, Boyd set forth on a full production run of the PCIe card cooling solution for use in the final product. From concept to production – and everything in between – Boyd was able to deliver a cost effective and timely solution for this difficult thermal problem.


• At the above tested conditions (55℃, 750hPa and 300LFM), all of the components stayed be low the maximum junction temperature limits.
• The ambient temperature inside the enclosure is well below 85℃ with the proposed heat sink design at 55℃ ambient.
• Side baffles were recommended because,if included, they would prevent air bypass and improve the junction temperatures further.
• The strategic 3D routing of heat pipes allowed heat to spread across the surface of the pcb as well as up into the fins.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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本文由莫子若转载自BOYD Official Website,原文标题为:PCIe Card,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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型号- 6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 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ATP(华腾国际)DRAM存储模块和NAND闪存产品选型指南(英文)

目录- Company Profile    Segment Challenges and Solutions    Thermal Solutions    Endurance Solutions    Security Solutions    CFexpress & USB 3.0    Value Line SSDs    DDR5    DRAM SOLUTIONS    FLASH SOLUTIONS    Flash Products Naming Rule    Solutions & Technologies    Flash Technology Overview table    Complete Flash Spec Overview & Product Dimensions   

型号- A750PI,E650SC SERIES,S600SC,B800PI,S750 SERIES,S600SI,S600SCA,E750PC SERIES,B600SC,N700PC,S700SC,E650SC,A750 SERIES,E600VC,S800PI,A750PI SERIES,I800PI,A600VC,A650SI,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,N650 SERIES,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E650SI SERIES,N750 SERIES,E700PIA,TR-03153,N600SI,S650,S650SC,E700PAA,N650SIA,E600SI,B600SC SERIES,S750SC,S600SIA,I700SC,N650SI,N600VI,E600SIA,E750PI,N650SC,N750PI SERIES,N600VC,I600SC,E750PC,S700PI,A650 SERIES,N650,N600 SERIES,N600VC SERIES,S650 SERIES,A650,AES-256,E700PI,A600SI,E750PI SERIES,N700PI,E700PA,S750,S750PI,E700PC,A600SC

012023  - ATP  - 选型指南  - v1.0 代理服务 技术支持 批量订货

BOYD Provides a Simple, Effective and Compact Cooling Solution for Portable Cold Therapy Medical Devices

Boyd engineered and optimized the heat dissipation assembly for prototyping. The cooling solution was designed with thermoelectric modules placed on a cold plate and an active cooling consisting of heat sinks and a fan.

2024-06-30 -  应用方案 代理服务 技术支持 批量订货
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品牌:BOYD

品类:散热片

价格:¥12.6104

现货: 10,025

品牌:BOYD

品类:散热片

价格:¥37.3590

现货: 1,970

品牌:BOYD

品类:heat sinks

价格:¥65.2406

现货: 880

品牌:BOYD

品类:散热片

价格:¥11.2245

现货: 500

品牌:BOYD

品类:散热片

价格:¥22.2495

现货: 500

品牌:BOYD

品类:散热片

价格:¥12.0960

现货: 448

品牌:BOYD

品类:散热片

价格:¥23.2890

现货: 280

品牌:BOYD

品类:散热片

价格:¥27.6347

现货: 50

品牌:BOYD

品类:散热片

价格:¥10.7551

现货: 50

品牌:BOYD

品类:散热片

价格:¥24.7187

现货: 50

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海量正品紧缺物料,超低价格,限量库存搜索料号

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4G PCB内置天线定制

可定制4G PCB内置天线的尺寸、连接器种类、电缆类型;支持频率700-960 MHz/1710-2700 MHz;支持协议4G;电压驻波比:860 MHz≦1.5;1710-2700MHz≦2.5。

最小起订量: 500 提交需求>

ATP半导体冷板制冷器定制

可定制ATP TE Cooler的冷却功率:40~200W;运行电压:12/24/48V(DC);控温精度:≤±0.1℃; 尺寸:冷面:20*20~500*300;热面:60*60~540*400 (长*宽;单位mm)。

最小起订量: 1 提交需求>

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授权代理品牌:接插件及结构件

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授权代理品牌:部件、组件及配件

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授权代理品牌:电源及模块

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授权代理品牌:仪器仪表及测试配组件

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授权代理品牌:电工工具及材料

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授权代理品牌:机械电子元件

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授权代理品牌:加工与定制

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