Boyd’s Solution for Outdoor Radio

2024-06-29 BOYD Official Website
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Introduction

A manufacturer of outdoor equipment sought BOYD for help. This client designs and manufactures disruptive technology platforms for emerging markets that drive profitable business models and enable ubiquitous connectivity. The client reached out to Boyd on a new outdoor point-to-point radio design challenge.


Challenge

The client is developing a new point to point radio product. This is an outdoor radio product that is mounted high on a pole.


Within the current design it houses a six layer PCB with all components on one side of the board. The components will face to the inside of the product, into a five sided plastic housing with the sixth side of the enclosure being the heat sink.


The back side of the board will interface with the heat sink using a compressible thermal pad.


Boyd’s objective is to verify the potential success of its thermal solution and to optimize the heat sink design.


Solution

Boyd was tasked with the following:

• To create a thermal CFD model of the existing product and implement PCB thermal properties.
• Create package level model for all critical components, apply thermal resistances and power.
• Compute internal and external thermal radiation paths. Simulate the baseline case and analyze temperature data, identify hot spots, and explore opportunities for improvements.
• Design heat sink for total power of 45W, to limit the internal enclosure temperature to 85℃ with an external ambient of 55℃. (max 30℃ rise).
• Optimize the heat sink design including: fin height, spacing, materials, base thickness, manufacturing process, size etc.


The Deliverables/Results

For the total of 45W power, at 55℃ ambient, with the addition of Cu layer and Al-Spreader all components are under maximum junction temperature limit.
• The ambient temperature inside the enclosure is well below 85℃ with the proposed heat sink design at 55℃ ambient.
• The shape of the enclosure is thermally close to the shape shown in drawings.


Boyd was able to manufacture the proposed heat sink and helped launch a successful project to market.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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本文由莫子若转载自BOYD Official Website,原文标题为:Outdoor Radio,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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目录- General Information    Board Mounted Heat Sinks    part number Introduction    Interface Materials    Labor Saving Heat Sink to Board and Semiconductor Mounts    Clips    Accessories   

型号- 6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 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