BOYD Improves the Thermal Performance of Networking Equipment Manufacturer‘s Wireless Remote Access Point

2024-06-30 BOYD Official Website
heat sinks,EMI shield,thermal design platform,BOYD heat sinks,EMI shield,thermal design platform,BOYD heat sinks,EMI shield,thermal design platform,BOYD heat sinks,EMI shield,thermal design platform,BOYD

Introduction

A manufacturer of high performance wired and wireless networking equipment asked BOYD, to evaluate and improve the thermal performance of their wireless remote access point, with an eye toward future product generations.


Wireless Access Challenge

The product had to be cooled by natural convection airflow for reasons of noise and cost. The prototype CAD model of the product was slimmer than the older model which would limit airflow through the system.


The primary orientation of the product during use was vertical, which was best for airflow, but the product also needed to meet the thermal performance requirements in the worst-case orientation, when the product was horizontal.


The initial CFD analysis showed that as designed, the top and bottom enclosure vents severely limited airflow. The CFD model predicted that this would cause several electronic components to operate above their temperature limits.


Dust accumulation in the vents over time might reduce system airflow and cause overheating.


Solution

Additional vents were added to the front and back of the product case near the top and bottom vents. This increased the system airflow by nearly a factor of three and reduced the likelihood of dust blocking the vents.


Additional thermal design improvements included:

• Placing a thermally conductive “gap pad” between the high-power components and the EMI shield
• Adding a second gap pad to link the radio board to the main PC board
• Designing optimized heat sinks for several critical components


Results

The modifications successfully lowered all component temperatures below their thermal limits in both vertical and horizontal orientation, while maintaining the aesthetics of the customer’s design.


Boyd’s thermal analysis provided the customer with a thermal design platform they could build on for future product generations.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
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本文由莫子若转载自BOYD Official Website,原文标题为:Wireless Access,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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目录- General Information    Board Mounted Heat Sinks    part number Introduction    Interface Materials    Labor Saving Heat Sink to Board and Semiconductor Mounts    Clips    Accessories   

型号- 6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 0000G,103G,374024B60023G,4804MG,374324B00035G,501806B00000G,7717-15G,7717-156G,590102B03600G,SW38-2G,100200F00000G,PF752G,TC11,593202,TC10,6232PB-MTG,7717-16G,6400B-P2G,529701,43-77-1G,529702,534002B02554G,577202B04000G,581202B02500G,TC12,164000F00000G,375224B00032G,7721-11NG,575002D00000G,BW50-4G,6396B–_G,335324B00032G,560200B00000G,500403,335814B00000G,8241-CL11G,PF758G,SW38-4G,500103B00000G,56-77-9G,575102B00000G,6400BG,574602B03300G,6201PBG,502006B00000G,6021-_-_G,533102,533101,591202,7106D/TRG,43-03-2,335824B00032G,6046PBG,580300B00000G,102100F00000G,BW50-2G,533522B02552G,10-THMA-01G,325705B00000G,PF732G,TV265G,533101B02551G,SW38-6G,533302,349G,43-77-20G,530162B00162G,125800D00000G,374024B00032G,574004U00000G,533722B02552G,533602B02552G,6232B-MTG,501503,7721-2PPSG,335824B00034G,53-03-2G,593101B 0 0000G,TV1500G,574902,8923-2G,7140DG,335214B00032G,2317B-EP11-BGS1G,592502,501303B000 _ _ G,542502D00000G,577304B00000G,500203,7717-247G,374524B00032G,SW63-4G,101600F00000G,576802B04000G,7721-7PPS,109G,531302V02500G,506003B00000G,590302B03600G,573400D00000G,SW63-2G,579302,374824B00035G,533701B02552G,574102B0 00 00G,10-L4LB-03G,NG,335214B00034G,532802B02500G,6222BG,4880G,574102B03300G,575603B00000G,375024B00032G,513302,513301,534202,7020BG,590102,577_ _02B 0 4000G,7717-79G,6239B-MTG,5_9003B 0 0000G,10-6326-27G,574402B03200G,5900PBG,5005-09NG,6021_–_-_G,507222B00000G,578622B03200G,529801B000 _ 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G,350G,374524B60023G,10-BRD1-05G,532702,375124B00035G,530102B00100G,374124B00032G,513002B02500G,551002B00000G,577002B00000G,513202,513201,6049PBG,46-77-9G,7023BG,7717-122G,506902,351G,PF435G,7019PBG,375124B00032G,533622B02552G,110G,7721-10PPSG,593101,7023B–_G,10-L4LB-11G,374124B60023G,529801,529802,6070B– G,574602,533721

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BOYD(宝德)EMI吸收器选型指南

目录- Company Profile    EMI Absorber   

型号- BCEMI-310-1011,BCEMI-310-1010,BCEMI-310-1025-0.06,BCEMI-310-1015,BCEMI-310-1014,BCEMI-310-1013,BCEMI-310-1012,BCEMI-310-1019,BCEMI-310-1018,BCEMI-310-1017,BCEMI-310-1016,BCEMI-310-1017-0.045,BCEMI-310-1025-XXXX,BCEMI-310-1017-XXXX,BCEMI-310-1022,BCEMI-310-1021,BCEMI-310-1020,BCEMI-310-1004,BCEMI-310-1026,BCEMI-310-1003,BCEMI-310-1025,BCEMI-310-1002,BCEMI-310-1001-A-A-0.05,BCEMI-310-1024,BCEMI-310-1001,BCEMI-310-1023,BCEMI-310-1008,BCEMI-310-1007,BCEMI-310-1006,BCEMI-310-1005,BCEMI-310-1009,BCEMI-310-1001-X-X-XXXX

选型指南  -  BOYD  - 12.10.2015 PDF 英文 下载

BOYD(宝德)导电泡沫选型指南

目录- Company profile and Conductive Polyurethane Foam Introduction    Conductive Polyurethane Foam    Conductive Polyurethane Foam Compression & Resistance Curves   

型号- BCEMI-321-1009,BCEMI-321-1007,BCEMI-321-1008,BCEMI-321-1005,BCEMI-321-1006,BCEMI-321-1003,BCEMI-321-1004,BCEMI-321-1001,BCEMI-321-1012,BCEMI-321-1002,BCEMI-321-1013,BCEMI-321-1010,BCEMI-321-1011

选型指南  -  BOYD  - 12.10.2015 PDF 英文 下载

商品及供应商介绍  -  BOYD  - 2021/11/17 PDF 英文 下载

商品及供应商介绍  -  BOYD  - 2021/11/17 PDF 英文 下载

Datasheet - Board Level Cooling High Power Extruded 6390

型号- 6396BG,6400BG,6396B-P2G,6400B-P2G,6390,6399BG,6398BG

数据手册  -  BOYD  - 2023/3/23 PDF 英文 下载

Infineon Continues to Partner with Boyd to Develop Improved Systems and Solutions for Cooling Electronics in HEV/EV

Infineon Technologies continues to partner with Boyd to develop improved systems and solutions for cooling electronics in hybrid and electric vehicles (HEV/EV). We see that EV and HEV production and consumer adoption is exponentially growing and will continue to as environmental standards push for cleaner, more compact, and less expensive transportation.

应用方案    发布时间 : 2024-06-29

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EMC电波暗室预测试

提供辐射发射测试、传导发射预测试、EMI噪声频率扫描服务。消费电子辐射发射预测试频率范围30MHz-1GHz、 车载电子9KHz-3GHz,并针对问题给出EMC整改方案。支持到场/视频直播测试,资深专家全程指导。

实验室地址: 深圳 提交需求>

EMI预兼容测试

配备是德信号分析仪和网络分析仪,测试范围DC-9GHZ,可测试确定干扰源的频率,某频段的干扰功率,准确得到谐波功率和杂散频点测试。支持到场/视频直播测试,资深专家全程指导。

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