Boyd’s Solution Including a Counter Intuitive Reduction of Heat Sink Size Solved Customer’s Tablet Temperature Problem

2024-06-30 BOYD Official Website
heat sinks,CFD model,RF gasket,Silicone sealant heat sinks,CFD model,RF gasket,Silicone sealant heat sinks,CFD model,RF gasket,Silicone sealant heat sinks,CFD model,RF gasket,Silicone sealant

Introduction

A major contract electronics manufacturer (CEM) chose BOYD, to evaluate the thermal performance of a ruggedized tablet PC in order to reduce the skin temperature of the product.


Challenge

Reduce the skin temperature and still maintain the component temperatures within operating limits.


The system had to be isolated from outside air and dust.

Due to the small product form factor, it had to be cooled using natural convection.


Solution

Boyd characterized the air flow and temperature profile of the enclosure using CFD. The resulting CFD model was used to identify critical components and product zones that needed improvement. The size of the heat sinks for the hottest components was reduced to decrease radiant heat transfer from the heat sinks to the external enclosure.

The hot spot regions were isolated from the external enclosure using insulation at several locations:

• A plastic cover was added over the hot spots to separate the heat sources from the side wall of the enclosure.

Polycarbonate sheet was added for thermal insulation between the PCB and a magnesium plate that houses the processor.

Silicone sealant was added between the heat sink base and the magnesium plate.

• An RF gasket was added around the interface between the heat sink and the processor to act both as thermal insulation and EMI shielding.


The Deliverables/Results

Boyd’s solution solved the customer’s tablet temperature problem. The solution included a counter intuitive reduction of heat sink size. Boyd’s expertise provided a cost-effective alternative to a customer that had no need for full time thermal engineering.

授权代理商:世强先进(深圳)科技股份有限公司
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本文由莫子若转载自BOYD Official Website,原文标题为:Tablet,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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目录- General Information    Board Mounted Heat Sinks    part number Introduction    Interface Materials    Labor Saving Heat Sink to Board and Semiconductor Mounts    Clips    Accessories   

型号- 6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 0000G,103G,374024B60023G,4804MG,374324B00035G,501806B00000G,7717-15G,7717-156G,590102B03600G,SW38-2G,100200F00000G,PF752G,TC11,593202,TC10,6232PB-MTG,7717-16G,6400B-P2G,529701,43-77-1G,529702,534002B02554G,577202B04000G,581202B02500G,TC12,164000F00000G,375224B00032G,7721-11NG,575002D00000G,BW50-4G,6396B–_G,335324B00032G,560200B00000G,500403,335814B00000G,8241-CL11G,PF758G,SW38-4G,500103B00000G,56-77-9G,575102B00000G,6400BG,574602B03300G,6201PBG,502006B00000G,6021-_-_G,533102,533101,591202,7106D/TRG,43-03-2,335824B00032G,6046PBG,580300B00000G,102100F00000G,BW50-2G,533522B02552G,10-THMA-01G,325705B00000G,PF732G,TV265G,533101B02551G,SW38-6G,533302,349G,43-77-20G,530162B00162G,125800D00000G,374024B00032G,574004U00000G,533722B02552G,533602B02552G,6232B-MTG,501503,7721-2PPSG,335824B00034G,53-03-2G,593101B 0 0000G,TV1500G,574902,8923-2G,7140DG,335214B00032G,2317B-EP11-BGS1G,592502,501303B000 _ _ 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00G,520329,575002,580500B00000G,335224B00034G,504222B00000G,10-BRD2-01G,6109PBG,566902B03100G,519703,7717-7G,577922B00000G,T410R,578505B00000G,513101B02500G,6374BG,505303,533621B02552G,576602B00000G,533202B02551G,374224B60023G,2327B-CP50G,6396B-P2G,7717-8G,4177G,575300B00000G,4949G,374724B00032G,TV40G,6396BG,335314B00000G,7038BG,6225B-MTG,505403B00000G,530714,615653B00250G,373224M00032G,374424B00035G,132000F00000G,574102,10-BRD1-01G,504222,533301B02551G,501706B00000G,574802B0 _ _ 00G,520327B00000G,125700D00000G,10-BRD1-04G,532702B02500G,533802,579206V00000G,505103,374124B00035G,575603,574802B03300G,5005-25NG,TC1,566902,TC6,TC7,115200F00000G,531102B02500G,10-BRD1-03G,533001B02551G,542502,533502B02552G,501200B00000G,542502B000 _ _G,513302B02500G,576203B00000G,374424B00032G,579902B00000G,320205B00000G,10-BRD1-07G,116200F00000G,375424B00034G,507302,335114B00032G,4171G,161000F00000G,529801B000 _ _ G,350G,374524B60023G,10-BRD1-05G,532702,375124B00035G,530102B00100G,374124B00032G,513002B02500G,551002B00000G,577002B00000G,513202,513201,6049PBG,46-77-9G,7023BG,7717-122G,506902,351G,PF435G,7019PBG,375124B00032G,533622B02552G,110G,7721-10PPSG,593101,7023B–_G,10-L4LB-11G,374124B60023G,529801,529802,6070B– G,574602,533721

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选型指南  -  BOYD  - 2021/12/16 PDF 英文 下载

应用及方案  -  BOYD  - 2023/3/15 PDF 英文 下载

用户指南  -  BOYD  - October 2021 PDF 英文 下载 查看更多版本

商品及供应商介绍  -  BOYD  - 2023/3/15 PDF 英文 下载

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商品及供应商介绍  -  BOYD  - 2022/2/3 PDF 英文 下载

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