TE Connectivity Expands VITA 66 Optical Backplane Interconnect Product Family

New High-Density Solution for Rugged Embedded Comp

时间： 2024-06-30 来源：TE connectivity Official Website

技术问答

HARRISBURG, Pa. JUNE 28, 2024 – TE connectivity (TE), a world leader in connectivity and sensors, has expanded its VITA 66 optical backplane interconnect family with the new VITA 66.5 Style D optical modules. These high-density modules provide a rugged, blind-mate optical interconnect solution for aerospace, defense, and marine applications.

The VITA 66.5 Style D optical modules feature up to 3 MT ferrules per insert and a floating receptacle design for optimal alignment. Available in full-size and half-size configurations, they offer versatility for various system designs. The modules are designed to withstand harsh environments and meet military and aerospace
specifications.

"The VITA 66.5 Style D, 3 MT optical modules address the growing need for higher data rates and bandwidth in embedded computing applications," said Anders Thelin, Product Manager at TE Connectivity. "This expansion of our VITA 66 family demonstrates our commitment to providing advanced connectivity solutions for challenging environments."

Key benefits of the VITA 66.5 Style D, 3 MT optical modules include:

●Easy integration with common mounting interfaces for 3U and 6U VPX applications

●Rugged design based on proven optical termini for various applications

●High performance with up to 3 MT ferrules per insert and floating alignment capability

The VITA 66.5 Style D, 3 MT optical modules are suitable for applications such as embedded computing, secure communications, avionics, radar and imaging systems.

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