8 High-Power Bluetooth LE Modules and Their Applications
Bluetooth Low Energy (BLE) technology is renowned for its low power consumption and ease of use in short-range wireless communication. With the advent of smart homes and Industry 4.0, there is a growing need for BLE devices with high transmit power to ensure long-range and stable connectivity.
What is the Maximum Transmit Power of BLE?
Regulatory agencies typically limit BLE transmit power to around 100mW (20dBm) for 2.4GHz band devices.
Applications of High-Power BLE modules
High-power BLE radios, with transmit power ranging from 0 dBm to 20 dBm, are particularly advantageous in the following areas:
● Smart Home: Seamless connectivity for devices across large homes.
● Industrial Automation: Stable wireless communication in vast factory settings.
● Medical Devices: Efficient long-range data transmission for remote monitoring.
● Logistics Tracking: Improved efficiency in tracking and managing goods.
● Smart Agriculture: Precision farming through environmental monitoring.
While these applications prioritize transmission power and range, higher transmit power also leads to increased power consumption. Therefore, when selecting Bluetooth Low Energy modules for different applications, it's essential to consider factors such as transmission power, communication range, antenna, and power consumption.
High-Power BLE Modules
Most BLE modules have a maximum transmit power of 4 dBm or 8 dBm, but some exceed this:
TI CC2652P-Based Modules: RF-BM-2652P2 and RF-BM-2652P2I can output +20dBm. Importantly, the modules support multiple protocols like Bluetooth 5.2 Low Energy, Thread, Zigbee®, IEEE802.15.4g, 6LoWPAN, and TI 15.4-Stack (2.4GHz), running simultaneously through the dynamic multi-protocol manager (DMM). Thanks to these features, the wireless modules have been widely used in smart homes, gateways, and long-distance sensors.
Another good news is that RF-star has released a Bluetooth UART transparent transmission version for the modules. Rich AT commands allow customers to quickly shorten the product development lifetime, like:
● 22 adjustment levels of transmission power: -20dBm ~ +20dBm
● Supporting one-master and multi-slave connections, up to 8 devices can be connected at the same time
● Customizing extended broadcast packets up to 251 bytes
● Supporting a maximum stable UART forwarding rate of 35KB/s
● Observer mode with filterable parameters
● Supporting Bluetooth pairing and bonding
● Automatic reconnection
TI CC2652P7-based BLE modules: RF-BM-2652P4 and RF-BM-2652P4I also offer +20dBm. Aside from supporting the above-mentioned ZigBee and other 2.4GHz wireless technology, they can run Matter protocol. More tellingly, the large memory of 152kB RAM and 704kB Flash of these CC2652P7 modules allows them to be embedded in more complex applications.
SILICON LABS EFR32BG24/MG24 Modules: This series of BLE modules are all designed as PCB onboard antennas with a maximum TX power of +19.5dBm. They are often used in smart home devices such as gateways/hubs, sensors, switches, door locks, smart plugs, LED lighting, lamps, and medical devices like blood glucose meters and pulse oximeters.
High-power BLE modules are essential for applications requiring extended range and robust connectivity. They integrate advanced wireless technologies and offer flexible output options, making them ideal for smart homes, industrial automation and more.
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本文由Vicky转载自RF-Star,原文标题为:8 High-Power Bluetooth LE Modules And Their Applications,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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信驰达USB Dongle&模组选型表
信驰达提供以下Sub-1G模组,USB Dongle,Wi-Fi模组,Zigbee模组,低功耗蓝牙模组,多协议无线模组,国产芯片低功耗蓝牙模组和无线模组的参数选型,工作电压(V):1.7 V ~ 5.5 V,推荐3.3 V,GPIO:7~48,工作温度(℃):-40 ℃ ~ +125℃等。
产品型号
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品类
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芯片型号
|
内核
|
天线类型
|
RAM(KB)
|
Flash(KB,MB)
|
支持协议
|
工作电压(V)
|
工作频段(GHz,MHz)
|
最大发射功率(dBm)
|
接收灵敏度(dBm)
|
功耗
|
GPIO
|
工作温度(℃)
|
储存温度(℃)
|
通信距离(m)
|
模块尺寸(mm)
|
封装方式
|
OTA升级
|
蓝牙Mesh
|
Long Range模式
|
2Mbps高速模式
|
AoA/AoD支持
|
透传协议
|
产品特点
|
应用场景
|
RF-BM-2642QB1I
|
低功耗蓝牙模组
|
CC2642R-Q1
|
48 MHzARM® Cortex®-M4F
|
IPEX/邮票孔
|
88 KB
|
352 KB
|
BLE 5.2
|
1.8 V ~ 3.63 V,推荐3.3 V
|
2.4 GHz
|
+5 dBm
|
-97 dBm @ BLE 1M PHY-105 dBm @ 125 kbps LECoded PHY
|
TX:25.58 μA@0 dBm 1000ms广播间隔睡眠功耗:2.49 uA
|
31
|
-40 ℃ ~ +105 ℃
|
-40 ℃ ~ +125 ℃
|
200 m @ 1M PHY 300 m @ LE Coded PHY
|
17.0 x 21.5 x 2.2
|
SMT(邮票半孔)
|
OTA升级
|
蓝牙Mesh
|
Long Range模式
|
2Mbps高速模式
|
AoA/AoD支持
|
主从一体,一主七从
|
AEC-Q100车规级,外置天线,抗干扰性能高
|
汽车(汽车门禁和安全系统、高级驾驶辅助系统、远程信息处理控制单元),音箱主机,工业(工业运输-资产跟踪、工厂自动化和控制)
|
选型表 - 信驰达 立即选型
Silicon Labs(芯科科技) 物联网无线产品选型指南
目录- Company and product overview Bluetooth Modules Bluetooth Modules Overview Bluetooth Modules Bluetooth Low Energy Kits Bluetooth Modules Blue Gecko Wireless Modules Bluetooth Modules Bluetooth Xpress Modules Bluetooth Modules Blue Gecko Wireless SoCs Bluetooth Modules Bluetooth BR/EDR Kits Bluetooth Modules Bluetooth BR/EDR Modules proprietary wireless devices proprietary wireless devices Proprietary Kits Proprietary Wireless Sub-GHz and 2.4 GHz Dual Band Devices Proprietary Wireless Sub-GHz Devices Wi-Fi Modules Wi-Fi Modules Wi-Fi Kits Mighty Gecko Modules Mighty Gecko Modules Mighty Gecko Development Kit Mighty Gecko Modules Mighty Gecko Mesh Networking Wireless SoCs Z-Wave Modules Z-Wave Modules Z-Wave Reference Designs Z-Wave Modules Z-Wave Development Kits
型号- EBWT41U,ZDB5202,SLEXP8027A,EFR32FG13P233F512GM48,EFR32™,SLWSTK6061B,MGM12P,EZR32WG,EFR32FG13P231F512GM32,EFR32BG12P232F1024GM68,EFR32MG13P733F512GM48,EFR32BG13P532F512GM32,WT12,AMW007-E04,EFR32,WT32I,EZR32™,BGM121,BGM11S,WT11U,EFR32FG,EFR32FG14P233F256GM48,SLWSTK6062B,RBK-ZW500DEV-CON2,SLWSTK6120A,SLWSTK6063B,RBK-ZW500,EFR32BG12P132F1024GL125,SI4XXX,ZM5101,ZM5304,ZDB5101,ACC-UZB3-U-BRG,BGM111,EBWT11U,EFR32FG14P233F128GM48,ACC-UZB3-U-STA,MGM111,ZDB5304,SLWSTK6000B,SLWSTK6020B,WT32,SI10XX,SLWSTK6101C,EFR32MG13P632F512GM32,AMW037,EFR32FG12P433F1024GM48,DKWT32I-A,EFR32MG12P132F1024GL125,EFR32MG1P133F256GM48,BGM13S,EZR32HG,BGM13P,BGX13P,EZR32LG,MGM13P,WT41U,EFR32BG13P733F512GM48,BGX13S,SLWSTK6060B,MGM13S,SLWSTK6065B,WGM110,RBK-ZW500DEV-EMB2,EFR32BG12P433F1024GL125,EBWT12-A,ZM5202,AMW007,SLTB004A,EFR32MG14P733F256GM48
EFR32BG24无线SoC系列数据手册
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型号- EFR32BG24B110F1536IM48-B,EFR32BG24B210F1024IM48-B,EFR32BG24A020F1024IM40-B,EFR32XG24,EFR32BG24A010F1024IM48-B,EFR32BG24A020F1024IM48-B,EFR32BG24B220F1024IM48-B,EFR32BG24B020F1536IM48-BR,EFR32,EFR32BG24,EFR32BG24A010F1024IM40-B
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型号- RF-BM-ND09A,RF-WM-11AFB1,RF-DG-22A,RF-WM-20DNB1,RF-WM-3235A1S,RF-BM-ND04CI,RF-SM-1277B2,RF-WM-RTL8720DNB1,RF-BM-ND04I,RF-SM-1277B1,RF-BM-2340C2,RF-BM-ND04C,RF-DG-52PAS,RF-BM-2652P2I,RF-WM-3200B3,RF-WM-3200B1,RF-B-AR4,RF-B-AR1,RF-BM-2652B1,RF-ZM-2530P1,RF-BM-BG22A1,RF-BM-2652B2,RF-TI1352B1,RF-BM-4044B5,RF-ZM-2530B1I,RF-WM-20CMB1,RF-BM-2340A2I,RF-BM-BG22A1I,RF-BM-ND05I,RF-BM-2340B1,RF-BM-4044B2,RF-BM-4044B4,RF-SM-1077B2,RF-BM-4044B3,RF-SM-1077B1,RF-WM-3235B1,RF-BM-2642B2,RF-DG-40A,RF-BM-BG22B1,RF-BM-ND10,RF-BM-BG24B1,RF-ZM-2530P1I,RF-DG-32B,RF-BM-BG22A3,RF-BM-ND04,RF-WM-3235B1S,RF-BM-ND05,RF-BM-ND06,RF-BM-ND08,RF-B-SR1,RF-BM-2340B1I,RF-BM-2340A2,RF-BM-4077B1,RF-BM-4077B2,RF-BM-MG24B2,RF-BM-MG24B1,RF-TI1352P1,RF-WM-3235A1,RF-BM-ND08C,RF-BM-2652P4I,RF-BM-ND08A,RF-BM-2652P7,RF-WM-3220B1,RF-BM-2651B1,RF-BM-BG22C3,RF-BM-BG24B2,RF-BM-2652P2,RF-WM-RTL8720CMB1,RF-BM-2652P3,RF-BM-BG22A3I,RF-BM-2652P4,RF-ZM-2530B1
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Silicon labs 蓝牙SOC选型表
Cortex-M4/M33内核,支持蓝牙5,待机功耗1.2μA;实测网络节点100+,工作温度高达125℃,提供芯片和模块。其最新的1.4μA超低功耗蓝牙SoC EFR32BG22具有主频高达76.8MHz Cortex-M33内核,16位ADC,支持蓝牙5.2与AoX定位和蓝牙Mesh协议。
产品型号
|
品类
|
MCU Core
|
Core Frequency (MHz)
|
Flash
|
RAM
|
Secure Vault
|
Bluetooth
|
Bluetooth 5
|
Bluetooth Mesh
|
Cryptography
|
Output Power Range (dBm)
|
GPIO
|
I²C
|
SPI
|
I²S
|
Receive Sensitivity
|
ADC
|
Comparators
|
Temperature Range (ºC)
|
Package Type
|
Package Size(mm)
|
EFR32BG24B110F1536IM48-B
|
Bluetooth®Wireless SoC
|
ARM Cortex-M33
|
78
|
1536
|
256
|
High
|
5.3
|
Bluetooth 5
|
Bluetooth Mesh
|
AES-128;AES-256;ECC;SHA-1;SHA-2
|
-20 to 10
|
28
|
2
|
3
|
1
|
-97.6DBM(1Mbit/s GFSK)
|
12-bit,SAR,1Msps
|
2
|
-40 to 125
|
QFN48
|
6x6
|
选型表 - SILICON LABS 立即选型
智能设备设计概念并开发小型医疗、可穿戴和娱乐设备
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EFR32BG24 无线 SoC 产品系列数据表
描述- EFR32BG24 无线 SoC 产品系列是一款适用于蓝牙低功耗和蓝牙网状网络的无线连接解决方案。该系列产品具备高性能 2.4 GHz RF、低电流消耗、AI/ML 硬件加速器和 Secure Vault 等关键功能,旨在为物联网设备制造商提供智能、强大、节能且安全的解决方案。其核心采用 32 位 ARM Cortex-M33 内核,最高工作频率为 78 MHz,并配备高达 1536 kB 的闪存和 256 kB 的 RAM。
型号- EFR32BG24B110F1536IM48-B,EFR32BG24B210F1024IM48-B,EFR32BG24A020F1024IM40-B,EFR32BG24A010F1024IM48-B,EFR32BG24A020F1024IM48-B,EFR32BG24B220F1024IM48-B,EFR32BG24B020F1536IM48-BR,EFR32BG24,EFR32BG24A010F1024IM40-B
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介绍在EFR32BG24程序运行的过程通过外部方法读取PC指针的方法。
AN928.2:EFR32系列2布局设计指南
描述- 本指南旨在帮助用户设计适用于EFR32系列2无线Gecko平台的PCB板,以实现良好的射频性能。指南涵盖了匹配网络类型、布局原则和设计建议,包括不同型号的EFR32xG系列MCU的匹配网络设计和PCB布局规则。此外,还提供了调试和编程接口连接器的详细信息以及电源配置的建议。 **主要内容** - 提供了EFR32系列2无线Gecko平台的设计参考方案。 - 列出了所有主要设计原则并进行了详细描述。 - 为每种EFR32xG系列MCU推荐了不同的匹配网络类型。 - 强调了布局图对匹配组件值的影响,并建议遵循相应的布局指南。 - 详细介绍了调试和编程接口连接器的好处和使用方法。 - 讨论了EFR32系列2的电源配置和硬件设计考虑因素。 - 提供了针对不同频率带和应用场景的典型RF匹配电路示例。
型号- EFR32MG27,EFR32MG24,EFR32MG22,EFR32MG21,EFR32XG21-C,EFR32ZG23,EFR32XG21-B,EFR32BG27,EFR32ZG28,EFR32FG23,EFR32FG22,EFR32 SERIES,EFR32BG22,EFR32FG28,EFR32XG21,EFR32,EFR32BG21,EFR32BG24,EFR32FG25
信驰达提供多款主流大功率无线蓝牙透传模块,满足更大范围的无线通信需求
信驰达提供多款主流的大功率蓝牙模块,这些蓝牙模块不仅具备大发射功率的特点,还集成了先进的无线连接技术,如ZigBee、Matter、Thread多协议等,提供板载 PCB 天线、外置 IPEX 天线和邮票半孔引出3种可选天线,为智能家居、工业自动化等各种应用提供了强大的无线通信解决方案。
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支持 3Hz ~ 26.5GHz射频信号中心频率测试;9kHz ~ 3GHz频率范围内Wi-SUN、lora、zigbee、ble和Sub-G 灵敏度测量与测试,天线阻抗测量与匹配电路调试服务。支持到场/视频直播测试,资深专家全程指导。
实验室地址: 深圳/苏州 提交需求>
提供蓝牙BLE芯片协议、蓝牙模块、蓝牙成品测试认证服务;测试内容分Host主机层,Controller控制器层,Profile应用层测试。支持到场/视频直播测试,资深专家全程指导。
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