TDK Launches InvenSense Sensor Partner Program to Empower IoT innovation with Sensor Technology

时间： 2024-07-24 来源：TDK InvenSense Official Website

技术问答

InvenSense Sensor Partners enable efficient prototyping and development for applications such as wearables, hearables, healthcare devices, drones, other IoT and robotics
Partners offer reference designs, evaluation kits, modules and software algorithms with InvenSense MEMS sensors to help build IoT solutions, accelerating time-to-market and reducing total costs
Current partners include Renesas, Ambiq, Qualcomm Technologies, Alif Semiconductor, Ambarella, AONDevices, Syntiant, Isentek, MindMics and Avnet, with additional partners added quarterly
Partners Renesas and Ambiq join TDK in exhibiting joint solutions at Sensors Converge, June 25-26

June 24, 2024——TDK Corporation (TSE:6762) announces the InvenSense Sensor Partner Program to empower faster time-to-market and innovation using InvenSense MEMS sensors in IoT, wearable, hearable, AR, VR and robotics applications. Through these new ecosystem partnerships, more engineers and developers can access leading InvenSense sensor technology along with the reference designs, software solutions and development kits that help them bring product designs to reality.

The InvenSense Sensor Partner Program enables ODMs, OEMs, developers, engineers and tech enthusiasts to work with a wide variety of InvenSense MEMS sensors – motion sensors, industrial motion modules, microphones, pressure sensors and ultrasonic sensors. Partner reference kits serve as real-world examples of how InvenSense MEMS sensors work with partner products to create more accurate, reliable and efficient solutions across industries. This not only improves time to market but also reduces the cost of ownership for building IoT solutions.

“Renesas is thrilled to be part of the InvenSense program, as they provide a variety of high accuracy sensors that are integrated into Renesas Quick Connect Studio platform. This helps customers quickly develop system solutions for IoT, home automation, consumer and industrial applications,” said Pooja Bhadrappanavar, Renesas product marketing lead.

Current InvenSense Sensor Partner Program members include:

Microcontroller/SOC partners:

Renesas Electronics Corporation – InvenSense partners with Renesas to empower a wide range of industrial, home electronics and IoT applications. InvenSense MEMS sensors have been integrated on the Renesas Quick Connect platform as a sensor PMOD board (QCIoT-42688P), enabling users to select these sensors to rapidly prototype IoT solutions on Renesas MCU platforms. The AI Kit from Renesas also comes with the ICM-42670-P PMOD boards and drivers.
Ambiq Micro – InvenSense partners with Ambiq Micro to empower ultra-low-power applications such as wearables and hearables. InvenSense motion sensors and microphones have been integrated on the energy harvesting reference design and ultra-low-power voice activation kits with the latest Apollo510 SOC; Ambiq leverages their low power/high compute leadership into power consumption constrained battery-powered applications, for markets such as healthcare, cargo/human/pet trackers, building access and self-healing conditional factory monitoring.
Qualcomm Technologies, Inc. – InvenSense is collaborating with Qualcomm Technologies to bring the latest innovation and technology solutions to the robotics market. As the sensor provider for several Qualcomm® Robotics Platforms, TDK has worked to create the “TDK Mezzanine” board supported on all Qualcomm Robotics Platforms. This mezzanine platform allows any customer who plans to utilize Qualcomm Robotics processors to evaluate and develop upon all the necessary sensor and motor controller technology needed for any robotic product quickly and efficiently.
Alif semiconductor – InvenSense partners with Alif Semiconductor to empower high compute AI/ML applications. TDK motion sensors and microphones have been integrated on an AK-E7-AIML AppKit, powered by Alif Ensemble E7 Fusion processor, enabling quick software development and evaluation for Edge Machine Learning use cases.

AI chip partners

Ambarella – InvenSense partners with Ambarella and its AI vision SOCs to enable Electronic Image Stabilization (EIS) for security cameras, video conference cameras and other applications, as well as Robotics simultaneous localization and mapping (SLAM) functions. Ambarella’s entire portfolio of CVflow® AI SOC evaluation kits, including the newest CV72S EVK, come with InvenSense motion sensors integrated for evaluation and development of Optical Image Stabilization (OIS) and EIS functions.
AONDevices – InvenSense partners with AONDevices (AON) SOCs to empower ultra-low power voice activation, speech and sound detection applications. InvenSense microphones and motion sensors have been integrated to AON 1100/1120 evaluation kits for quick evaluation and prototyping of voice related applications on TWS, speakers and hearables.
Syntiant – InvenSense partners with Syntiant SOC for acoustic and motion event detection applications. InvenSense motion sensors and microphones are integrated on the RASynBoard which is an ultra-low power, edge AI/ML board, based on a Syntiant Neural Decision Processor, and a Renesas RA6M4 host MCU.

Sensor Partner

Isentek – InvenSense partners with Isentek 3D Hall sensors for 9-axis IoT applications such as Asset Tracking, Drones, navigation, e-bikes and more. InvenSense sensors have been integrated on 9-axis evaluation kits DK-42688-9x and DK-42670-9x, with Isentek 3D hall sensor IST8306.

Solution/Software Partners

MindMics – InvenSense partners with MindMics to produce infrasonic earbuds for artifact compression for in-ear heart health monitoring. MM-TW-01WT infrasonic earbuds use the InvenSense 6-axis motion sensor for heart health monitoring while listening to music and taking calls.

Distribution/Design House Partners

Avnet – We partner with Avnet (an official distributor of TDK) to build RASYN (Renesas Syntiant) AI ML board for predictive maintenance, acoustic event and scene classification, multi sensor fusion applications.

“Ambiq and InvenSense have mutual goals for energy efficiency in battery-powered applications like wearables, hearables, factory automation, and asset trackers,” said Mike Kenyon, VP of Sales at Ambiq. “With InvenSense’s ultra-low power sensors and Ambiq’s lowest power microcontrollers, customers can seamlessly develop solutions with a faster time-to-market.”

“We believe in the power of collaboration to drive progress at TDK. Through our InvenSense Sensor Partner Program, we’re committed to empowering our customers, developers and engineers to pioneer cutting-edge IoT solutions, with access to our leading MEMS sensors, partner solutions, reference designs, and boards,” said Sahil Choudhary, Director Product Marketing, IoT Sensors, at InvenSense, a TDK Group Company.

Glossary

UToF: Ultrasonic Time of flight
PDM: Pulse density modulation
SoC: System on chip
EIS: Electronic image stabilization
OIS: Optical image stabilization
IMU: Inertial measurement unit
PMOD: Peripheral module
ODM: Original design manufacturer
OEM: Original equipment manufacturer

Key InvenSense Sensors

ICM-42670-P IMU – Low power IMU
ICM-45605- Ultra-Low Power IMU with Balanced Gyroscope
ICM-42688-P – Ultra-low noise IMU
T5838 – Low Noise PDM Microphone

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本文由Ray转载自TDK InvenSense Official Website，原文标题为:06.24.24 - TDK launches InvenSense Sensor Partner Program to empower IoT innovation with sensor technology，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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纳芯微电子（NOVOSENSE）信号感知芯片/隔离与接口芯片/驱动与采样芯片选型指南（英文）

描述- NOVOSENSE Microelectronics (NOVOSENSE, SSE Stock Code 688052) is a highly robust & reliable analog and mixed signal Chip company. Since its establishment in 2013, the company has been focusing on sensor, signal chain, and power management, providing comprehensive semiconductor products and solutions, which are widely used in automotive, industrial, information communication and consumer electronic

型号- NSI6602NA-DLAR,NSL21924-Q1,NCA1051,NSI6602VC-Q1SWR,NSI6622NB-Q1SWKR,NCA1051N-Q1SPR,NSM2017,NSI6602NC-Q1SWR,NSM2019,NSM211X,NSI6602A-Q1SWKR,NSM2013,NIRS485,NSIP83086,NSI6622VB-Q1SPOR,NSM2015,NSM2016,NSC9260X,NSHT30-CLAR,NSD1624-Q1SPR,NSM2011,NSM2012,NSI8231,NSI8230,NSD2621C-DQAGR,NSR33XXX,NSC9262,NSC9260,NSI6801LC-DDBR,NSI6602VD-Q1SWKR,NSC9264,NSP1830,NSG65N15K-DQAFR,NST112X,NCA1042C-Q1DNR,NCA1042,NCA1042A-Q1DNHR,NSI8220NX,NSI6622A-DSWKR,NSI6801TB-DDBR,NSD1624-DSPKR,NSP1833,NST7719,NSP1831,NSP1832,NSM1052,NSM1053,NSI8222,NSA2860X,NSI8221,NSI8220,NSE5701 SERIES,NSI6642C-DSPNR,NSM1051,NSI822XC,NSIP8921W1-DSWR,NSI6602MNF-Q1SWTR,NSD11416-Q1STBR,NSI6602VB-Q1SPNR,NCA3491,NSI6642A-DLAR,NSI6602NB-Q1SWKR,NSA2860_TSSOP,NSD1026V,NSI8221CX-DSWR,NSE34050,NCA1043B-Q1DNKR,NCA1044N-Q1SPR,NSIP8944W1-DSWR,NSL21912-Q1,NSM201X,NSI6622A-Q1SPNR,NCA1051N-Q1,NSM2031,NSI6602MNB-Q1SWTR,NSD7310A-DHSPR,NSM2032,NCA1145-Q1SPKR,NSM2033,NSI8210,NSM2034,NST112-DSTR,NSI6601MB-DSPR,NSD1015T,NSI8266CX-DSWR,NSI6602VD-DSWKR,NSI8222CX-DSPR,NSM105X SERIES,NSD1015MT-DSPR,NSC2860X_DQNR,NCA1021S-Q1SPR,NSI8262CX-DSWR,NSPGS2,NCA34XX,NCA3485,NCA1051C,NSI68011C-DSWAR,NSI8221NX,NSI6602NC-DLAMR,NST1002,NSPGS5,NSM211X SERIES,NSI6602VC-DLAMR,NST1001,NCA1042C-Q1,NSI6602A-DLAR,NSI6602ND-DSWKR,NSM105X,NSD16241-Q1SPR,NSI1303M0X,NSM3011,NSPAS3M SERIES,NSI8240CX-DSPR,NSD7312-Q1,NSM3013,NSM3012,NSA2860_SSOP16,NSA2862X,NSI6642B-DSWKR,NSM1071,NSM1072,NSI823XC,NSI6642A-DLAMR,NSD5604N,NSI319X,NSI6642D-DLAR,NSI8100NC,NSI6602B-Q1SWR,NSI6622ND-DSPNR,NSI6601B-DSPR,NSA2860X-QQNR,NSI8210NX,NSI6642D-DSWKR,NSI6602MF-DSWTR,NSD5604E,NIRSP31,NSI6602MNB-DSWTR,NST175,NST1075,NSI6602A-DSPNR,NCA9617A SERIES,NSI68010B-Q1SWAR,NSI1312D,NSI6642B-DSWR,NSI8222NX,NSI6601C-DSPR,NSI6622NB-DLAR,NSIP8841W1-DSWR,NSP1631,NSI8221CX-DSWVR,NSP1632,NSP1630,NSD56008-Q1HTSPR,NSI6622C-DLAR,NSM301X,NSM107X,NSI824XC,NSI6602VA-Q1SPNR,NSI6602ND-DLAR,NSI6801C-DSWFR,NSD3604-Q1,NCA3176,NSI6801MB-DSWVR,NSD3608-Q1QAJR,NSI1312S,NSI6622VB-Q1SWR,NSI6622B-Q1SPNR,NSD5604N-DHTSPR,NSD1624-DLAJR,NSI68011C-Q1SWAR,NSI6602VA-DLAMR,NSI6602NA-DLAMR,NSI6602NB-DSWR,NSD5604E-DHTSTR,NSR35XXX,NSI6622NB-Q1SWR,NSD5604N-Q1HTSPR,NSD1224X,NSI6602C-Q1SPNR,NSI8100W,NSI6622NA-DSPNR,NSIP8844W1-DSWR,NSI6622NB-DSWKR,NSE5702,NSE5701,NSI8100N,NSP183X,NCA1044-Q1DNR,NSI6622NC-DLAR,NCA1021S-Q1DNR,NSI6622VB-Q1SPNR,NCA1044N-Q1DNR,NSD16241-DSPKR,NSI3190,NSI6602VD-DSWR,NPC060N120A-QTOOT,NSI6622NA-Q1SWKR,NSE34050Q,NSD1224LA-DAFR,NSI8241SX,NSI6622NA-Q1SWR,NSI6622NC-Q1SPNR,NSI8231CX-DSWR,NSI1052-DSWR,NSPGL1 SERIES,NSI6622VA-Q1SPOR,NSA2860X_QQNR,NSI6801B-DSWFR,NSI6602B-Q1SPNR,NSI6601WC-DSWVR,NSI6651ASC-Q1SWR,NSC6272,NSI8263CX-DSWR,NSD8310-Q1HTSXR,NSC6273,NSREF31XX,NSI6622ND-DSWR,NSI6622NC-DSPNR,NSI6602NB-DLAR,NSI6602NB-DSPNR,NSA5312,NSI6622VC-Q1SWKR,NSPGL1,NSI6602A-Q1SWR,NSI6622NC-Q1SPOR,NSPGS2 SERIES,NSI6642C-DLAMR,NSR7808,NSI8220WX,NSI8266WX,NSD56008-Q1,NSD5604NE,NSI6622VA-Q1SPNR,NSI6602VB-DSWKR,NSL2161X-Q1,NCA1042BN-Q1SPR,NCA1057-Q1SPR,NCA1043B-Q1,NCA9511,NSI6602A-DSWR,NSC6280,NSI6602NA-Q1SWKR,NSD8308-Q1,NSI6602NC-DSWR,NSI6801TC-DDBR,NSI8242SX,NSI68515AC-DSWR,NSI6602B-DSWKR,NSI6602VD-DLAMR,NPCO60N120A-QTOIT,NSI8220CX-DSWVR,NSI6622NB-DSWR,NST235,NST117,NSI6602VC-DSWKR,NSI6602VC-Q1SWKR,NSI6602MB-DSWDR,NST118,NCA954X SERIES,NSD16242-Q1SPR,NCA9306 SERIES,NCA1044-Q1SPR,NSI6651,NSI6642B-DLAMR,NSI6602C-DSWKR,NSI8240NX,NSE34050 SERIES,NCA1057N-Q1DNR,NSP163X,NSI6602NC-DSPNR,NCA1042BN-Q1,NSI8221WX,NSI66X2,NSI6631ASC-Q1SWR,NSI6602MNC-DSWTR,NCA1042B-Q1DNR,NSI6642,NSI6601C-DSWVR,NIRS2X,NSI6601MB-DSWR,NSI8266SX,NSI6602NB-Q1SPOR,NCA34XX SERIES,NSI6602NC-Q1SPOR,NSD7310A,NSD8306-Q1,NSI6622ND-DLAMR,NSG65N15K,NSD12409-Q1SPR,NSE4250 SERIES,NCA1042CN-DSPR,NSI6602VA-DSWKR,NSI6642D-DLAMR,NCA1051N,NSI6642A-DSWKR,NIRS20N1-DSPR,NIRS21N1-DSPR,NSI6622NA-DLAR,NSC2860X-DQNR,NSI1042-DSWVR,NCA1042C-Q1SPR,NSI6602C-DSWR,NCA1057-Q1DNR,NSI8221CX-DSPR,NPD010N120A-DTOGT,NSI6602VB-Q1SWR,NSI8210CX-DSPR,NSD1026V-QISPR,NSD12416‒Q1,NSI1050-DDBR,NSI8241NX,NSI6602NC-Q1SPNR,NCA1042BN-Q1DNR,NSR10AXX SERIES,NST461,NSD2621X,NCA1042A-Q1,NSI8222WX,NST103,NSI1303D0X,NSI1303E2X,NSI6622A-Q1SWKR,NSI6602VC-DLAR,NSR31 SERIES,NSD16242-DSPR,NCA9555,NSI1052,NSC6360,NSC6362,NSI6622NB-DLAMR,NSI6651ALC-DSWR,NSC6364,NSI6602NA-DSPNR,NSI6622A-DLAR,NSI6622C-Q1SPNR,NCA1042C,NSI8220CX-DSWR,NSI6622C-DSPNR,NSA3166,NCA1042A-Q1SPR,NSIP8941W0-DSWR,NSI6642B-DLAR,NCA1042B-Q1,NSPGD1M,NSPAS3 SERIES,NSD1624-DSPR,NSI6602VA-Q1SWR,NSD1026V-Q1HMSR,NSI8242CX-DSWR,NSI6602MNC-Q1SWTR,NSL2163X-Q1,NST20,NIRS31,NSREF30XX,NCA9545,NSI6622NA-DLAMR,NSI1042,NSI6611,NCA9546,NSI6622B-DSPNR,NCA9306,NCA9548,NSD12416-Q1SPR,NSI6602MC-Q1SWTR,NSI8242NX,NSD8381-Q1QAIR,NSD8308-Q1HTSXR,NCA9617A,NST1001HA,NSI6602VA-DSWR,NSI1303D2X,NSI1050,NSI6601B-DSWVR,NSD7310-DHSPR,NSI6601,NSD731X-Q1,NCA1057N-Q1SPR,NSR7808GXX,NSD7312-Q1HSPR,NSI6602VB-DLAMR,NSI6602MNF-DSWTR,NSD1026V-DHMSR,NSA3300,NSI6602C-Q1SWKR,NSC2860X,NSD11416‒Q1,NSI6622NB-Q1SPNR,NCA1051N-DSPR,NSI6611ASC-DSWR,NSI22C11,NSI8230CX-DSWR,NSI6801B-DSPR,NSI6622A-DSPNR,NSD12409‒Q1,NSD5604NE-DHTSTR,NSPDSX SERI

选型指南 - 纳芯微电子 - April 2024 PDF 英文下载

ICM-456xy

型号- ICM-45605,ICM-45686,ICM-45631,ICM-456XY

数据手册 - TDK INVENSENSE - Revision: 1.1 - 05/11/2023 PDF 英文下载

ICM-42688-P Datasheet

型号- ICM-42688-P,ICM-42605,ICM-42688-P†,ICM-40607,ICM-42686-P

数据手册 - TDK INVENSENSE - Revision: 1.7 - 12/01/2022 PDF 英文下载查看更多版本

ICM-45605 High Performance 6-Axis MEMS MotionTracking Device Datasheet

型号- ICM-45605

数据手册 - TDK INVENSENSE - Revision: 1.0 - 07/25/2024 PDF 英文下载

TDK InvenSense（应美盛）SmartSonic™超声波ToF（飞行时间）传感器选型指南

描述- TDK's ultrasonic Time-of-Flight (ToF) sensors integrate a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (System on Chip) in a miniature reflowable package. These sensor solutions are capable of ranging to targets of any composition up to 5 meters in any lighting condition, making them ideal for a variety of applications.

型号- ICU-10201,ICU-20201,CH101,CH201

选型指南 - TDK INVENSENSE - 2023/1/14 PDF 英文下载

ROHM（罗姆）传感器产品选型指南（英文）

目录- Company Profile Motion Sensors Environment Sensors Interface Wireless Communication Sensor Control Evaluation Kits R&D Sensors Thin-Film Piezoelectric MEMS Service Package

型号- BU52492NUZ,BH1790GLC,BU52274NUZ,BU52040HFV,WQFN32,WSOF5,WQFN40,WSOF6,RLD82PZJ1,SIR-568ST3F,RPMD-0100,TCM 310,ML7396D,RPT-38PB3F,ML7396A,RLD94PZJ5,BU21170 MUV,BU52074GWZ,BU21180FS,RLD94PZJ7,SOP16,RPR-0521RS,USB 400J,RPI- 441C1E,STM 431J,KXG07,ECO 200,BH1900NUX,KXG08,BU52073GWZ,BU21077MUV,BU21029MUV,VQFN028V5050,KX022-1020,BP35A1,BM1386GLV,BP35C2,BM1383AGLV,KX122-1037.KX122-1037,BP35C0,VQFN024V4040,SIM-22ST,BU21025GUL,PTM 330,BH1620FVC,ML7404,ML7406,PTM 210,BH1682FVC,WSON008X2120,RLD85PZJ4,WLGA010V28,ML7416N,BU52075GWZ,BDJXXX0HFV,BU52098GWZ,RPI-441C1,BH1726NUC,RPI-0352E,BD9251FV,BH1749NUC,BU21170MUV,BD1020HFV,BU52493NUZ,RPI-222,SSOP5,VSON008X2030,KX122-1037,RPI-221,RLD85NZJ4,PTM 210J,SSON004X1216,BU52494NUZ,1053KX222,ML630Q464,RLD84NZJ2,ML630Q466,KMX62-1031,BU52092GWZ,RPT-34PB3F,KX123-6000,BH1721FVC,ML7066,BU21079F,K X112-10 42,KX224-1053,BU52097GWZ,RPI-441C1E,KX126-1063,BH1792GLC,PTM 430J,BU52273NUZ,RLD84PZJ2,RPR- 0521RS,STM 429J,ML610Q793,STM 300,ML620Q503H,BU21027MUV,TCM 410J,ML7344J,ML7344C,BU21023GUL,BH1680FVC,KX222,BM1422AGMV,MK71251-02,MK71251-01,SIM-030ST,BP3580,KX112-1042,ML620Q504H,BH1730FVC,BU52054GWZ,MK71050-03,BP359B,ML7345D,ML7345C,BP3599,SIR-34ST3F,RPI-352,BP3595,BGA81,KXTC9,RPT-37PB3F,BP3591,BU52272NUZ,BU52792GWZ,SIM-040ST,KX126 -1063,ML630Q791,VCSP50L,SIR-563ST3F,BH1603FVC,RLD94NZJ7,RLD94NZJ5,RPI-125,RPI-246,RPI-121,USB 300,C-QFN24,RPI-122,RPI-243,BU21028FV-M,RPM-22PB,SIR-341ST3F,BU21026MUV,KX222-1054,SSOP-B20,VQFN020V4040,SSOP-B28,SIR-56ST3F,BU21023MUV,BU52078GWZ,UCSP35L,HVSOF5,ML62Q1000,KX124-1051,SSOP-B14,KXCJB-1041,KXTJ3-1057,BD7411G,BU52095GWZ,BU21072MUV,K X TJ3 -10 57,BU52177GXZ,BU21078FV,KXG03,KXG07-1080,BU21024FV-M,RPI-0226,ML610Q794G,MK71251-02B,MK71251-02A,RPI- 441C1,BU52077GWZ,VQFN48,ML7345,STM 320,RLD82NZJ1,HSM 100,BU52055GWZ,BU21029GUL,RPM-20PB,STM 400J,BU52072GWZ,SIM-20ST,KX123,KX122,BU21078MUV,RPI-0125,STM 331,ML8540

选型指南 - ROHM - Vol.3.1 - 05.2018 PDF 英文下载