TDK Launches InvenSense Sensor Partner Program to Empower IoT innovation with Sensor Technology
InvenSense Sensor Partners enable efficient prototyping and development for applications such as wearables, hearables, healthcare devices, drones, other IoT and robotics
Partners offer reference designs, evaluation kits, modules and software algorithms with InvenSense MEMS sensors to help build IoT solutions, accelerating time-to-market and reducing total costs
Current partners include Renesas, Ambiq, Qualcomm Technologies, Alif Semiconductor, Ambarella, AONDevices, Syntiant, Isentek, MindMics and Avnet, with additional partners added quarterly
Partners Renesas and Ambiq join TDK in exhibiting joint solutions at Sensors Converge, June 25-26
June 24, 2024——TDK Corporation (TSE:6762) announces the InvenSense Sensor Partner Program to empower faster time-to-market and innovation using InvenSense MEMS sensors in IoT, wearable, hearable, AR, VR and robotics applications. Through these new ecosystem partnerships, more engineers and developers can access leading InvenSense sensor technology along with the reference designs, software solutions and development kits that help them bring product designs to reality.
The InvenSense Sensor Partner Program enables ODMs, OEMs, developers, engineers and tech enthusiasts to work with a wide variety of InvenSense MEMS sensors – motion sensors, industrial motion modules, microphones, pressure sensors and ultrasonic sensors. Partner reference kits serve as real-world examples of how InvenSense MEMS sensors work with partner products to create more accurate, reliable and efficient solutions across industries. This not only improves time to market but also reduces the cost of ownership for building IoT solutions.
“Renesas is thrilled to be part of the InvenSense program, as they provide a variety of high accuracy sensors that are integrated into Renesas Quick Connect Studio platform. This helps customers quickly develop system solutions for IoT, home automation, consumer and industrial applications,” said Pooja Bhadrappanavar, Renesas product marketing lead.
Current InvenSense Sensor Partner Program members include:
Microcontroller/SOC partners:
Renesas Electronics Corporation – InvenSense partners with Renesas to empower a wide range of industrial, home electronics and IoT applications. InvenSense MEMS sensors have been integrated on the Renesas Quick Connect platform as a sensor PMOD board (QCIoT-42688P), enabling users to select these sensors to rapidly prototype IoT solutions on Renesas MCU platforms. The AI Kit from Renesas also comes with the ICM-42670-P PMOD boards and drivers.
Ambiq Micro – InvenSense partners with Ambiq Micro to empower ultra-low-power applications such as wearables and hearables. InvenSense motion sensors and microphones have been integrated on the energy harvesting reference design and ultra-low-power voice activation kits with the latest Apollo510 SOC; Ambiq leverages their low power/high compute leadership into power consumption constrained battery-powered applications, for markets such as healthcare, cargo/human/pet trackers, building access and self-healing conditional factory monitoring.
Qualcomm Technologies, Inc. – InvenSense is collaborating with Qualcomm Technologies to bring the latest innovation and technology solutions to the robotics market. As the sensor provider for several Qualcomm® Robotics Platforms, TDK has worked to create the “TDK Mezzanine” board supported on all Qualcomm Robotics Platforms. This mezzanine platform allows any customer who plans to utilize Qualcomm Robotics processors to evaluate and develop upon all the necessary sensor and motor controller technology needed for any robotic product quickly and efficiently.
Alif semiconductor – InvenSense partners with Alif Semiconductor to empower high compute AI/ML applications. TDK motion sensors and microphones have been integrated on an AK-E7-AIML AppKit, powered by Alif Ensemble E7 Fusion processor, enabling quick software development and evaluation for Edge Machine Learning use cases.
AI chip partners
Ambarella – InvenSense partners with Ambarella and its AI vision SOCs to enable Electronic Image Stabilization (EIS) for security cameras, video conference cameras and other applications, as well as Robotics simultaneous localization and mapping (SLAM) functions. Ambarella’s entire portfolio of CVflow® AI SOC evaluation kits, including the newest CV72S EVK, come with InvenSense motion sensors integrated for evaluation and development of Optical Image Stabilization (OIS) and EIS functions.
AONDevices – InvenSense partners with AONDevices (AON) SOCs to empower ultra-low power voice activation, speech and sound detection applications. InvenSense microphones and motion sensors have been integrated to AON 1100/1120 evaluation kits for quick evaluation and prototyping of voice related applications on TWS, speakers and hearables.
Syntiant – InvenSense partners with Syntiant SOC for acoustic and motion event detection applications. InvenSense motion sensors and microphones are integrated on the RASynBoard which is an ultra-low power, edge AI/ML board, based on a Syntiant Neural Decision Processor, and a Renesas RA6M4 host MCU.
Sensor Partner
Isentek – InvenSense partners with Isentek 3D Hall sensors for 9-axis IoT applications such as Asset Tracking, Drones, navigation, e-bikes and more. InvenSense sensors have been integrated on 9-axis evaluation kits DK-42688-9x and DK-42670-9x, with Isentek 3D hall sensor IST8306.
Solution/Software Partners
MindMics – InvenSense partners with MindMics to produce infrasonic earbuds for artifact compression for in-ear heart health monitoring. MM-TW-01WT infrasonic earbuds use the InvenSense 6-axis motion sensor for heart health monitoring while listening to music and taking calls.
Distribution/Design House Partners
Avnet – We partner with Avnet (an official distributor of TDK) to build RASYN (Renesas Syntiant) AI ML board for predictive maintenance, acoustic event and scene classification, multi sensor fusion applications.
“Ambiq and InvenSense have mutual goals for energy efficiency in battery-powered applications like wearables, hearables, factory automation, and asset trackers,” said Mike Kenyon, VP of Sales at Ambiq. “With InvenSense’s ultra-low power sensors and Ambiq’s lowest power microcontrollers, customers can seamlessly develop solutions with a faster time-to-market.”
“We believe in the power of collaboration to drive progress at TDK. Through our InvenSense Sensor Partner Program, we’re committed to empowering our customers, developers and engineers to pioneer cutting-edge IoT solutions, with access to our leading MEMS sensors, partner solutions, reference designs, and boards,” said Sahil Choudhary, Director Product Marketing, IoT Sensors, at InvenSense, a TDK Group Company.
Glossary
UToF: Ultrasonic Time of flight
PDM: Pulse density modulation
SoC: System on chip
EIS: Electronic image stabilization
OIS: Optical image stabilization
IMU: Inertial measurement unit
PMOD: Peripheral module
ODM: Original design manufacturer
OEM: Original equipment manufacturer
Key InvenSense Sensors
ICM-42670-P IMU – Low power IMU
ICM-45605- Ultra-Low Power IMU with Balanced Gyroscope
- |
- +1 赞 0
- 收藏
- 评论 0
本文由Ray转载自TDK InvenSense Official Website,原文标题为:06.24.24 - TDK launches InvenSense Sensor Partner Program to empower IoT innovation with sensor technology,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
TDK InvenSense全面量产ASIL-B惯性测量单元IAM-20685,支持自动泊车和视觉系统等广泛ADAS应用
TDK集团宣布IAM-20685正式量产,这是按照ISO 26262标准为ADAS和自动驾驶汽车系统开发的最小ASIL-B单片6轴MEMS IMU。支持自动泊车、ADAS域控制器和视觉系统等广泛的ADAS应用。该产品简化了汽车ADAS系统的开发,也攻克了其他的技术弱点,这得益于其6轴集成和组件级别的ASIL-B兼容性。在市场上,其高性能和最小尺寸意味着其在集成定位、视觉和雷达模块中是最佳的IMU。
TDK Starts Full-scale Production of SmartAutomotive™ IAM-20685, ASIL-B monolithic 6-axis MEMS IMU to Enhance Automotive ADAS Applications
“Thanks to its 6-axis integration and its ASIL-B compliancy at the component level, the IAM-20685 simplifies automotive ADAS systems development, helping overcome weaknesses of other technologies,“ said Alberto Marinoni, Sr Director – Product Marketing Automotive at InvenSense, a TDK Group company.
TDK to Showcase the Power of Its Advanced Sensor Solutions at Sensors Converge 2024
TDK sensor solutions help further the company’s vision of transforming designs into reality. At TDK’s Sensors Converge booth, attendees can interact with innovations in sound, motion, pressure, and more. TDK technology will come to life in the form of Ribbit the Robot, an interactive roaming robot showcasing the broad spectrum of TDK technologies in a single use case. Ribbit will chat with participants about new possibilities for applications in IoT, robotics, automotive, and beyond.
TE Connectivity(泰科)传感器选型指南
目录- Company Profile DIGITAL COMPONENT SENSOR DEVELOPMENT TOOLS FLOW SENSORS FORCE SENSORS HUMIDITY SENSORS LIQUID LEVEL SENSORS PHOTO OPTIC SENSORS PIEZO FILM SENSORS POSITION SENSORS PRESSURE SENSORS RATE AND INERTIAL SENSORS SCANNERS AND SYSTEMS SPEED SENSORS TEMPERATURE SENSORS TORQUE SENSORS ULTRASONIC SENSORS VIBRATION SENSORS WATER LEVEL SENSORS
型号- 7504A,3255A,T500,8011-AR,8011-AP,CD9515,DSD 25,68CM1,FS-90,FS-91,6900,4602,4604,7505A,MS4525DO,DSD 17,TSYS02D,CWW600,D5100,4610,MS8607,EPRB,XP5,805,5903 SERIES,808,89BSD,T400,4630,SDT1,P1200,606M1,PS2011AB,LDTC FAMILY,DSD 40,ELM-4000,3058A,MS5803-01BA,FMT,SIL-3,M7100,700,LS809-31,EGCS-D5,TLH100,4332M3,FTP520,MS54XX,EGCS-D0,ESP 64HD,XL403D,AST46HA,832,FN7110,HSTA,834,EB,PS501,LDM-1000,U86B,DP86,KMXP 1000,52M30,PS2021AB,M905,RVIT-Z,603,LS509-51,ELM-5000,TS318-3B0814,FN4070,H005,PT500,H009,610,RCS01-10,31207B,FTP540,CWW850,PML 1000,LDS309-11N,EPB-PW,EVS722-51,CWW1000,FN9630,GC,FN9635,FLDT1,U7100,FTP530,85F,FN4080,834M1,HTU2X,ARD154,EPB,EGAXT,VS804-21,HC,65210E,EPL,7108A,86A,CLP,AST46SW,HR,MS52XX,KMXP 2000,AST4510,KPSI 730,KPSI 735,FTP560,633,634,7531A,XFTC300,Y12AD,18FR,FTP552,FTP553,FTP554,AST4401,AST4400,AST4520,KPSI 720,U5700,KPSI 600,FN4055,KPSI 601,400,MS5803-30BA,FTP551,31206B,FN9620,DPG,TRUBLUE 255,LL-01,FN7325,DPL,DPN,64B,40A,64C,40B,HTF3000LF,52F,3022,KPSI 750,KMT37,FN3050,TPT,64X,KMT39,9916,53A,AST43LP,ESP 16HD,AST4500,KPSI 500,KPSI 501,KPSI 745,3028,86BSD,8811-01,PM50,KMA36,TSYS01,LT,TSYS02,ATA-2001,KMT36H,P900,LBB,G-SERIES,PM81,FN3030,DSD,3038,DSF,CM-01,DSH,8021-AP,8021-AR,DSL,PM83,CD375,ML,DT1,4020,TSD,6200,DSS,AST46PT,AST44LP,805M1,AST4600,DSY,TSD305,7500A,DC-SE,EGAXT3,4030,LDTC,XPM10,MS4515DO,KPSI 710,PT100,MSP300,AST20HA,XS-C,XS-D,7501A,LL-10,HTU3535PVBM/WIRE,PT101,6100,SSI,HTG351XCH,AST2000H2,KPSI 700,SSR,KPSI 705,TRUBLUE 275,LS304-31,LMM-H04,LMM-H03,FN3148,TSYS,DSD 70,7502A,7514A,P700,APS,4810A,CD1110,KPSI 330,8021-VP,8021-VR,KPSI 335,AST4000,7135A,5905 SERIES,400 SERIES,XFL212R,6000,LVM-110,KMXP 5000,KPSI 320,AST44XX,8711-01,121,FN3002,AST5100,LCS-03,FN3000,CS1120,R36,PCA 375,U5300,RT9,RT8,M3200,7100A,9400,TLH600,CPA150,HS1101LF,M210,AST20SW,KPSI 351,KPSI 353,HTU383X/WIRE,130,IT9000,KPSI 355,AST5300,AST4100,SG,CD1140,XPM4,SK,7101A,SM,FX19,MSP100,SP,EPM-5000,TPT300V,PM101,MSP340,SR,12FR GP,PT9000,AST45XX,KPSI 342,1201F,MT3A,ACH-01,SL-630,M5600,7102A,PT1000,TS,EL20-S458,8011-VP,MS5805,XFU400,MS5803,MP 2000,P981,HSTAR,KPSI 30,HTM2500LF,CS1210,AST5400,E-SERIES,MLP,FN1010,HTU2XF,HM1520LF,TS305-10C50,24FR,TRUBLUE 585,16MS,52,8011-VR,KPSI 27,MS32,KPSI 28,58,MS1451,XPM6,160,AST46XX,ESP 32HD DTC,PT1,161,ACCUSTAR EA,AST4200,PT5,DSH 16,DOG2,FX29,MMX,12FR,ESP 64HD DTC,7104A,TRUBLUE 575,FN2114,US300,9FR,9146-R,GHSE,PTX,85BSD,7105A,MS5837,9216,KMA36A,AST20PT,AST4300,MS1471,9146-T,808M1,U5600,FN2570,CD1050,EPM-4001,XP,82,MS5525DSO,85,86,TRUBLUE 555,FS-01,89,MS5607,FS-02,FS-05,FS-06,ED32I,MS5840,PS2031AB,8032-01,FN2420,R60D,3052A,154BSD,P9000,MS5611,XFC200R,EPIH,ELAF,ESP 32HD,M12,3801A,1620,KMY,65210ES,KMZ,FN2317,M150,AST46DS,11206AC,10FR,PS831,8021-01,EGCS-D1S,KPSI 300DS,1630,820M1,XPC10,TSEV,53AF,140A,SL-900,MS5637,CD1124T,EVS312-11N,MT2,MT3,CS1060,CD1095,832M1,VCS-06,MTA,VCS-04,3700,M5200,FN7080,P105,P101,9022,FS19,7131A,FC22,FC23,4630M12,9034,142A,9038,154N,4801A,9032,LIM-420,9033,5905,GHSER,7132A,LTA,ACCUSTAR IP66,LTB,4630M14,5903,PT8000,P125,TS318-5C50,T600,8102A,LTR,HM1500LF,R30A,GHSER 750-A,HTU21D,8011-01,PS801,700 SERIES,KPSI 380,NDT-1,FS20,FS22,4835A,AST43XX,D-SERIES,FS23,U5200,1201,1200,HPGS 750,FCA7300,AD-101,PS811,VS309-51N,KMXP,11207AC
TDK InvenSense(应美盛)SmartMotion®MEMS运动传感器选型表
目录- Motion Sensor
型号- ICM-42688-P,ICM-42605,IAM-20380,ICM-42688-V,IIM-42352,ICM-40609-D,IIM-42351,IAM-20381,ICM-42670-P,ICM-40627
了解IMU传感器偏移
描述- 本文介绍了IMU传感器偏移的概念,包括部件级偏移和板级偏移的区别,以及如何计算和确定传感器偏移。文章详细解释了偏移产生的原因,提供了两种偏移计算方法,并给出了实际应用中的计算示例。此外,还提到了如何处理初始偏移超出规格的情况。
ROHM(罗姆)传感器产品选型指南(英文)
目录- Company Profile Motion Sensors Environment Sensors Interface Wireless Communication Sensor Control Evaluation Kits R&D Sensors Thin-Film Piezoelectric MEMS Service Package
型号- BU52492NUZ,BH1790GLC,BU52274NUZ,BU52040HFV,WQFN32,WSOF5,WQFN40,WSOF6,RLD82PZJ1,SIR-568ST3F,RPMD-0100,TCM 310,ML7396D,RPT-38PB3F,ML7396A,RLD94PZJ5,BU21170 MUV,BU52074GWZ,BU21180FS,RLD94PZJ7,SOP16,RPR-0521RS,USB 400J,RPI- 441C1E,STM 431J,KXG07,ECO 200,BH1900NUX,KXG08,BU52073GWZ,BU21077MUV,BU21029MUV,VQFN028V5050,KX022-1020,BP35A1,BM1386GLV,BP35C2,BM1383AGLV,KX122-1037.KX122-1037,BP35C0,VQFN024V4040,SIM-22ST,BU21025GUL,PTM 330,BH1620FVC,ML7404,ML7406,PTM 210,BH1682FVC,WSON008X2120,RLD85PZJ4,WLGA010V28,ML7416N,BU52075GWZ,BDJXXX0HFV,BU52098GWZ,RPI-441C1,BH1726NUC,RPI-0352E,BD9251FV,BH1749NUC,BU21170MUV,BD1020HFV,BU52493NUZ,RPI-222,SSOP5,VSON008X2030,KX122-1037,RPI-221,RLD85NZJ4,PTM 210J,SSON004X1216,BU52494NUZ,1053KX222,ML630Q464,RLD84NZJ2,ML630Q466,KMX62-1031,BU52092GWZ,RPT-34PB3F,KX123-6000,BH1721FVC,ML7066,BU21079F,K X112-10 42,KX224-1053,BU52097GWZ,RPI-441C1E,KX126-1063,BH1792GLC,PTM 430J,BU52273NUZ,RLD84PZJ2,RPR- 0521RS,STM 429J,ML610Q793,STM 300,ML620Q503H,BU21027MUV,TCM 410J,ML7344J,ML7344C,BU21023GUL,BH1680FVC,KX222,BM1422AGMV,MK71251-02,MK71251-01,SIM-030ST,BP3580,KX112-1042,ML620Q504H,BH1730FVC,BU52054GWZ,MK71050-03,BP359B,ML7345D,ML7345C,BP3599,SIR-34ST3F,RPI-352,BP3595,BGA81,KXTC9,RPT-37PB3F,BP3591,BU52272NUZ,BU52792GWZ,SIM-040ST,KX126 -1063,ML630Q791,VCSP50L,SIR-563ST3F,BH1603FVC,RLD94NZJ7,RLD94NZJ5,RPI-125,RPI-246,RPI-121,USB 300,C-QFN24,RPI-122,RPI-243,BU21028FV-M,RPM-22PB,SIR-341ST3F,BU21026MUV,KX222-1054,SSOP-B20,VQFN020V4040,SSOP-B28,SIR-56ST3F,BU21023MUV,BU52078GWZ,UCSP35L,HVSOF5,ML62Q1000,KX124-1051,SSOP-B14,KXCJB-1041,KXTJ3-1057,BD7411G,BU52095GWZ,BU21072MUV,K X TJ3 -10 57,BU52177GXZ,BU21078FV,KXG03,KXG07-1080,BU21024FV-M,RPI-0226,ML610Q794G,MK71251-02B,MK71251-02A,RPI- 441C1,BU52077GWZ,VQFN48,ML7345,STM 320,RLD82NZJ1,HSM 100,BU52055GWZ,BU21029GUL,RPM-20PB,STM 400J,BU52072GWZ,SIM-20ST,KX123,KX122,BU21078MUV,RPI-0125,STM 331,ML8540
TDK InvenSense IMU PCB设计和MEMS装配指南,适用于ICM/IAM/IIM-4xxxx、2xxxx和MPU-6xxx产品
描述- 本资料为TDK InvenSense公司提供的IMU产品PCB设计、传感器安装和处理指南,适用于ICM/IAM/IIM-4xxxx、2xxxx和MPU-6xxx系列产品。内容包括PCB设计规范、PCB放置和板安装指南、IMU产品处理指南等,旨在确保IMU产品在最终产品中的最高性能。指南涵盖了PCB设计、布局、放置、热管理、振动和冲击防护、存储和处理等方面的详细要求。
ICM-42688-P规格书
描述- 该资料介绍了ICM-42688-P,一款高精度的6轴MEMS运动跟踪器件。它集成了3轴陀螺仪和3轴加速度计,支持I3CSM、I2C和SPI串行通信接口,具备低功耗唤醒功能。该设备具有高度精确的外部时钟输入,可减少系统级灵敏度误差,提高姿态测量精度,并降低温度敏感度和设备间差异。此外,还提供了先进的APEX运动处理引擎,用于手势识别、活动分类和计步器等功能。
型号- ICM-42688-P,ICM-42605,ICM-42688-P†,ICM-40607,ICM-42686-P
DK-45605和DK-45686 SmartMotion开发平台(第一版)硬件用户指南
描述- 本指南介绍了TDK InvenSense SmartMotion开发平台(版本I)的硬件使用。该平台是一个全面的开发系统,用于评估和开发基于InvenSense运动传感器的解决方案。平台集成了Microchip SAMG55微控制器和嵌入式调试器,支持多种传感器和开发套件,包括DK-45605和DK-45686。平台提供必要的软件,包括InvenSense MotionLink开发工具和嵌入式运动驱动程序,支持Atmel Studio和Microchip Xplained Pro扩展板。
型号- ICM-45605,DK-45605,ICM-45686,DK-45686
Sekorm is an Authorized Distributor of MERRY that is a Famous Acoustic Sensors Manufacturer
Sekorm said: “The new generation of electroacoustic products will play a more critical role, bringing more imagination and applications to human life. This cooperation with Merry will jointly promote business development and product extension.”
TDK InvenSense ICM-45605和ICM-45686用户指南
描述- 本指南详细介绍了TDK InvenSense的ICM-45605和ICM-45686双接口传感器的使用。内容包括I2C主接口配置、FIFO数据流管理、APEX运动算法支持、操作功率模式、自检功能、外部输入时钟配置、FSYNC同步操作等。指南涵盖了传感器的主要功能、配置方法和应用细节。
型号- ICM-45605,ICM-45686
TDK InvenSense(应美盛)SmartSound™数字MEMS麦克风选型指南
型号- T5837,T5848,T5838,MD-54001-D58
电子商城
品牌:TDK InvenSense
品类:6-axis MEMS MotionTracking device
价格:¥30.1116
现货: 0
品牌:TDK InvenSense
品类:6-axis MEMS MotionTracking device
价格:¥16.0885
现货: 0
品牌:EPSON
品类:USB Evaluation Cable Interface / Breakout Board for EPSON IMU
价格:
现货: 0
现货市场
服务
满足150W内适配器、PD快充、氮化镓快充等主流产品测试需要;并可查看被测开关电源支持协议,诱导多种充电协议输出,结合电子负载和示波器进行高精度测试。测试浪涌电流最大40A。支持到场/视频直播测试,资深专家全程指导。
实验室地址: 深圳 提交需求>
登录 | 立即注册
提交评论