TDK Launches InvenSense Sensor Partner Program to Empower IoT innovation with Sensor Technology
InvenSense Sensor Partners enable efficient prototyping and development for applications such as wearables, hearables, healthcare devices, drones, other IoT and robotics
Partners offer reference designs, evaluation kits, modules and software algorithms with InvenSense MEMS sensors to help build IoT solutions, accelerating time-to-market and reducing total costs
Current partners include Renesas, Ambiq, Qualcomm Technologies, Alif Semiconductor, Ambarella, AONDevices, Syntiant, Isentek, MindMics and Avnet, with additional partners added quarterly
Partners Renesas and Ambiq join TDK in exhibiting joint solutions at Sensors Converge, June 25-26
June 24, 2024——TDK Corporation (TSE:6762) announces the InvenSense Sensor Partner Program to empower faster time-to-market and innovation using InvenSense MEMS sensors in IoT, wearable, hearable, AR, VR and robotics applications. Through these new ecosystem partnerships, more engineers and developers can access leading InvenSense sensor technology along with the reference designs, software solutions and development kits that help them bring product designs to reality.
The InvenSense Sensor Partner Program enables ODMs, OEMs, developers, engineers and tech enthusiasts to work with a wide variety of InvenSense MEMS sensors – motion sensors, industrial motion modules, microphones, pressure sensors and ultrasonic sensors. Partner reference kits serve as real-world examples of how InvenSense MEMS sensors work with partner products to create more accurate, reliable and efficient solutions across industries. This not only improves time to market but also reduces the cost of ownership for building IoT solutions.
“Renesas is thrilled to be part of the InvenSense program, as they provide a variety of high accuracy sensors that are integrated into Renesas Quick Connect Studio platform. This helps customers quickly develop system solutions for IoT, home automation, consumer and industrial applications,” said Pooja Bhadrappanavar, Renesas product marketing lead.
Current InvenSense Sensor Partner Program members include:
Microcontroller/SOC partners:
Renesas Electronics Corporation – InvenSense partners with Renesas to empower a wide range of industrial, home electronics and IoT applications. InvenSense MEMS sensors have been integrated on the Renesas Quick Connect platform as a sensor PMOD board (QCIoT-42688P), enabling users to select these sensors to rapidly prototype IoT solutions on Renesas MCU platforms. The AI Kit from Renesas also comes with the ICM-42670-P PMOD boards and drivers.
Ambiq Micro – InvenSense partners with Ambiq Micro to empower ultra-low-power applications such as wearables and hearables. InvenSense motion sensors and microphones have been integrated on the energy harvesting reference design and ultra-low-power voice activation kits with the latest Apollo510 SOC; Ambiq leverages their low power/high compute leadership into power consumption constrained battery-powered applications, for markets such as healthcare, cargo/human/pet trackers, building access and self-healing conditional factory monitoring.
Qualcomm Technologies, Inc. – InvenSense is collaborating with Qualcomm Technologies to bring the latest innovation and technology solutions to the robotics market. As the sensor provider for several Qualcomm® Robotics Platforms, TDK has worked to create the “TDK Mezzanine” board supported on all Qualcomm Robotics Platforms. This mezzanine platform allows any customer who plans to utilize Qualcomm Robotics processors to evaluate and develop upon all the necessary sensor and motor controller technology needed for any robotic product quickly and efficiently.
Alif semiconductor – InvenSense partners with Alif Semiconductor to empower high compute AI/ML applications. TDK motion sensors and microphones have been integrated on an AK-E7-AIML AppKit, powered by Alif Ensemble E7 Fusion processor, enabling quick software development and evaluation for Edge Machine Learning use cases.
AI chip partners
Ambarella – InvenSense partners with Ambarella and its AI vision SOCs to enable Electronic Image Stabilization (EIS) for security cameras, video conference cameras and other applications, as well as Robotics simultaneous localization and mapping (SLAM) functions. Ambarella’s entire portfolio of CVflow® AI SOC evaluation kits, including the newest CV72S EVK, come with InvenSense motion sensors integrated for evaluation and development of Optical Image Stabilization (OIS) and EIS functions.
AONDevices – InvenSense partners with AONDevices (AON) SOCs to empower ultra-low power voice activation, speech and sound detection applications. InvenSense microphones and motion sensors have been integrated to AON 1100/1120 evaluation kits for quick evaluation and prototyping of voice related applications on TWS, speakers and hearables.
Syntiant – InvenSense partners with Syntiant SOC for acoustic and motion event detection applications. InvenSense motion sensors and microphones are integrated on the RASynBoard which is an ultra-low power, edge AI/ML board, based on a Syntiant Neural Decision Processor, and a Renesas RA6M4 host MCU.
Sensor Partner
Isentek – InvenSense partners with Isentek 3D Hall sensors for 9-axis IoT applications such as Asset Tracking, Drones, navigation, e-bikes and more. InvenSense sensors have been integrated on 9-axis evaluation kits DK-42688-9x and DK-42670-9x, with Isentek 3D hall sensor IST8306.
Solution/Software Partners
MindMics – InvenSense partners with MindMics to produce infrasonic earbuds for artifact compression for in-ear heart health monitoring. MM-TW-01WT infrasonic earbuds use the InvenSense 6-axis motion sensor for heart health monitoring while listening to music and taking calls.
Distribution/Design House Partners
Avnet – We partner with Avnet (an official distributor of TDK) to build RASYN (Renesas Syntiant) AI ML board for predictive maintenance, acoustic event and scene classification, multi sensor fusion applications.
“Ambiq and InvenSense have mutual goals for energy efficiency in battery-powered applications like wearables, hearables, factory automation, and asset trackers,” said Mike Kenyon, VP of Sales at Ambiq. “With InvenSense’s ultra-low power sensors and Ambiq’s lowest power microcontrollers, customers can seamlessly develop solutions with a faster time-to-market.”
“We believe in the power of collaboration to drive progress at TDK. Through our InvenSense Sensor Partner Program, we’re committed to empowering our customers, developers and engineers to pioneer cutting-edge IoT solutions, with access to our leading MEMS sensors, partner solutions, reference designs, and boards,” said Sahil Choudhary, Director Product Marketing, IoT Sensors, at InvenSense, a TDK Group Company.
Glossary
UToF: Ultrasonic Time of flight
PDM: Pulse density modulation
SoC: System on chip
EIS: Electronic image stabilization
OIS: Optical image stabilization
IMU: Inertial measurement unit
PMOD: Peripheral module
ODM: Original design manufacturer
OEM: Original equipment manufacturer
Key InvenSense Sensors
ICM-42670-P IMU – Low power IMU
ICM-45605- Ultra-Low Power IMU with Balanced Gyroscope
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本文由Ray转载自TDK InvenSense Official Website，原文标题为:06.24.24 - TDK launches InvenSense Sensor Partner Program to empower IoT innovation with sensor technology，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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SERIES,NSI6642C-DSPNR,NSM1051,NSI822XC,NSIP8921W1-DSWR,NSI6602MNF-Q1SWTR,NSD11416-Q1STBR,NSI6602VB-Q1SPNR,NCA3491,NSI6642A-DLAR,NSI6602NB-Q1SWKR,NSA2860_TSSOP,NSD1026V,NSI8221CX-DSWR,NSE34050,NCA1043B-Q1DNKR,NCA1044N-Q1SPR,NSIP8944W1-DSWR,NSL21912-Q1,NSM201X,NSI6622A-Q1SPNR,NCA1051N-Q1,NSM2031,NSI6602MNB-Q1SWTR,NSD7310A-DHSPR,NSM2032,NCA1145-Q1SPKR,NSM2033,NSI8210,NSM2034,NST112-DSTR,NSI6601MB-DSPR,NSD1015T,NSI8266CX-DSWR,NSI6602VD-DSWKR,NSI8222CX-DSPR,NSM105X SERIES,NSD1015MT-DSPR,NSC2860X_DQNR,NCA1021S-Q1SPR,NSI8262CX-DSWR,NSPGS2,NCA34XX,NCA3485,NCA1051C,NSI68011C-DSWAR,NSI8221NX,NSI6602NC-DLAMR,NST1002,NSPGS5,NSM211X SERIES,NSI6602VC-DLAMR,NST1001,NCA1042C-Q1,NSI6602A-DLAR,NSI6602ND-DSWKR,NSM105X,NSD16241-Q1SPR,NSI1303M0X,NSM3011,NSPAS3M SERIES,NSI8240CX-DSPR,NSD7312-Q1,NSM3013,NSM3012,NSA2860_SSOP16,NSA2862X,NSI6642B-DSWKR,NSM1071,NSM1072,NSI823XC,NSI6642A-DLAMR,NSD5604N,NSI319X,NSI6642D-DLAR,NSI8100NC,NSI6602B-Q1SWR,NSI6622ND-DSPNR,NSI6601B-DSPR,NSA2860X-QQNR,NSI8210NX,NSI6642D-DSWKR,NSI6602MF-DSWTR,NSD5604E,NIRSP31,NSI6602MNB-DSWTR,NST175,NST1075,NSI6602A-DSPNR,NCA9617A SERIES,NSI68010B-Q1SWAR,NSI1312D,NSI6642B-DSWR,NSI8222NX,NSI6601C-DSPR,NSI6622NB-DLAR,NSIP8841W1-DSWR,NSP1631,NSI8221CX-DSWVR,NSP1632,NSP1630,NSD56008-Q1HTSPR,NSI6622C-DLAR,NSM301X,NSM107X,NSI824XC,NSI6602VA-Q1SPNR,NSI6602ND-DLAR,NSI6801C-DSWFR,NSD3604-Q1,NCA3176,NSI6801MB-DSWVR,NSD3608-Q1QAJR,NSI1312S,NSI6622VB-Q1SWR,NSI6622B-Q1SPNR,NSD5604N-DHTSPR,NSD1624-DLAJR,NSI68011C-Q1SWAR,NSI6602VA-DLAMR,NSI6602NA-DLAMR,NSI6602NB-DSWR,NSD5604E-DHTSTR,NSR35XXX,NSI6622NB-Q1SWR,NSD5604N-Q1HTSPR,NSD1224X,NSI6602C-Q1SPNR,NSI8100W,NSI6622NA-DSPNR,NSIP8844W1-DSWR,NSI6622NB-DSWKR,NSE5702,NSE5701,NSI8100N,NSP183X,NCA1044-Q1DNR,NSI6622NC-DLAR,NCA1021S-Q1DNR,NSI6622VB-Q1SPNR,NCA1044N-Q1DNR,NSD16241-DSPKR,NSI3190,NSI6602VD-DSWR,NPC060N120A-QTOOT,NSI6622NA-Q1SWKR,NSE34050Q,NSD1224LA-DAFR,NSI8241SX,NSI6622NA-Q1SWR,NSI6622NC-Q1SPNR,NSI8231CX-DSWR,NSI1052-DSWR,NSPGL1 SERIES,NSI6622VA-Q1SPOR,NSA2860X_QQNR,NSI6801B-DSWFR,NSI6602B-Q1SPNR,NSI6601WC-DSWVR,NSI6651ASC-Q1SWR,NSC6272,NSI8263CX-DSWR,NSD8310-Q1HTSXR,NSC6273,NSREF31XX,NSI6622ND-DSWR,NSI6622NC-DSPNR,NSI6602NB-DLAR,NSI6602NB-DSPNR,NSA5312,NSI6622VC-Q1SWKR,NSPGL1,NSI6602A-Q1SWR,NSI6622NC-Q1SPOR,NSPGS2 SERIES,NSI6642C-DLAMR,NSR7808,NSI8220WX,NSI8266WX,NSD56008-Q1,NSD5604NE,NSI6622VA-Q1SPNR,NSI6602VB-DSWKR,NSL2161X-Q1,NCA1042BN-Q1SPR,NCA1057-Q1SPR,NCA1043B-Q1,NCA9511,NSI6602A-DSWR,NSC6280,NSI6602NA-Q1SWKR,NSD8308-Q1,NSI6602NC-DSWR,NSI6801TC-DDBR,NSI8242SX,NSI68515AC-DSWR,NSI6602B-DSWKR,NSI6602VD-DLAMR,NPCO60N120A-QTOIT,NSI8220CX-DSWVR,NSI6622NB-DSWR,NST235,NST117,NSI6602VC-DSWKR,NSI6602VC-Q1SWKR,NSI6602MB-DSWDR,NST118,NCA954X SERIES,NSD16242-Q1SPR,NCA9306 SERIES,NCA1044-Q1SPR,NSI6651,NSI6642B-DLAMR,NSI6602C-DSWKR,NSI8240NX,NSE34050 SERIES,NCA1057N-Q1DNR,NSP163X,NSI6602NC-DSPNR,NCA1042BN-Q1,NSI8221WX,NSI66X2,NSI6631ASC-Q1SWR,NSI6602MNC-DSWTR,NCA1042B-Q1DNR,NSI6642,NSI6601C-DSWVR,NIRS2X,NSI6601MB-DSWR,NSI8266SX,NSI6602NB-Q1SPOR,NCA34XX SERIES,NSI6602NC-Q1SPOR,NSD7310A,NSD8306-Q1,NSI6622ND-DLAMR,NSG65N15K,NSD12409-Q1SPR,NSE4250 SERIES,NCA1042CN-DSPR,NSI6602VA-DSWKR,NSI6642D-DLAMR,NCA1051N,NSI6642A-DSWKR,NIRS20N1-DSPR,NIRS21N1-DSPR,NSI6622NA-DLAR,NSC2860X-DQNR,NSI1042-DSWVR,NCA1042C-Q1SPR,NSI6602C-DSWR,NCA1057-Q1DNR,NSI8221CX-DSPR,NPD010N120A-DTOGT,NSI6602VB-Q1SWR,NSI8210CX-DSPR,NSD1026V-QISPR,NSD12416‒Q1,NSI1050-DDBR,NSI8241NX,NSI6602NC-Q1SPNR,NCA1042BN-Q1DNR,NSR10AXX SERIES,NST461,NSD2621X,NCA1042A-Q1,NSI8222WX,NST103,NSI1303D0X,NSI1303E2X,NSI6622A-Q1SWKR,NSI6602VC-DLAR,NSR31 SERIES,NSD16242-DSPR,NCA9555,NSI1052,NSC6360,NSC6362,NSI6622NB-DLAMR,NSI6651ALC-DSWR,NSC6364,NSI6602NA-DSPNR,NSI6622A-DLAR,NSI6622C-Q1SPNR,NCA1042C,NSI8220CX-DSWR,NSI6622C-DSPNR,NSA3166,NCA1042A-Q1SPR,NSIP8941W0-DSWR,NSI6642B-DLAR,NCA1042B-Q1,NSPGD1M,NSPAS3 SERIES,NSD1624-DSPR,NSI6602VA-Q1SWR,NSD1026V-Q1HMSR,NSI8242CX-DSWR,NSI6602MNC-Q1SWTR,NSL2163X-Q1,NST20,NIRS31,NSREF30XX,NCA9545,NSI6622NA-DLAMR,NSI1042,NSI6611,NCA9546,NSI6622B-DSPNR,NCA9306,NCA9548,NSD12416-Q1SPR,NSI6602MC-Q1SWTR,NSI8242NX,NSD8381-Q1QAIR,NSD8308-Q1HTSXR,NCA9617A,NST1001HA,NSI6602VA-DSWR,NSI1303D2X,NSI1050,NSI6601B-DSWVR,NSD7310-DHSPR,NSI6601,NSD731X-Q1,NCA1057N-Q1SPR,NSR7808GXX,NSD7312-Q1HSPR,NSI6602VB-DLAMR,NSI6602MNF-DSWTR,NSD1026V-DHMSR,NSA3300,NSI6602C-Q1SWKR,NSC2860X,NSD11416‒Q1,NSI6622NB-Q1SPNR,NCA1051N-DSPR,NSI6611ASC-DSWR,NSI22C11,NSI8230CX-DSWR,NSI6801B-DSPR,NSI6622A-DSPNR,NSD12409‒Q1,NSD5604NE-DHTSTR,NSPDSX SERI
【IC】TDK推出用于高级驾驶辅助和安全应用的第二代6轴IMU，体积小巧，工作温度范围广
TDK公司进一步扩展了其InvenSense SmartAutomotive™ MEMS传感器系列，推出了用于汽车安全应用的IAM-20685HP和IAM-20689第二代6轴IMU。这两款设备都能为决策算法提供可靠的运动数据，并能实时准确地检测车辆动态。
Sekorm is an Authorized Distributor of MERRY that is a Famous Acoustic Sensors Manufacturer
Sekorm said: “The new generation of electroacoustic products will play a more critical role, bringing more imagination and applications to human life. This cooperation with Merry will jointly promote business development and product extension.”
电子商城
品牌：TDK InvenSense
品类：6-axis MEMS MotionTracking device
价格：￥29.7208
现货： 0
品牌：TDK InvenSense
品类：6-axis MEMS MotionTracking device
价格：￥15.8711
现货： 0
品牌：EPSON
品类：USB Evaluation Cable Interface / Breakout Board for EPSON IMU
价格：
现货： 0
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