SMARTsemi Automotive Journey Extends with new AEC-Q100 Class 2 Compliant 4Gb DDR3 x8 and x16 SDRAM Components

时间： 2024-07-24 来源：SMARTsemi Official Website

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DDR3 SDRAM,DDR3 SRAM,DDR2 SDRAM,Flash eMMC

SMART’s latest DDR3 SDRAMs are both automotive temperature tested and certified for AEC-Q100 Class 2 Automotive Applications.

NEWARK, Calif., July 16, 2024 - SMARTsemi, a division of SMART Modular Technologies, Inc., provider of commercial, industrial, and automotive/wide-grade Tier-1 memory components and cards for embedded applications, announces the availability of 4Gb x8 and 4Gb x16 DDR3 SDRAMs for automotive and wide temperature range applications.

The latest additions to the DRAM components family operate at -40℃ to +105℃ and have been tested to comply with the industry’s AEC-Q100 Class 2 Automotive Component Specification. Class 2 components are ideal in passenger cabin applications including navigation and infotainment systems, environmental controls, and for various controls including wipers, locks.

“We’re pleased to be expanding SMARTsemi DDR3 SDRAM product line with the highly-valued products at a time when industry manufacturing capacity is being diverted away from DDR3 to newer DDR4 and DDR5 generations,” stated Helen Do, Sales Operations at SMART.

In addition to auto-grade compliant components, SMARTsemi also offers a variety of SDRAMs and Flash eMMC Components that are tested to operate at automotive temperature ranges.

SMARTsemi is your supply chain partner for DRAM components, eMMC solutions, and SD/microSD Flash Memory Cards for long-life applications. With 20+ years of industry experience, SMARTsemi understands your challenges and have aligned SMARTsemi priorities with yours to simplify your memory chip supply chain for the long run. SMARTsemi knows what you need before you need it. Get a jump start and request a sample today.

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本文由Ray转载自SMARTsemi Official Website，原文标题为:SMARTsemi Automotive Journey Extends with new AEC-Q100 Class 2 Compliant 4Gb DDR3 x8 and x16 SDRAM Components，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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IC代烧录及驻厂烧录

可烧录MCU/MPU，EPROM,EEPROM,FLASH,Nand Flash, PLD/CPLD,SD Card,TF Card, CF Card,eMMC Card,eMMC,MoviNand, OneNand等各类型IC,IC封装：DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN.

最小起订量： 1 提交需求>

IC烧录代工及IC自动化烧录