A Brief Description of Thermally Conductive Gap Filler Material-Silicon-free Thermal Pad

时间： 2024-07-26 来源：SHEEN Official Website

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Power consumption electronic components are the main body of heat generation in electronic equipment. The higher the power of electronic components, the more heat they will generate. However, the development trend of science and technology in today's society is based on high performance, high integration and light weight. Mainly, the performance of electronic components is getting stronger and stronger, which also means that their power is also rising, so the heat dissipation must keep up with the pace.

Fig.1

Thermally conductive gap filling material is a general term for a material that is coated between the heat sink device and the heat sink device and reduces the contact thermal resistance between the two. The widely used thermal conductive silicone sheet and thermal paste are one of the thermally conductive gap filling materials. At present, many thermal conductive gap fillers are made of silicone oil, so small molecules of siloxane will be precipitated during use and pollute the surrounding devices, which is not allowed for some electronic devices that have high environmental requirements.

silicon-free thermal pad is a gap-filling thermal pad based on special resin instead of silicone oil. It has the characteristics of high resilience, high flexibility, high thermal conductivity, low thermal resistance, etc. It is easy to operate and easy to rework , and under the condition of continuous pressure and heat, there is no precipitation of small siloxane molecules, so as to avoid the precipitation of small siloxane molecules in heat-conducting products containing silicone oil under long-term working conditions, which will lead to the degradation of the performance of electronic components and prolong their working life.

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