What is Thermal Putty?
What is Thermal putty?
Thermal putty, also known as thermal gel, is a highly versatile thermal interface material (TIM) designed to transfer heat between electronic components and their cooling solutions efficiently.
Key Features of Thermal Putty
Thermal putty is available in various formulations, each tailored to specific thermal management needs. The SHEEN's SE series silicone thermal putty, for instance, offers a thermal conductivity range of 1.0 to 10.0 W/m·K and is made from silicone oil and thermal conductive fillers. This formulation is particularly known for its low thermal resistance, excellent wetting properties, and good thixotropy, making it easy to apply and ensuring consistent performance. Unlike traditional thermal pastes, thermal putty does not cure, which allows for easy rework and maintenance.
Another popular variant is the SHEEN's AE series, a silicone-free thermal gel with a thermal conductivity range of 1.0 to 3.0 W/m·K. This non-curing, non-silicone material is designed to avoid the risk of silicone oil migration and siloxane volatility, making it ideal for silicone-sensitive applications. The AE series is especially suitable for large gap tolerances and the delicate interfaces of components such as automotive electronics, smartphones, and communication devices.
Applications and Advantages
Thermal putty is particularly advantageous in applications where large gaps need to be filled or where components are prone to mechanical stress. Its high viscosity compared to thermal grease ensures that it stays in place, providing consistent thermal performance even under varying conditions. It also exhibits low assembly stress, which is critical for protecting fragile components during the manufacturing process.
The SE and AE series thermal putties are compatible with automated dispensing equipment, making them ideal for high-volume production environments. These products are widely used in the automotive industry, consumer electronics, and telecommunications, where reliable thermal management is essential for the longevity and performance of devices.
Conclusion
Thermal putty is a critical material for effective heat management in modern electronics. Whether you need a solution that offers high thermal conductivity, low assembly stress or is free from silicone contamination, thermal putty provides a versatile and reliable option. Understanding the properties of different thermal putty formulations, such as those in the SE and AE series, can help you select the best material for your application needs.
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目录- Company Profile Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel Thermal Pad Thermal Silicone Pad & Silicone Thermal Fiberglass/Film EMI absorber/Absorption Gel Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound Silicone/Non-Silicone Thermal grease Silicone Thermal Tape Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad
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