FORESEE XP2300 PCIe SSD: A Flagship Solution Leading the AI PC Memory Revolution

时间： 2024-08-22 来源：FORESEE Official Website

技术问答

As AI computing platforms undergo a new wave of upgrades, industry giants are launching innovative products: NVIDIA’s Rubin GPU, Intel’s Xeon 6 processors, and AMD’s Ryzen and EPYC series processors, all of which stress the central role of AI acceleration. These technological advances not only drive significant leaps in AI processing capabilities, but also establish new performance benchmarks for the entire industry.

In the PC sector, with Windows on ARM products poised for release and AI PCs based on x86 architecture leveraging advanced process technologies, performance metrics represented by Tera operations per second (TOPS) and applications for AI of have expanded at an unprecedented rate.

This pursuit of AI computing power is directly reflected in the growing demand for storage. According to the "Global Memory Market Summary for Q2 2024 and Q3 Outlook Report" released by CFM, a 16GB capacity has become the starting standard for AI PC memory, while 1TB storage is now the standard configuration for high-end AI PC products.

Against this backdrop, FORESEE is joining this wave of technological innovation with its latest high-capacity, high-performance flagship product - the XP2300 series PCIe 4.0 M.2 2280 SSD.

A Dual Leap in Performance and Capacity

Featuring 236-layer 3D TLC NAND Flash and a next-gen PCIe 4.0 SSD controller, the FORESEE XP2300 PCIe M.2 2280 SSD is designed to answer the call of artificial intelligence (AI) computing. Available in capacities from 256GB to 4TB, the XP2300 PCIe SSD provides sequential read / write speeds up to 7,400MB/s / 6,700MB/s and random read / write speeds up to 1,070K / 1,130K IOPS.*

The XP2300 uses proprietary technologies like Host Memory Buffer (HMB), Initial Data Acceleration (IDA), and Free Block Acceleration (FBA), and delivers an ideal option for AI PCs, ultra-thin laptops, gaming PCs, and other high-performance devices.

Optimized Energy Efficiency and Heat Dissipation

The XP2300 SSD uses a 12nm process PCIe 4.0 4-channel DRAM-less main control chip to reduce the number of read-write channels by half, while lowering power consumption and heat generation. Combined with an active power consumption as low as 5W, and idle consumption below 20mW, the XP2300 also extends the battery life of smart terminals.

*All performance indicators are based on internal testing.

Reliable and Secure

The FORESEE XP2300 PCIe SSD is equipped with next-gen 4KB LDPC error-correction capability, while also supporting RAID, SRAM ECC, and E2E features, to guarantee reliable utilization of user data. Additionally, the XP2300 SSD features an advanced heat-dissipation design and materials, as well as intelligent temperature control to automatically adjust a workload to ensure stable transmission. With support for mainstream encryption methods such as AES256, TCG OPAL2.0, eDrive, and Pyrite, the XP2300 is ready to maintain data security standards.

Stringent Standards and Quality Assurance

The FORESEE XP2300 PCIe SSD has undergone comprehensive and rigorous product development testing and verification to ensure exceptional performance, compatibility, reliability and power consumption. Equipped with certifications for CE, EMC, FCC, ROHS, UKCA, and more, the XP2300 meets access standards for most countries and regions.

Continuous Innovation

As the AI PC market continues to evolve and mature, Lonsys will continue to find new paths to optimize firmware algorithms, while gaining a deeper understanding of applications and performance requirements. With the latest SSD innovations, every customer will have access to flexible custom solutions to satisfy complex computing needs.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由Ray转载自FORESEE Official Website，原文标题为:FORESEE XP2300 PCIe SSD: A Flagship Solution Leading the AI PC Memory Revolution，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

【元件】FORESEE XP2300 PCIe SSD：引领AI PC存储革新的旗舰级解决方案

FORESEE XP2300 PCIe SSD搭载236层3D TLC闪存颗粒，采用了新一代PCIe 4.0 SSD控制器，容量覆盖256GB~4TB，顺序读写速度最高可达7400MB/s / 6700MB/s；随机读写速度最高可达1070K / 1130K IOPS。产品集成了HMB主机内存缓冲器、IDA初始数据加速、FBA空闲块数据加速等自研技术，专为AI PC、超薄笔记本、电竞主机等设计。

产品发布时间 : 2024-08-16

【IC】读写性能提高40%！FORESEE XP2200系列SSD推出M.2 2280规格

近日，FORESEE XP2200系列PCIe SSD推出M.2 2280规格，产品搭载主流232层3D TLC闪存颗粒，并采用基于12nm工艺的4通道高性能主控芯片，支持HMB主机高速缓冲技术，能够提供高达2400MT/s的I/O速率，进一步释放产品潜能。产品所用的主控芯片减少了一半的读写通道数量，从而显著降低25%的功耗并减少发热量，让该产品的整体功耗低至4W，能够有效延长智能终端的续航时间。

产品发布时间 : 2024-02-20

【IC】首颗自研2D MLC NAND Flash！江波龙构建完整的存储芯片垂直整合能力

江波龙FORESEE研发布局突破藩篱进入到集成电路设计领域，产品及服务获得客户高度认可。继自研SLC NAND Flash系列产品实现规模化量产后，首颗自研32Gb 2D MLC NAND Flash也于近日问世。该产品采用BGA132封装，支持Toggle DDR模式，数据访问带宽可达400MB/s，将有望应用于eMMC、SSD等产品上，为公司存储产品组合带来更多可能性。

产品发布时间 : 2024-02-05

FORESEE存储器选型表

FORESEE存储产品有内存模块、固态硬盘、闪存、eMMC等。工规MSATA SSD，工规 SATA M.2 2242 SSD，工规 SATA M.2 2280 SSD，商规DDR3L，用于工业电脑，轨道交通，工业设备，电力设备，服务器，POS机，医疗设备等。工规PPI SLC NAND FLASH，工规NMCP，工规PPI SLC NAND FLASH，工规SPI SLC NAND FLASH，用于电视，机顶盒，网通，IPC，行车记录仪，智能手环等。车规II EMMC，车规III EMMC，应用于车载前装，智能仪表，IVI，ADAS，域控，BMS，记录仪。工规EMMC，用于耐用性消费类电子，车载后装，商显，TV，黑白家电等。工业宽温EMMC，用于工业控制，通讯基站，智能电网，车载前装。

产品型号	品类	Density（Mb、Gb、GB、TB）	Speed（MT/s、Gbps、MHz）	Voltage (V）	Memory	Temp. Range (℃)	Bus	Interface	Package	Size (mm)
FI4S26M016GSC3	DDR4 DIMM	16GB	2666MT/s	1.2V	DDR4	0℃ to 85℃	64bits	260pin	SODIMM	69.6 x 30mm

选型表 - FORESEE 立即选型

FORESEE工业存储产品选型指南

目录- eMMC NAND Flash nMCP DDR3L SSD DDR4 DIMM Company Profile

型号- FS33ND04GS108TFI0,FISKRM032G-B2A43,FISQRM128G-B2A43,FEMDRW008G-88A43,FI4V26W008GSD5,F60C1A0004-M6AR,FISPRM128G-B2A43,FEMDMW008G-88A37,F35SQA512M-WWT,FEMDMW008G-88A39,FISKRW008G-B2A53,FISHRM001T-G8A56,FI4V26M008GSC3,FISPRM001T-G8A56,FSEIASLD-64G,F35SQA002G-WWT,FSEIASLD-32G,FEMDRW128G-88A19,FI4S26W016GSD5,FEMDRW032G-88A19,F35SQA001G-WWT,FI4S26W008GSD5,FEMDMW032G-88A19,FISQRM032G-B2A53,F70ME0101-RDWA,FEMDRW008G-88A39,FSNS8A002G-TWT,FEMDME004G-A8A39,FSNS8A001G-TWT,FS33ND04GS108BFI0,FISKRW032G-B2A43,FEMDMW016G-88A43,FI4S26M016GSC3,FISQRM064G-B2A43,FISHRW256G-G8A56,FEMDME008G-A8A39,FEMDME016G-A8A58,FISKRM008G-B2A53,FEMDME008G-A8A43,FEMDME032G-A8A58,FISPRM064G-B2A43,FI4V26W016GSD5,F35UQA002G-WWT,FS704B2R1CH6A2KAM,FISPRW064G-B2A43,FSNU8A002G-TWT,FEMDMW064G-88A19,FISQRW064G-B2A43,F70ME0101D-RDWA,FISKRW032G-B2A53,FISPRW256G-G8A56,FEMDME064G-A8A58,F35UQA001G-WWT,FEMDMW016G-88A37,F60C1A0004-M79W,F60C1A0004-M79R,FISKRM064G-B2A43,FISKRW016G-B2A53,FEMDRM016G-58A43,FISQRW032G-B2A53,FISKRW064G-B2A43,FSNU8A001G-TWT,FISHRM064G-B2A43,FISHRM256G-G8A56,FISHRW064G-B2A43,FISPRM512G-G8A56,FISKRM032G-B2A53,FS35ND04G-S2Y2QWFI000,FISPRW128G-B2A43,FISQRW128G-B2A43,FI4S26M008GSC3,FISHRW001T-G8A56,FISKRM016G-B2A53,FISPRW512G-G8A56,FS33ND01GS108BFI0,FISQRM016G-B2A53,FISQRW032G-B2A43,FEMDME016G-A8A43,FISHRW128G-B2A43,F60C1A0002-M69W,FSEIASLD-128G,FISKRM128G-B2A43,FISQRM032G-B2A43,FISHRM128G-B2A43,FISPRW001T-G8A56,FEMDRM008G-58A39,FISQRW016G-B2A53,FISHRW512G-G8A56,FISKRW128G-B2A43,F60C1A0002-M6AR,FISPRM256G-G8A56,FEMDRW016G-88A43,F35UQA512M-WWT,FISHRM512G-G8A56,FEMDRW064G-88A19

选型指南 - FORESEE - March 1, 2022 PDF 英文下载

江波龙荣登《财富》中国科技50强，成榜单中唯一半导体存储品牌企业

2024年8月21日，全球知名商业杂志《财富》于今年首度推出“《财富》中国科技50强”榜单，试图找到出生在中国、正在影响世界的科技公司。深圳市江波龙电子股份有限公司（FORESEE）凭借其核心技术、企业规模和全球产业链布局等优势，在上千家企业中脱颖而出，荣登榜单，并成为该榜单中唯一入选的半导体存储品牌企业。

厂牌及品类发布时间 : 2024-08-29

Ziitek（兆科）是集研发与生产于一体的高新技术创新型企业，公司具备成熟的导热材料生产加工技术，拥有优异生产设备和优化的工艺流程，可提供拥有电绝缘、温度作业范围(-45℃~200℃)以及UL94V0防火认证的导热产品，并提供散热解决方案。

导热硅胶导热绝缘片导热硅脂导热石墨片导热双面胶导热塑料单组份导热凝胶双组份导热凝胶无硅导热片 Auto汽车应用材料导热环氧灌封材料导热硅胶灌封材料硅胶泡棉密封垫高粘性带阻燃双面胶导热绝缘硅胶挤出材料硅胶垫片密封条导热硅胶垫锂电池密封垫硅胶板硅胶皮硅胶条硅胶套 PCM相变化材料 0.95W导热相变化帖 2.5W导热相变化帖 5.0W导热相变化帖铝箔导热相变化帖无硅导热相变化 PI加热膜 SP硅胶加热膜 ES环氧加热膜吸波材料经济吸波材料常规吸波材料混合型吸波材料高频吸波材料吸波导热片高性能吸波材料 EMI屏蔽材料导电硅胶片导电泡棉导电布导电铜箔导电铝箔

授权代理商 - 世强先进（深圳）科技股份有限公司线上商城技术资料

展开

FORESEE® XP2100 PCIe SSD

型号- FSB0C001T-C6C7200,XP2100F001T

数据手册 - FORESEE - December 7, 2022 PDF 英文下载

2024年Q1 DRAM与SSD市场趋势及展望：存储产业强劲反弹

回顾2023年，受到整年持续的通货膨胀及地缘政治紧绷情势的影响，全球经济大幅放缓。值得注意的是，存储产业预估将一甩近年来的低迷，呈现正面态势并强劲反弹，这股复苏力度归功于AI相关技术的持续进展，有助于扩大工业和消费电子领域对密集型内存应用的需求。迈入2024年，请参考存储市场主要应用的价格更新和市场前景。本文中SMART与您分享2024年Q1 DRAM与SSD市场趋势及展望：存储产业强劲反弹。

行业资讯发布时间 : 2024-02-22

2024年Q3-DRAM与SSDA市场态势剖析：AI驱动下的涨势与变数

AI的蓬勃发展持续推动半导体和IT产业的成长，尤其在存储领域，生成式AI应用助长了市场对高性能运算方面的需求。从数据中心的AI服务器到消费端的AI PC，内存运算和存储性能表现至关重要，成为提升AI应用落地的关键推手。

行业资讯发布时间 : 2024-08-15

2024 MWC上海：江波龙FORESEE探索存储技术新趋势

6月26日至28日，2024 MWC上海在新国际博览中心隆重举行，半导体存储品牌企业江波龙亮相展会，并在现场展示其最新成果，与全球行业精英共同探索存储在移动通信领域的无限可能。

厂牌及品类发布时间 : 2024-07-23

江波龙亮相第十八届CPSE安博会，展示应用于智慧安防行业的存储产品和成功案例

安博会现场，深耕行业市场的存储品牌FORESEE分享了一系列可应用于智慧安防行业的存储产品和成功案例，其中涵盖了FORESEE全系列存储产品，包括以“小型化智能化”为核心优势的Subsize eMMC、UFS等；以宽温耐用见长的车规级eMMC、工规级SSD等。

厂牌及品类发布时间 : 2023-02-08

FORESEE, the Industry Storage Brand of Longsys, Debuted at Embedded World 2022

FORESEE has primarily focused on the innovation, research, and development of storage application products since it was established in 2011. It has accumulated a series of core technical capabilities in firmware development, memory chip testing, integrated packaging design, and more.

产品发布时间 : 2022-12-31