Leading the Future of Low-Power IoT: A Conversation with Semtech and Sony Altair on the New HL7900 Module

2024-08-27 Sierra Wireless Official Website
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As the world continues to embrace the Internet of Things (IoT), the demand for low-power, high-efficiency solutions grows exponentially. At the forefront of this technological evolution stand two industry experts: Sony Altair and Semtech. Their latest innovation, the Semtech HL7900 module—a global 5G LPWA module featuring the Sony ALT1350 chipset—promises to revolutionize the IoT landscape by providing ultra-low power, future-ready connectivity. 


As the world continues to embrace the Internet of Things (IoT), the demand for low-power, high-efficiency solutions grows exponentially. At the forefront of this technological evolution stand two industry experts: Sony Altair and Semtech. Their latest innovation, the Semtech HL7900 module—a global 5G LPWA module featuring the Sony ALT1350 chipset—promises to revolutionize the IoT landscape by providing ultra-low power, future-ready connectivity. 



In this blog, we discuss with key leaders from Semtech(Semtech: formerly Sierra Wireless) and Sony Altair to explore how this cutting-edge module is poised to shape the future of IoT, unlocking new possibilities for smart cities, metering, asset tracking and beyond. 
 


Hi Guy and Michael, let’s start with the vision behind the development of the new HL7900/ALT1350. What are the most critical needs and challenges faced by organizations when developing a successful cellular IoT device? 

Michael: One major challenge is achieving low power consumption and extended battery life, which are essential for devices expected to last up to 20 years in the field. Customers often find it challenging to design a product that maintains low power consumption and long battery life across varying environments and network conditions. Another critical aspect is the complexity of deployments.  Wireless IoT is complex, and seamless integration isn't always straightforward. Improving customer experience through clear documentation, intuitive software, user-friendly APIs, and robust development boards is crucial. 


Guy: IoT use cases also increasingly demand higher levels of integration—combining multiple functionalities into single hardware or chipset solutions. This approach simplifies the overall solution and reduces the cost of end-to-end implementation. However, it's equally important to keep APIs and interfaces simple and straightforward. Clear and concise documentation is essential to ensure ease of use when developing and deploying these devices in real-world applications. 

 

How do the new Sony ALT1350 chipset and Semtech HL7900 module help solve these challenges? 

Guy: From a chipset perspective, the ALT1350 significantly outperforms previous generations. Battery-operated devices can now achieve up to 4 times longer battery life for typical use cases. Additionally, the ALT1350 offers a high level of integration to meet the simplification need we’ve talked earlier. It integrates more functions, such as location capabilities and additional short-range radio, which enhance connectivity and enable more use cases. It can for example create mesh networks, connecting devices in areas with weak cellular signals. This is particularly needed for smart cities and tracking applications. The key advantage is that customers can use a single platform to adapt in real-time their topology and connectivity needs. 



Michael: In addition to the features Guy mentioned, the HL7900 module includes an ultra-low power sensor hub MCU. This innovation monitors systems for specific conditions with minimal power use and activates the system only when necessary to send data or make decisions. For example, in asset tracking applications, the accelerometer or temperature sensors are monitored while everything else remains in sleep mode. The radio only turns on and sends data when the temperature or accelerometer data exceeds a certain threshold. This feature is crucial for achieving the low power requirements essential for many IoT designs. 


Guy: Exactly. We invested heavily in this new subsystem, and we're delighted that Semtech can utilize it for end-to-end solutions. This capability further enhances low power consumption and extends battery life for battery-operated products. 

 

You talked about longevity as being a key need for low-power IoT devices. How future-proof is the HL7900/ALT1350 solution? What is the expected lifespan of 5G LTE-M/NB-IoT technologies? 

Michael: Longevity is one of the most critical concerns for many of our customers, especially those involved in critical infrastructure, smart metering, and smart cities. They need solutions that will last in the field for up to 20 years without frequent replacements. Over the past few years, they've seen considerable changes in wireless standards and technologies from operators, including the shutdown of 2G and 3G networks. This raises concerns about the future of 4G and LTE. To address this, Sony and Semtech have implemented several key features in the HL7900/ALT1350 solution. One crucial aspect is the ability to upgrade software over-the-air (FOTA). This allows us to easily and remotely deploy necessary updates through our AirVantage® platform as technologies evolve over time. 


Secondly, LTE-M is designed as a low-power wide-area (LPWA) technology compatible with 5G. It's a 5G technology itself and aligns with new 3GPP releases that network operators will roll out, ensuring compatibility between Cat-M and 5G networks. Currently, there is no replacement for Cat-M in the standards, making it likely that LTE-M will continue to be supported by network operators for many years.  
Guy: Absolutely. Longevity is crucial for many IoT applications, particularly in infrastructure. For higher LTE categories, we see enhancements like eMBB in the 5G space and eventual replacements like RedCap for Cat-1 to Cat-4. However, for Cat-M and NB-IoT, there is no technology replacement within the 5G domain. These technologies are already part of the 5G ecosystem and are expected to remain in use for at least the next 15 to 20 years, as long as 5G is deployed. 



Considering that some of these devices are deployed in critical infrastructure, how have you addressed security in the design of the HL7900 module? 

Guy: One key advantage of the close collaboration between Sony, Sierra and now Semtech, is the combined expertise and investment in security. We engage in open discussions to ensure our end-to-end solution is secure by design. This includes features like secure boot and FOTA (Firmware Over-The-Air). Our silicon also incorporates isolated secure elements, which are physically disconnected from other system parts, providing an extra layer of security for various applications. This dual-directional input ensures a robust security foundation for our products. 


Michael: Absolutely, security is a combination of the chipset, module and integration. We support essential security features such as secure boot, ensuring that only official software is executed on the module. We also support secure networking protocols like DTLS and TLS to protect data during transmission, with authentication and encryption. Customers can securely load their keys onto the module to further protect connections. Additionally, we provide tools to check for vulnerabilities and disable unsecure interfaces like JTAG to keep devices safe in the field. 

There’s a general agreement that a large number of IoT projects fail. How can Semtech simplify the path to success for their customers? 

Michael: The hardware is just one piece of an overall IoT project. The real challenge lies in getting data from the edge to the cloud, ensuring it's secure, and integrating it into backend systems. This is where Semtech can significantly help. We offer complete end-to-end solutions, providing the necessary connectivity so customers don't need to negotiate separately with network operators. Our embedded SIMs eliminate the need to manage physical SIM cards. Our edge-to-cloud solution ensures secure data transmission to the cloud and backend systems. Additionally, our FOTA service supports secure over-the-air updates from the cloud. By providing all these components together, we enable customers to successfully bring their products to market. 


Guy: I completely agree. It's crucial for us to rely on partners like Semtech to leverage the advantages we've designed into our solutions. Providing an end-to-end solution simplifies the integration process for users, ensuring high-quality and scalable solutions. This collaboration aims to enhance and streamline the implementation process, making it easier for customers to achieve success with their IoT projects. 

This is not the first collaboration between Semtech and Sony Altair. What do you consider the key factors contributing to the success of this partnership, especially in low-power deployments? 

Michael: Our partnership, began a decade ago with the Sony ALT1250 inside the HL78 modules, a best-in-class LPWA module family with exceptionally low power consumption. This innovation enabled new use cases for cellular technology that were previously unfeasible due to battery constraints. Our partnership has continued to thrive, supporting millions of deployments in the field that meet long battery life and low power requirements. Together, we've created robust solutions designed to last many years. 


Guy: Absolutely. The strength of our collaboration lies in our complementary expertise. Semtech brings extensive experience in wireless communication, while Sony provides innovative chipset technology. Working together, we create exceptional products that neither could achieve alone. Additionally, we share a unified vision and goal to advance IoT capabilities with cutting-edge solutions. This shared vision has driven our successful partnership and continues to address market needs effectively. 

Well thank you for this insightful discussion. One last question for you, where can we learn more about the HL7900 module and get in touch with your teams for further information? 

Michael: You can find more information on the HL7900 module on our webpage. 


You can also contact our IoT experts who are available to help you get started. 
 
Finally you might also be interested in our webinar, "Top 5 Factors for Choosing the Right Connectivity Technologies," where industry experts share valuable insights on selecting the ideal IoT technology for long-term success.  


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本文由雪飘梦飞转载自Sierra Wireless Official Website,原文标题为:Leading the Future of Low-Power IoT: A Conversation with Semtech and Sony Altair on the New HL7900 Module,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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型号- YP0009BA,SC606T,RG501Q-EU,EG06,YC0003AAEVB,YB0016AA,YG0030AA,M89,YF0002AA,YE0009AA,YB0031AA,YCGA001AA,YM0004AA,YG0015AA,YG0038AA,EM120R-GL,YP0009AA,UC200A-GL,BG600L-M3,YP0009CA,HC06U,EG120K,SC310K,LC29HAA,YC0010AA,M95,L76,L70-RL,YKL001CA,YBS00A1AA,YE0013AA,BG96,BG95,YC0018AA,YCGO004AA,SC200K,LC29HBA,YB0032AA,FC30R,LG77L,YC0017BA,SC200L,LC29H,L80,EC25 MINI PCIE,YB0017AA,LC29D,SC200E,L86,YAT001CA,AG569N,YF0026AA,EM12-G,FC66E,RG520N-NA,YE0025AA,YE0002AA,YM0003AB,RG520F-EU,YLY001CA,SC200R,L26-LB,RM530N-GL,YM0003AA,RG502Q-GT,YGL001AA,LC29HCA,EG12,YG0065AA,EG21-G,L26-ADR,L96,EG18,YE0037AA,YCGS004AA,FC65E,AG568N,AG55XQ,FC41D,LC98S,YM0015AA,YC0013AAEVB,BG770A-GL,EG060V-EA,LC86L,YEWN001AA,LC79H,LC79D,YG0032AA,L76-LB,YWL00A0AA,AG215S,YC0008AAEVB,YAT001AA,YB0014AA,EM05,EM06,FC64E,YF0027AA,YE0003AA,RG502Q-EU,EC200U MINI PCIE,YM0003CA,YBY00A0KA,YCGO014AA,YG0043AA,BC660K-GL,SC20,YE0038AA,YAT001BA,YXH001AA,EM060K-GL,YCGS005AA,YPCA004AA,YF0006DA,EG915N,YG0028AA,YG0005AA,RM500Q-GL,YECT002AA,EG915U,YC0003AA,RG530F-EU,LG69T,AF56C,YE0027AA,YF0020AA,YB0015AA,YE0039BA,RG500L-NA,AG57XQ,YDX001AA,YCGS006AA,YF0017BA,YF0028AA,AG15,FC62E,YPR00A0AA,BC66,BC65,L70-R,RM502Q-AE,YB0026AA,LC79HAL,YG0021AA,RG502Q-EA,RM510Q-GL,YE0031AA,YF0017AA,MC60,M66-DS,YECT003AA,BC68-GV,YCGO009AA,YM0013AA,BC66-NA,YC0002AA,EC200U,BC92,YG0034AA,UG96,MC90,YE0028AA,EC20 R2.1,EG25-G MINI PCIE,L26-T,YEGT002AA,YF0029AA,BG772A-GL,AG35,YFGA001AA,SC20 LINUX,EG91,AG519M,YC0018AAEVB,EG95,YCGO011AA,EG21-G MINI PCIE,MC60E,BG95 SERIES,BG950A-GL,YE0032AA,SG865W,RG500Q-GT,YF0007BA,RM505Q-AE,SC66,YB0008AA,YBY00A0HA,EG512R-EA,EC20 R2.1 MINI PCIE,SA800U,YCGO008AA,AF20,L80-R,EC25,FG50V,YC0001AA,YE0006AA,YE0029AA,RG520N-EU,AF51Y,YF0022AA,YF0023CA,YE0021AA,YCN001AA,L76B,YFGA002AA,RG520F-NA,YG0035AA,YBY00A0IA,L26-UDR,YC0009AA,AF50T,EG25-G,L76-L,YC0013AA,EG065K,YCGO010AA,SG560D,YF0011AA,YE0010AA,BC95-GV,YB0009AA,YG0046AA,YCGO007AA,YBY00A0JA,EC21,YB0033AA,RG500Q-EA,LC29DB,LC29DC,YE0007AA,AH20C,LC29HDA,YB0010AA,YF0023AA,LC86LA,L26,YFGA003AA,YEMA003AA,FC80A,LC86LC,YC0017BAEVB,FC20,FC21,YC0008AA,EM121R-GL,LG69TAB,LG69TAA,YG0062AA,YEIM001AA,EC200A MINI PCIE,LC79DA,LG69TAD,YF0002DA,YE0019AA,AG52XR,L89 R2.0,YE0011AA,YEWM001AA,RM520N-GL,YCGO006AA,YSAN001AA,BG951A-GL,YEWT004AA,RG530F-NA,YFCA002AA,SC600T,RG500L-EU,SC680A,M08-R,M66,M65,YF0002CA,YE0008AA,YFGA004AA,YEGT001AA,EP06,YEMA004AA,YM0005AA,LG69TAM,YCGA002AA,SC600Y,EC21 MINI PCIE,YEWN004AA,LG77LC,YB0022AA,LG77LA,YG0063AA,LG77LB,EC200A,EM160R-GL,YF0002BA,YKL001AA,YE0001BA,RG500Q-EU,YE0012AA,YB0007AA,RM500Q-AE,EM120K-GL,M95-R,EC200S,BG77,YG0048AA,EG060K,YCGO005AA

2022/4/22  - QUECTEL  - 商品及供应商介绍  - V7.0 代理服务 技术支持 批量订货

Sierra Wireless推出最新的LPWA模块HL7900,可降低运营和设备维护成本

Sierra Wireless于2023年2月28日宣布推出其最新的HL系列LPWA模块5G HL7900,用于需要超低功耗、设备寿命延长和支持3GPP最新5G标准的下一代用例。该模块使用索尼以色列半导体公司(Sony)新的ALT1350芯片组,索尼声称该芯片组是世界上第一个能够额外启用非授权的频谱通信协议和卫星连接的蜂窝芯片组。

2023-03-09 -  原厂动态 代理服务 技术支持 批量订货

全球领先的LOT和M2M模块供应商

型号- SC606T,RG501Q-EU,EC200U,EC200T,BC92,LG77L(C),LC86L (C),LC29D(C),EG06,AF50T*,FC31R*,UG96,MC90,EC20 R2.1,M89,L26-T,AG35,FC21*,SC20 LINUX,LC29H*,EG91,EM120R-GL,EG95,BG95 SERIES1,BG600L-M3,HC06U,LG77L(B),M95,MC60E,L76,L70-RL,UG89,SC66,EG512R-EA,EC20 R2.1 MINI PCIE,SA800U,FC64E*,BG96,AF20,EC21/EC21 MINI PCIE,L80-R,FC30R,LC79H*,FC62E*,L80,L86,AF51Y,L76B,SC200R,L26-LB,L26-DR,L76-L,EG12,EG21-G/EG21-G MINI PCIE,L96,EG18,EG25-G/ EG25-G MINI PCIE,AG55XQ,FC41D,LC98S,RG500Q-EA,L76-LB,AG215S,EM05,LC29D(B)*,EM06,L26,FC20,EM121R-GL,RM502Q-GL,UC200T,BC660K-GL,LG69T(AA)*,SC20,RM500Q-GL,LC79D(C) *,LC79D(A),AG52XR (X=1, 2),FC66E*,FG50V*,SC600T,LC29D(A),LG77L(A),LC86L (A),M08-R,M66,M65,EP06,AG15,LG69T(AP)*,SC600Y,BC68,BC66,BC65,EG912Y,L70-R,LG69T(AD)*,RM502Q-AE,EC25/EC25 MINI PCIE,EM12,RG502Q-EA,RM510Q-GL,EM160R-GL,UC200T MINI PCIE,EG060V,MC60,RM500Q-AE,M66-DS,M95-R,EC200S,BG77,BC95-G,BC66-NA,FC65E*,L89 R2.0*

2021.05  - QUECTEL  - 商品及供应商介绍  - V6.6 代理服务 技术支持 批量订货

高新兴物联(GosuncnWelink)5G/4G/LPWA蜂窝通信模组选型指南

目录- 5G/4G/LPWA Module    Revision History   

型号- GM331H,GM520,GM510,ME3630-W,GM500,GM196,GM120,GM351A,GM122,GM320,ME3616,GM860A,GM552A,ME3630,GM196H,GM800

2022/9/30  - 高新兴物联  - 选型指南  - V6.9

GoSunCN-无线模块专家

型号- R800,GM510,GM500,GM610,GM720,GR500,GM100,GM551A,ME3616,GM552A,MW3650,ME3630,ME3610,MC8635,GM620S,GM800

2020.01  - 高新兴物联  - 商品及供应商介绍

涂鸦智能Cube Cloud正式支持阿里云IoT、腾讯云IoT和AWS IoT

12月29日,涂鸦智能正式对外宣布,其IoT平台支持兼容各大主流云厂商IoT平台南向设备接入和北向应用服务。本文重点介绍标准化迁移解决方案及涂鸦IoT平台如何为客户迁移保驾护航。

2024-01-10 -  原厂动态

Semtech Corporation完成对Sierra Wireless的收购

Semtech Corporation收购,交易将LoRa®的超低功耗优势与蜂窝网络的更高带宽能力结合在一起,打造出全新的物联网云到芯片系统领导者,预计其物联网市场机会到2027年将增长约10倍,达到100亿美元。

2023-02-07 -  原厂动态 代理服务 技术支持 批量订货

华轩阳电子LDO选型表

华轩阳电子LDO选型表包括以下品类:100mA线性稳压器,1A线性稳压器,250mA线性稳压器,300mA低压差线性稳压器,500mA低压差线性稳压器,500mA线性稳压器,50mA线性稳压器;并包含以下几种封装:SOT-223,SOT-23,SOT-89,SOT89-3L,TO252-2L;应用等级 分为民用级和消费级,输出类型分为固定或可调,输出极性分为正或负。

产品型号
品类
输入电压
输出电压
输出电流
封装
应用等级
输出类型
输出极性
HXY6206I-2.5
低压差线性稳压器
8V
2.5V
300mA
SOT-23
民用级
固定

选型表  -  华轩阳电子 立即选型

Sierra Wireless 智能模块选型表

Sierra Wireless 智能模块选型:Dimensions(mm):22mmx23mmx2.5mm和51mmx30mmx3.6mm;Bands:多种Bands;峰值下载率(Mbps/Gbps/Kbps):10Mbps和150Mbps;峰值上传速率(Mbps/Gbps/Kbps):5Mbps和50Mbps

产品型号
品类
Dimensions(mm)
Bands
Peak Download Rate(Mbps/Gbps/Kbps)
Peak Upload Rate(Mbps/Gbps/Kbps)
RC7611 DO GNSS Q JVN._1105020
4G IoT Modules
22mmx23mmx2.5mm
LTE:B2,B4,B5,B12,B13,B14,B25,B26,B66,B71
150Mbps
50Mbps

选型表  -  Sierra Wireless 立即选型

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物联网天线方案设计/虚拟天线芯片方案设计

Ignion可支持多协议、宽频段的物联网天线方案设计,协议:Wi-Fi、Bluetooth、UWB、Lora、Zigbee、2G、3G、4G、5G、CBRS、GNSS、GSM、LTE-M、NB-IoT等,频段范围:400MHz~10600MHz。

最小起订量: 2500 提交需求>

直流无刷风扇定制

可定制风扇尺寸范围:30mm~120mm;转速:2000~30000RPM;噪音≥17dB。最大风量范围:3.28~262.39CFM;最大风压范围:1.25~110.83mmH2O;

最小起订量: 1 提交需求>

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