Bornsun Offers Many Thermal Interface Thermal Conductive Materials that Can be Applied to UPS
UPS is an uninterruptible power supply containing energy storage devices, rectifiers, inverters, batteries as the main components, mainly for the power supply stability requirements of higher equipment to provide uninterruptible power supply, the role of the UPS is reflected in two aspects, one is the utility voltage stabilisation after the supply to the load to improve the quality of the power supply, at the same time for the charging of batteries in the machine; secondly when the utility power is interrupted to act as a supply source of DC power will be converted to supply AC power to the load through the inverter battery. The second is to act as a power supply when the utility power is interrupted, converting the DC power in the battery to supply AC power to the load through the inverter.
Compared with 4G, 5G has the requirements of ultra-high speed rate, ultra-low latency, and ultra-wide connectivity, which need to be paired with higher performance processors and specialised integrated circuits to improve data transmission performance, while the AAU and BBU work with high power consumption and increased heat dissipation. If the internal temperature of the base station is too high, it will affect the normal operation of the internal devices, and then cause network instability.
Thermal interface thermal conductive materials that can be applied to UPS:
① Thermally conductive silicone grease (BN-GC3095, BN-GC4095) can be used for the heat dissipation of the main chip of the power supply, the UPS power density is high, the heat dissipation needs are large, thermally conductive silicone grease in the ultra-thin compressed thickness of the thermal resistance is extremely low, the thermal conductivity effect is good. Thermally conductive silicone grease itself has excellent low ionic content, high purity, non-corrosive and non-toxic.
②Thermally conductive insulating film (BNG600, BNG410, BNG700) can be used for heat dissipation between the inverter power module IGBT (MOS tube) and heat sink, and can be fastened with screws so that the thermally conductive insulating film can fully contact the interface between the heat source and the heat sink interface to improve the heat dissipation efficiency. The thin thickness of the thermally conductive insulating film can fill the gap, and its excellent electrical insulation properties can increase the insulation strength, and high thermal stability, long working life. It meets the environmental requirements of UL and has good flame retardant properties.
③Thermally conductive sealant (BN-RT200H series) can be used for transformers, high-power resistance and capacitance and PCB board or shell of the bonding thermal conductivity. Its bonding performance is good, low contact thermal resistance, good thermal conductivity. And excellent insulation properties and water and solvent resistance can improve the safety and reliability of UPS power supply work.
④ thermal pads (BN-FS300GF, BN-FS300SP) can be used for gap leveling large area heat dissipation, loaded with glass fibre substrate paste tearing easy to return to the repair, can be used for the back of the PCB board to fit, to improve the heat dissipation of heat capacity. Thermally conductive spacer with low hardness, soft and resilient, low assembly pressure; smooth and flat surface, good resistance to friction and puncture performance; with good thermal conductivity and electrical insulation.
⑤ Thermal Conductive Potting Adhesive BN-RT120 is used for potting of components and power converters to achieve insulation and thermal conductivity.
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鸿富诚（HFC）热界面材料/屏蔽材料/吸波材料选型指南
公司介绍 Company Profile 热界面材料介绍 Thermal Interface Material Introduction 导热硅胶垫片 Thermal Pad 各向异性导热垫片 Anisotropic Thermal Pad 导热凝胶 Thermal Gel 导电泡棉 FOF Gasket 石墨泡棉 Graphite Foam 半包型导电泡棉 Half-wrapped Gasket SMT导电泡棉 SMT Gasket 全方位导电泡棉 XYZ Conductive Foam 导电PE Conductive PE 导电毛丝 Conductive FOA 导电布胶带 Conductive Fabric Tape 铜/铝箔胶带 Copper/Atuminum Foil Tape 吸波材料 Wave-absorbing Material 导热吸波材料 Thermal Conductive Absorbing Material
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BOYD（宝德）板级散热产品选型指南
General Information Board Mounted Heat Sinks part number Introduction Interface Materials Labor Saving Heat Sink to Board and Semiconductor Mounts Clips Accessories
BOYD - 向导,COPPER SLIDE ON HEAT SINK,HEAT SINK,HIGH POWER, SQUARE BASKET HEAT SINK,SPACE SAVING HEAT SINKS,HIGH POWER FLAT BACK EXTRUDED CHANNEL STYLE HEAT SINK,COPPER HEAT SINK,完成,LOW COST CHANNEL STYLE HEAT SINK,INSULATING STANCHION PADS,TEFLON-FILLED ACETAL BUSHINGS,PUSH PIN HEAT SINKS,STANCHION PADS,CLIP ON STYLE HEAT SINK,散热片,ANGLE FIN HEAT SINK,EXTRUDED COLLAR HEAT SINKS,凹形半导体底座,挤压成型散热器,低成本通道式散热器,THERMAL CLIPS,CHANNEL STYLE HEAT SINKS,SLIDE ON HEAT SINKS,SOLDERABLE NUTS,CLINCH NUTS,两件式散热器,NYLON SHOULDER WASHERS,丙烯酸粘合剂,SPACE SAVING EXPANDABLE COLLAR HEAT SINK,节省空间的交错散热器,散热器上的低成本滑块,SLIP ON STYLE HEAT SINKS,SOLDERABLE MOUNTS,CLIP ON STYLE HEAT SINK,SPACE SAVING COLLAR HEAT SINKS,ALUMINUM OXIDE CERAMIC,卡片弹出装置,散热器上的铜片,CLIP HEAT SINKS,INTERFACE PADS,可焊螺母,平背挤压散热器,卡在冷却器散热器上,安装套件,铜散热片,节省空间的散热器,LOW COST DIAMOND SHAPED BASKET HEAT SINK,在散热器上滑动,DOUBLE-SIDED THERMAL TAPES,聚苯硫醚（PPS）肩垫,低成本菱形篮式散热器,LOW COST SLIDE ON COOLER HEAT SINKS,BGS夹式散热器,LOW PROFILE HAT SECTION HEAT SINK,SILICONE BASED PADS,ALUMINUM OXIDE CERAMIC INSULATORS,MOUNTING KITS,大功率挤压散热器,角翅片散热器,EXTRUDED COLLAR STYLE HEAT SINK,方形篮式散热器,可焊接安装片,聚酰亚胺塑料薄膜,热润滑脂,COMPACT SLIDE ON HEAT SINKS,LOW PROFILE CHANNEL STYLE HEAT SINK,MALE SEMICONDUCTOR MOUNTS,SEMICONDUCTOR MOUNTS,DIAMOND SHAPED HEAT SINK,POLYIMIDE PLASTIC FILMS,THERMALLY CONDUCTIVE TAPE,半导体底座,PLUG IN STYLE HEAT SINK,HAT SECTION HEAT SINKS,TEFLON-FILLED ACETAL INSULATORS,螺纹可焊接螺柱,薄型低成本通道式散热器,SNAP DOWN STYLE HEAT SINKS,ACRYLIC ADHESIVE,MOUNTING PADS,SOLDERABLE MOUNTING TABS,TEFLON-FILLED ACETAL INSULATORS,STANDARD EJECTORS,SQUARE BASKET HEAT SINK,菱形散热器,聚苯硫醚PPS肩垫,挤压轴环散热器,HEAVY GAUGE SQUARE BASKET HEAT SINK,DUAL EXTRUDED HEAT SINKS,SLIM LOW COST CHANNEL STYLE HEAT SINK,双高升式散热器,DIAMOND SHAPED BASKET HEAT SINKS,SNAP-ON EJECTORS,GUIDES,薄型通道式散热器,推引脚散热器,自锁支座凸片,PLUG IN STYLE HEAT SINK,滑盖式散热器,散热器上的紧凑型滑盖,冷却器散热器上的低成本滑块,低轮廓帽形截面散热器,HAT SECTION HEAT SINK,MULTIWATT HEAT SINKS,SPACE SAVING TWISTED FIN HEAT SINK,NARROW CHANNEL STYLE HEAT SINK,SNAP-ON EJECTORS/PULLERS,板装散热器,BOARD MOUNTED HEAT SINKS,SPACE SAVING EXPANDABLE HEAT SINK,TWO PIECE HEAT SINKS,节省空间的可扩展轴环散热器,接口焊盘,相变热界面材料,高强度环氧胶粘剂,DOUBLE SIDED TAPE,夹式散热器,SNAP DOWN STYLE HEAT SINK,WIDE EXTRUDED HEAT SINK,低成本推进散热器,POLYPHENYLENE SULFIDE PPS SHOULDER WASHERS,COPPER CHANNEL STYLE HEAT SINK,高升式散热器,FINISHES,LOW COST PUSH ON HEAT SINK,挤压环氧树脂附着散热器,BGS CLIP HEAT SINKS,EXTRUDED EPOXY ATTACH HEAT SINK,方篮散热器,CHANNEL STYLE HEAT SINK,SQUARE BASKET STYLE HEAT SINK,聚四氟乙烯填充的乙缩醛衬套,POLYPHENYLENE SULFIDE (PPS) SHOULDER WASHERS,EXTRUDED HEAT SINKS,HIGH RISE STYLE HEAT SINKS,TWO PIECE HEAT SINK,CARD EJECTORS,氧化铝陶瓷绝缘子,卡扣式喷射器,SELF LOCKING STAND-OFF TAB,对准垫,绝缘子,INSULATING COVERS,INTERFACE MATERIAL,帽型散热器,散热器上的低成本黄铜夹,CHANNEL STYLE HEAT SINK,SOLDERABLE PINS,THERMAL GREASES,EPOXY ADHESIVE,环氧树脂,ALIGNMENT PADS,铜窄通道式散热器,PULLERS,绝缘台肩垫圈,HIGH STRENGTH EPOXY ADHESIVE,公头半导体底座,HIGH PERFORMANCE CHANNEL STYLE HEAT SINK,LOW COST BRASS CLIP ON HEAT SINK,SILICONE-FREE SYNTHETIC GREASE,SPACE SAVING STAGGERED FIN HEAT SINK,绝缘支柱衬垫,高功率平背挤压通道式散热器,HAT SECTION STYLE HEAT SINK,支柱衬垫,窄通道式散热器,多瓦散热器,双通道式散热器,SQUARE BASKET HEAT SINK,插入式散热器,SURFACE MOUNT HEAT SINK,滑动式散热器,坚果,INSULATORS,硅树脂基垫,通道式散热器,可焊接底座,卡扣式推出器/拉出器,按扣式散热器,菱形篮式散热器,SQUARE BASKET HEAT SINKS,安装垫,节省空间菱形篮式散热器,导热胶带,无硅合成润滑脂,CLIP ON STYLE HEAT SINKS,SPACE SAVER DIAMOND SHAPED BASKET HEAT SINK,LOW COST SLIDE ON HEAT SINKS,标准喷射器,SNAP ON COOLER HEAT SINKS,绝缘盖,HEAT SINKS,SPACE SAVING STAGGERED HEAT SINK,INSULATING SHOULDER WASHERS,双挤压散热器,高性能通道式散热器,低轮廓通道式散热器,界面材料,FEMALE SEMICONDUCTOR MOUNTS,SLIDE ON STYLE HEAT SINKS,EXTRUDED HEAT SINK,SOLDER ANCHOR,帽型截面式散热器,双面胶带,HIGH RISE STYLE HEAT SINK,表面贴装散热器,DUAL HIGH RISE STYLE HEAT SINKS,挤压套环式散热器,FLAT BACK EXTRUDED HEAT SINK,EPOXIES,热夹,PHASE-CHANGE THERMAL INTERFACE MATERIAL,SOLDERABLE STUDS,大尺寸方篮散热器,尼龙肩垫,填充聚四氟乙烯的乙缩醛绝缘子,COPPER NARROW CHANNEL STYLE HEAT SINK,节省空间的轴环散热器,LOW PROFILE HAT SECTION HEAT SINK,双面热敏胶带,TWIN CHANNEL STYLE HEAT SINK,SLIM LOW PROFILE CHANNEL STYLE HEAT SINK,HIGH POWER EXTRUDED HEAT SINK,THREADED SOLDERABLE STUDS,PLUG IN STYLE HEAT SINKS,6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 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G,542502D00000G,577304B00000G,500203,7717-247G,374524B00032G,SW63-4G,101600F00000G,576802B04000G,7721-7PPS,109G,531302V02500G,506003B00000G,590302B03600G,573400D00000G,SW63-2G,579302,374824B00035G,533701B02552G,574102B0 00 00G,10-L4LB-03G,NG,335214B00034G,532802B02500G,6222BG,4880G,574102B03300G,575603B00000G,375024B00032G,513302,513301,534202,7020BG,590102,577_ _02B 0 4000G,7717-79G,6239B-MTG,5_9003B 0 0000G,10-6326-27G,574402B03200G,5900PBG,5005-09NG,6021_–_-_G,507222B00000G,578622B03200G,529801B000 _ 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00G,520329,575002,580500B00000G,335224B00034G,504222B00000G,10-BRD2-01G,6109PBG,566902B03100G,519703,7717-7G,577922B00000G,T410R,578505B00000G,513101B02500G,6374BG,505303,533621B02552G,576602B00000G,533202B02551G,374224B60023G,2327B-CP50G,6396B-P2G,7717-8G,4177G,575300B00000G,4949G,374724B00032G,TV40G,6396BG,335314B00000G,7038BG,6225B-MTG,505403B00000G,530714,615653B00250G,373224M00032G,374424B00035G,132000F00000G,574102,10-BRD1-01G,504222,533301B02551G,501706B00000G,574802B0 _ _ 00G,520327B00000G,125700D00000G,10-BRD1-04G,532702B02500G,533802,579206V00000G,505103,374124B00035G,575603,574802B03300G,5005-25NG,TC1,566902,TC6,TC7,115200F00000G,531102B02500G,10-BRD1-03G,533001B02551G,542502,533502B02552G,501200B00000G,542502B000 _ _G,513302B02500G,576203B00000G,374424B00032G,579902B00000G,320205B00000G,10-BRD1-07G,116200F00000G,375424B00034G,507302,335114B00032G,4171G,161000F00000G,529801B000 _ _ G,350G,374524B60023G,10-BRD1-05G,532702,375124B00035G,530102B00100G,374124B00032G,513002B02500G,551002B00000G,577002B00000G,513202,513201,6049PBG,46-77-9G,7023BG,7717-122G,506902,351G,PF435G,7019PBG,375124B00032G,533622B02552G,110G,7721-10PPSG,593101,7023B–_G,10-L4LB-11G,374124B60023G,529801,529802,6070B– G,574602,533721
【选型】BNG600导热绝缘垫片替换陶瓷垫片用于MOS管散热，柔软、抗撕裂、易安装、寿命长，可降低工艺成本
虽然陶瓷垫片的导热系数比一般的导热垫片高很多，而且绝缘强度也非常高，但陶瓷垫片比较脆，在受到压力的情况下容易碎裂，而且使用工艺复杂，需要在陶瓷片两边涂硅脂，传热路径变长，热阻变大，导热效果会受到影响，所以陶瓷垫片给MOS管散热也存在较大的风险，同时工艺成本较大，而BNG600导热绝缘垫片完全可以避免这些问题，成为MOS管散热的新方案。
金菱通达（GLPOLY）热对策材料选型指南
Company Profile Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel Thermal Pad Thermal Silicone Pad & Silicone Thermal Fiberglass/Film EMI absorber/Absorption Gel Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound Silicone/Non-Silicone Thermal grease Silicone Thermal Tape Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad
金菱通达 - 低密度导热硅凝胶垫,NON-SILICONE THERMAL TAPE,NON-SILICONE THERMAL GREASE,LOW DENSITY THERMAL GAP PAD FOR EV BMS,ELECTROSTATIC DISCHARGE THERMAL SILICONE PAD,热间隙垫,硅酮热膜,减振硅胶垫,硅橡胶热垫,NON-SILICONE THERMAL FIBERGLASS,非硅酮热玻璃纤维,无硅密封剂,热腻子凝胶,PRINTABLE PCM THERMAL LNTERFACE MATERIAL,热界面相变材料,导热电磁干扰吸收软垫,SILICONE THERMAL FIBERGLASS,无应力硅酮热腻子凝胶,脉冲编码调制系统,EML吸收器,非硅酮热敏带,EMI ABSORBER,石墨热辐射垫,热EMI吸收凝胶,用于电动汽车BMS的低密度热间隙衬垫,THERMALLY CONDUCTIVE INSULATOR,非硅酮热垫,THERMALLY CONDUCTIVE EMI ABSORBER,双组分热界面密封剂,静电放电散热硅胶垫,THERMAL CONDUCTIVE SILICONE GEL PAD,SILICONE RUBBER THERMAL PAD,导热粘合剂,THERMAL FIBERGLASS,THERMAL INTERFACE PHASE CHANGE MATERIALS,PRINTABLE PCM THERMAL INTERFACE MATERIAL,ELECTROSTATIC DISCHARGE THERMAL GAP PAD,可印刷PCM热界面材料,GRAPHITE THERMAL RADIATION PAD,非硅酮热润滑脂,非硅酮腻子凝胶,THERMAL EMI ABSORPTION GEL,THERMAL PUTTY GEL,NON-SILICONE THERMAL PAD,SILICONE RUBBERTHERMAL PAD,SILICONE THERMAL PUTTY PAD,两部分液体热间隙垫,硅酮热垫,导热绝缘体,两部分可分配热垫,硅热玻璃纤维,SILICONE FREE SEALING COMPOUND,硅酮热腻子垫,STRESSLESS SILICONE THERMAL PUTTY GEL,THERMAL GREASE,NON-SILICONE THERMAL GREASE,SILICONE THERMAL PAD,PHASE CHANGE MATERIALS,静电放电热间隙垫,SILICONE THERMAL FILM,热界面润滑脂,EML ABSORBER,热玻璃纤维,SILICONE THERMAL TAPE,热导率EML吸收体PCM,THERMAL CONDUCTIVITY EMI ABSORBER SOFT PAD,TWO-PART THERMAL INTERFACE SEALING COMPOUND,导热硅凝胶垫,THERMAL GAP PAD,硅酮热敏带,THERMALLY CONDUCTIVE ADHESIVE,PCMS,非硅酮密封剂,VIBRATION DAMPENING SILICONE PAD,硅热凝胶,SILICONE PUTTY PAD,THERMAL CONDUCTIVITY EMI ABSORBER,非硅酮型,硅热润滑脂,NON-SILICONE SEALING COMPOUND,导热EMI吸收材料,TWO-PART DISPENSABLE THERMAL PAD,TWO-PART LIQUID THERMAL GAP PAD,THERMAL LNTERFACE GREASE,散热膏,THERMAL INTERFACE GREASE,NON-SILICONE PUTTY GEL,硅酮腻子垫,THERMAL CONDUCTIVITY EML ABSORBER PCM,NON-SILICONE TYPE,相变材料,导热EMI吸收凝胶,SILICONE THERMAL GREASE,THERMALLY CONDUCTIVE EMI ABSORPTION GEL,SILICONE THERMAL GEL,LOW DENSITY THERMALLY CONDUCTIVITY SILICONE GEL PAD,XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10,电机控制,MOTOR CONTROLS,空中飞行,OPTICAL PRODUCTS,HEAT SINK,军事的,摄像头,DIGITAL DISK DRIVES,北桥集成电路,医学电子学,MEDICAL ELECTRONICS,DC-DC CONVERTERS,高压装置,NEW ENERGY VEHICLES,AEROSPACE,散热片,COMPUTER,HIGH FREQUENCY IC CHIP,CAMERA,存储设备,手机应用,AIR FLIGHT,GRAPHIC CARDS,POWER SUPPLIES,光学产品,LED LIGHT,PERIPHERALS,HIGH PERFORMANCE COMPUTER PROCESSORS GRAPHIC CARDS,HAND-SET APPLICATIONS,POWER CONVERSION,TELECOMMUNICATIONS,工业控制设备,LED LIGHTING,POWER SEMICONDUCTORS,CELLULAR PHONES,FPC,军工设备,MILITARY EQUIPMENT,HIGH PERFORMANCE COMPUTER PROCESSORS,CONSUMER ELECTRONICS,射频模块,LED灯,CONSUMER ELECTRONICS,手机,HIGH VOLTAGE UNITS,SEMICONDUCTOR,消费电子,RF MODULE,航空航天,功率半导体,无线通讯,光纤模块,UAV,TELECOMMUNICATIONS,COMPUTER,医疗器件,DC-DC转换器,数字磁盘驱动器,高性能计算机处理器,STORAGE DEVICE,FIBER OPTICS MODULES,MILITARY,MEDICAL DEVICES,AUTOMOTIVE SYSTEMS,半导体,医疗设备,MEDICAL EQUIPMENT,AUTOMOTIVE ELECTRONICS,新能源汽车,LED,COMPUTER CPU,计算机中央处理器,功率转换,TELECOMMUNICATIONS CAMERA,LED照明,图形卡,外围设备,INDUSTRIAL CONTROL EQUIPMENT,电脑,NORTH BRIDGE IC,发光二极管,电源,汽车系统,高频集成电路芯片,汽车电子,柔性线路板,无人飞机
Thermally Conductive Interface Materials Applied To Outdoor Energy Storage
Outdoor energy storage power supplies are generally built-in high energy density lithium-ion batteries, highly integrated with decentralised charging devices, storage devices and power supply devices. It can store solar power conversion, grid power, automotive power generation and generator power generation, and also output high-power AC and DC power. This article is telling about the thermally conductive interface materials that can be applied to outdoor energy storage.
Parker Chomerics（派克固美丽）热界面材料（用于电子产品散热）选型指南
Company Profile Heat Transfer Fundamentals Thermal Gels Gap Filler Pads Phase Change Materials Thermal Tapes Potting and Underfill Materials Dielectric Pads Heat Spreaders Thermal Greases Glossary
PARKER CHOMERICS - THERMALLY CONDUCTIVE PADS,NON-SILICONE,PHASE-CHANGE THERMAL INTERFACE PADS,热间隙填充垫,HEAT SPREADERS,热绝缘体,间隙填充垫,DOUBLE-SIDED THERMAL TAPES,热敏胶带,热润滑脂,压敏黏合剂,THERMAL INTERFACE MATERIALS,THIN HEAT SPREADERS,DOUBLE-SIDED THERMAL INTERFACE TAPES,PRESSURE SENSITIVE ADHESIVE,THERMAL TAPES,PSA,GELS,THERMAL GAP FILLER PADS,HEAT SPREADERS,THERMAL INTERFACE MATERIALS,THERMAL INSULATOR PADS,THERMAL INSULATORS,散热器,导热垫,GAP FILLER PADS,THERMAL GREASES,导热电绝缘垫,PADS,UNDERFILL MATERIALS,THERMALLY CONDUCTIVE GAP FILLER PADS,PHASE CHANGE MATERIALS,灌封材料,THERMALLY CONDUCTIVE ATTACHMENT TAPES,THERMAL GREASES,底部填充材料,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,热凝胶,导热间隙填充垫,导热连接带,绝缘垫,POTTING MATERIALS,非硅胶，相变热界面垫,THERMAL GAP FILLERS,GAP FILLERS,NON-SILICONE, PHASE-CHANGE THERMAL INTERFACE PADS,SILICONE GREASE,导热凝胶,DIELECTRIC PADS,相变材料,THERMALLY CONDUCTIVE GELS,THERMAL GELS,PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10,电机控制器,INFORMATION TECHNOLOGY,TELECOMMUNICATION INFRASTRUCTURE COMPONENTS,MEMORY MODULES,TELEVISIONS,GRAPHICS PROCESSORS,不间断电源,UPS,电信基础设施组件,不断电系统,HANDHELD PORTABLE ELECTRONICS,图形处理器,MEDICAL DEVICE,MOTOR,POWER CONVERSION,LIGHT EMITTING DIODE,LIGHTING,电机控制处理器,金属氧化物半导体场效应晶体管阵列,POWER SEMICONDUCTORS,汽车电子控制单元,SERVER CPU,ENGINE CONTROLLERS,CONSUMER ELECTRONICS,手机,POWER MODULES,MOTOR CONTROLLERS,INDUSTRIAL APPLICATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,LAPTOP PC,UNINTERRUPTIBLE POWER SUPPLIES,欧洲货币单位,DEFENSE,服务器CPU,ENGINE CONTROL,TELECOMMUNICATIONS EQUIPMENT,PC PROCESSORS,微处理器,MOSFET ARRAYS,HIGH SPEED DISK DRIVES,发动机,AUTOMOTIVE ELECTRONICS,牵引力控制,MOBILE,电视和电子产品,TRANSPORTATION,发光二极管,ECU,工业应用,笔记本电脑,AEROSPACE,内存模块,汽车电子,TRANSMISSION CONTROL MODULES,制动控制,LAPTOP PCS,发动机控制,TRACTION CONTROL,桌面,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,发光二极体,POWER SUPPLIES,MOTOR CONTROL PROCESSORS,TELECOMMUNICATIONS,功率转换设备,个人电脑处理器,BRAKING CONTROL,TELEVISIONS ELECTRONICS,CONSUMER ELECTRONICS,CHIPSETS,发动机控制器,消费电子,功率半导体,无线通讯,LEDS,TELECOMMUNICATIONS,GRAPHICS PROCESSORS,SERVERS,DESKTOP,MICROPROCESSORS,POWER CONVERSION EQUIPMENT,变速箱控制,CONSUMER,HANDHELD DEVICES,LAPTOPS,电视机,DESKTOP COMPUTERS,变速器控制模块,MOBILE,LED,手持便携式电子设备,高速磁盘驱动器,INDUSTRIAL,CPUS,电源,TRANSMISSION CONTROL
【选型】博恩导热材料助力光伏逆变器散热设计，导热硅脂最高导热系数达3.8W/mK
博恩的导热垫片，导热硅脂，导热灌封胶，导热矽胶布或热固化粘接膜，绝缘片材和RTV粘胶胶等特色产品应用于光伏逆变器，使光伏逆变器具有良好的散热效果，绝缘性能和粘接稳定性。
Thermally Conductive Materials For Mobile communications infrastructure (5G/4G/3G)
Compared with 4G, 5G has the requirements of ultra-high speed rate, ultra-low latency, and ultra-wide connection, which needs to be paired with higher performance processors and specialised integrated circuits to enhance the data transmission performance, while the AAU and BBU work with high power consumption and increased heat dissipation. If the internal temperature of the base station is too high, it will affect the normal operation of internal devices, and then cause network instability.
有没有导热系数＞2W，绝缘好，且双面有胶可粘贴的产品
你好，可推荐使用汉华TSHB30、博恩BNG410，技术参数请查阅1、TSHB30：https://www.sekorm.com/doc/2832613.html 2、BNG410：https://www.sekorm.com/doc/2119705.html
博恩导热硅胶绝缘膜选型表
博恩导热绝缘膜选型：可调整基材，导热系数0.5~5W，应用间隙0.15mm~0.38mm
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产品型号
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品类
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厚度(mm）
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导热系数(W/m·K）
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热阻(℃·in²/W@50Psi）
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体积电阻(Ω·cm）
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击穿电压(AC,KV）
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BNG400
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导热硅胶绝缘膜
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0.23-0.3
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1.6
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0.57
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10¹⁴
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＞4.5
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选型表 - 博恩 立即选型
Thermally Conductive Interface Materials and Insulating Materials Applied to Enterprise Servers
Enterprise-class servers are mostly used with more than hundreds of networked computers, with strict requirements for data processing speed and data security management, and high requirements for hardware configuration and system reliability. This article is telling about the thermally conductive interface materials and insulating materials that can be applied to enterprise-level servers.
电子商城
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
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