Introducing Kyocera‘s Small and Thin MLCCs for Semiconductor Applications and Operable at 105℃

时间： 2024-09-06 来源：KYOCERA Official Website

技术问答

KYOCERA has developed a lineup of small and thin products operable at the high-demand 105℃ temperature limit.

Overview

In recent years, due to heat generation around the processor die and PMIC, the demand for high-temperature operable has increased from 85℃ to 105℃.

Kyocera has a wide range of small MLCC products, from EIA0201 size 1μF to EIA0805 size 100μF.

A new addition to the product lineup is the thin 2.2μF capacitor, EIA0503 size (1.15×0.65mm), which can be mounted in BGA gaps of thickness 0.22mm or less.

Keywords

What is a processor?

This is a general term for processing equipment and generally refers to a CPU.

What is die?

Each chip is a pattern of wires and elements baked into a silicon wafer and diced.

What is PMIC?

It stands for "Power Management IC," and it combines multiple DC/DC converters and power control functions. It means an IC that can perform power management.

What is BGA?

BGA is a type of semiconductor package consisting of a grid of small ball-shaped solders. It is short for Ball Grid Array.

Features

Suitable for High-temperature Environments (up to 105℃)

Compatible with high-temperature environments due to heat generation, such as near processor dies and PMICs.

Wide Range of Lineups
Kyocera has a wide lineup, from 1μF (EIA0201 size) to 100μF (EIA0805 size).

Thin Series of 0.22mm or Less
Kyocera will develop thin series of 0.22mm or less, which can be mounted in the gap of BGA.

Applications

The semiconductor periphery and the back surface of the package board.

Product Lineup

General Use

Thin MLCCs Series 0.22mm or Less

Products highlighted yellow are available for mass production.
Products highlighted green are under development.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由玄子转载自KYOCERA Official Website，原文标题为:Introducing Kyocera's Small and Thin MLCCs for Semiconductor Applications and Operable at 105℃，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

Kyocera Introduces Cutting-Edge Peltier Module with 21% Increase in Cooling Performance

Kyocera Corporation (President: Hideo Tanimoto, hereinafter: Kyocera) today introduced a new Peltier (thermoelectric) module with improved heat absorption. This new Peltier module has a maximum heat absorption rate*1 21% higher than Kyocera‘s conventional products, enabling dramatically enhanced cooling performance.

产品发布时间 : 2024-07-16

KYOCERA to Increase MLCC Production for 5G, ADAS and EV Technology with New Manufacturing Plant

Demand for MLCCs is expected to grow as communication terminals and semiconductor devices become more compact and sophisticated. The expanding commercialization of 5G data centers, ADAS, and EV technology will be facilitated by smaller, more functional electronic components like MLCCs.

原厂动态发布时间 : 2023-04-07

Empower Semiconductor Showcases Innovation in Integrated Voltage Regulator and Silicon Capacitor Technologies at PowerUp Expo 2022

Empower Semiconductor announced that it will be participating in the forthcoming PowerUP EXPO 2022 virtual conference and exhibition. The virtual Empower booth will showcase their high-performance power management IVRs that are designed to provide efficiency, size, and cost benefits to energy-hungry, data-intensive, electronics applications by replacing the traditional power management integrated circuits with a single tiny IC.

原厂动态发布时间 : 2023-03-07