Thermal Pad vs Paste: Which is Better for Your Needs?

时间： 2024-09-19 来源：SHEEN Official Website

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Thermal Pad vs Paste: Which is Better for Your Needs?

When it comes to thermal management in electronic devices, choosing the right thermal interface material (TIM) is crucial. Two common options are thermal pads and thermal paste. Each has its unique properties and applications, and understanding their differences can help you make an informed decision.

What is a Thermal Pad?

Thermal pads are solid materials, often made of silicone, silicone-free material, or phase change materials, designed to transfer heat from electronic components to heat sinks. They are pre-cut, easy to install, and provide consistent thermal performance. Thermal pads are ideal for applications where convenience and reliability are priorities, such as in pre-assembled electronics or devices with large, uneven surfaces.

Advantages of Thermal Pads:

Ease of Installation: No mess or precise application needed.

Consistency: Offers uniform thickness and thermal conductivity.

Durability: Resistant to pump out, making them reliable under varying conditions.

Versatility: Suitable for a range of applications, from CPUs to power transistors.

What is Thermal Paste?

Thermal paste, also known as thermal grease or compound, is a viscous substance applied between the CPU or GPU and the heat sink. It fills microscopic imperfections on surfaces, ensuring efficient heat transfer. Unlike thermal pads, thermal paste requires careful application and is often used in high-performance computing environments where maximizing heat dissipation is critical.

Advantages of Thermal Paste:

High Thermal Conductivity: Often provides better heat transfer compared to pads, especially for high-performance applications.

Custom Fit: Can be applied as a thin layer, optimizing contact and thermal performance.

Flexibility: Suitable for a wide range of components and cooling solutions.

Key Differences

1.Application and Convenience: Thermal pads are easy to apply and remove, making them ideal for situations where frequent maintenance is needed. In contrast, thermal paste requires careful application and can be messy.

2.Thermal Performance: While thermal paste generally offers superior thermal conductivity, thermal pads provide adequate performance for most consumer electronics and offer better durability in dynamic environments.

3.Usage Scenarios: Thermal paste is preferred in high-performance computing where maximum heat transfer is essential. Thermal pads are more commonly used in consumer electronics, providing a balance between performance and convenience.

Conclusion

Choosing between thermal pads and paste depends on your specific needs. For ease of use and durability, thermal pads are an excellent choice. For maximum thermal conductivity in high-performance setups, thermal paste may be more suitable. Understanding the strengths of each can help you optimize your thermal management strategy.

Recommended Products from SHEEN

For those looking for reliable thermal management solutions, SHEEN offers high-quality thermal interface materials:

SHEEN Thermal Pads: With a thermal conductivity range of 1 to 15 W/m·K, our thermal pads are perfect for a variety of applications, providing consistent performance and ease of installation.

SHEEN Thermal Paste: Our thermal paste offers a thermal conductivity range of 1 to 5 W/m·K, making it ideal for high-performance computing where efficient heat dissipation is crucial.

By choosing SHEEN's thermal pads or paste, you can ensure optimal performance and longevity for your electronic devices.

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Parker Chomerics（派克固美丽）热界面材料（用于电子产品散热）选型指南

Company Profile Heat Transfer Fundamentals Thermal Gels Gap Filler Pads Phase Change Materials Thermal Tapes Potting and Underfill Materials Dielectric Pads Heat Spreaders Thermal Greases Glossary

PARKER CHOMERICS - THERMALLY CONDUCTIVE PADS,NON-SILICONE,PHASE-CHANGE THERMAL INTERFACE PADS,热间隙填充垫,HEAT SPREADERS,热绝缘体,间隙填充垫,DOUBLE-SIDED THERMAL TAPES,热敏胶带,热润滑脂,压敏黏合剂,THERMAL INTERFACE MATERIALS,THIN HEAT SPREADERS,DOUBLE-SIDED THERMAL INTERFACE TAPES,PRESSURE SENSITIVE ADHESIVE,THERMAL TAPES,PSA,GELS,THERMAL GAP FILLER PADS,HEAT SPREADERS,THERMAL INTERFACE MATERIALS,THERMAL INSULATOR PADS,THERMAL INSULATORS,散热器,导热垫,GAP FILLER PADS,THERMAL GREASES,导热电绝缘垫,PADS,UNDERFILL MATERIALS,THERMALLY CONDUCTIVE GAP FILLER PADS,PHASE CHANGE MATERIALS,灌封材料,THERMALLY CONDUCTIVE ATTACHMENT TAPES,THERMAL GREASES,底部填充材料,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,热凝胶,导热间隙填充垫,导热连接带,绝缘垫,POTTING MATERIALS,非硅胶，相变热界面垫,THERMAL GAP FILLERS,GAP FILLERS,NON-SILICONE, PHASE-CHANGE THERMAL INTERFACE PADS,SILICONE GREASE,导热凝胶,DIELECTRIC PADS,相变材料,THERMALLY CONDUCTIVE GELS,THERMAL GELS,PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10,电机控制器,INFORMATION TECHNOLOGY,TELECOMMUNICATION INFRASTRUCTURE COMPONENTS,MEMORY MODULES,TELEVISIONS,GRAPHICS PROCESSORS,不间断电源,UPS,电信基础设施组件,不断电系统,HANDHELD PORTABLE ELECTRONICS,图形处理器,MEDICAL DEVICE,MOTOR,POWER CONVERSION,LIGHT EMITTING DIODE,LIGHTING,电机控制处理器,金属氧化物半导体场效应晶体管阵列,POWER SEMICONDUCTORS,汽车电子控制单元,SERVER CPU,ENGINE CONTROLLERS,CONSUMER ELECTRONICS,手机,POWER MODULES,MOTOR CONTROLLERS,INDUSTRIAL APPLICATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,LAPTOP PC,UNINTERRUPTIBLE POWER SUPPLIES,欧洲货币单位,DEFENSE,服务器CPU,ENGINE CONTROL,TELECOMMUNICATIONS EQUIPMENT,PC PROCESSORS,微处理器,MOSFET ARRAYS,HIGH SPEED DISK DRIVES,发动机,AUTOMOTIVE ELECTRONICS,牵引力控制,MOBILE,电视和电子产品,TRANSPORTATION,发光二极管,ECU,工业应用,笔记本电脑,AEROSPACE,内存模块,汽车电子,TRANSMISSION CONTROL MODULES,制动控制,LAPTOP PCS,发动机控制,TRACTION CONTROL,桌面,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,发光二极体,POWER SUPPLIES,MOTOR CONTROL PROCESSORS,TELECOMMUNICATIONS,功率转换设备,个人电脑处理器,BRAKING CONTROL,TELEVISIONS ELECTRONICS,CONSUMER ELECTRONICS,CHIPSETS,发动机控制器,消费电子,功率半导体,无线通讯,LEDS,TELECOMMUNICATIONS,GRAPHICS PROCESSORS,SERVERS,DESKTOP,MICROPROCESSORS,POWER CONVERSION EQUIPMENT,变速箱控制,CONSUMER,HANDHELD DEVICES,LAPTOPS,电视机,DESKTOP COMPUTERS,变速器控制模块,MOBILE,LED,手持便携式电子设备,高速磁盘驱动器,INDUSTRIAL,CPUS,电源,TRANSMISSION CONTROL

January 2022 - 选型指南代理服务技术支持采购服务

你见过“会相变”的导热垫片吗？——导热相变材料

导热硅胶片方便裁剪与贴附，但是导热效果不够导热膏好，导热膏便于重复返工，导热效率相对导热硅胶片要好但是操作没有导热硅胶片便利，人们往往会选择哪一种而考虑许久，这时如果出现一种集合两者的优点的导热材料该多好，下面给大家介绍今天的推荐：导热相变材料。

2023-12-25 - 技术探讨代理服务技术支持采购服务

Kapton绝缘片

Kapton绝缘片是一种用于电导热界面材料（TIM）的组装辅助工具，适用于Conductonaut液体金属、Carbonaut或KryoSheet等。该绝缘片可在高达280摄氏度的高温下使用，每片厚度为40微米，宽度10毫米，长度60毫米。适用于覆盖CPU上的SMD组件或显卡上的RAM组件等。

THERMAL GRIZZLY - 绝缘片,INSULATION SHEET,TG-KIS-10-60-50,RAM COMPONENTS,RAM组件,蒂姆,热界面材料,CPU,TIM,THERMAL INTERFACE MATERIALS,中央处理器,SMDS,SMDS

20240923 - 数据手册代理服务技术支持采购服务

Parker Chomerics（派克固美丽）热界面材料（热传导性凝胶/在位灌封材料/润滑脂）选型指南

Company Profile Overview of Dispensable Materials Material Selection Equipment Types Technical Parameters Packaging Options

PARKER CHOMERICS - 现场固化灌封化合物,GELS,ELECTRONIC APPLICATION,UNDERFILL MATERIALS,导热凝胶,DISPENSABLE, VERY LOW COMPRESSION FORCE, THERMAL GAP FILLERS,THERMAL GREASES,THERM-A-GAP™ GELS,CURE-IN-PLACE POTTING COMPOUNDS,热接口材料,热润滑脂,TIM,THERMALLY CONDUCTIVE GELS,THERMAL INTERFACE MATERIAL,POTTING MATERIALS,T636,T647,T635,T646,CIP 35,GEL 30,T642,TC 50,GEL 25NS,1642,1641,GEL 8010,T630,GEL 75,T650,GEL 45,T660,T670,GEL 37,HIGH-VOLUME AUTOMATED DISPENSING SYSTEMS,配药设备,制动控制,CONSUMER ELECTRONICS,消费电子,POWER DRIVERS,MEMORY MODULES,功率半导体,TELEVISIONS,移动服务器,DC/DC CONVERTERS,DC/DC转换器,LED模块,欧洲货币单位,MICROPROCESSORS,电信基站,不间断电源,TELECOM BASE STATION,POWER CONVERSION EQUIPMENT,TELECOM BASE STATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,DISPENSING EQUIPMENT,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,MOBILE SERVERS,微处理器,POWER SUPPLIES,BRAKING CONTROLS,MOSFET ARRAYS,发动机,牵引力控制,UNINTERRUPTABLE POWER SUPPLIES,功率转换设备,TRACTION CONTROLS,电视和电子产品,金属氧化物半导体场效应晶体管阵列,功率驱动器,POWER SEMICONDUCTORS,汽车电子控制单元,DESKTOPS,电源,ECU,高容量自动分配系统,TELEVISIONS ELECTRONICS,内存模块,台式机,LED MODULES

May 2021 - 选型指南代理服务技术支持采购服务

COLLTECH热界面材料

德聚 - THERMAL GREASE,间隙填充剂,THERMAL INTERFACE MATERIALS,PU,EPOXY,MS,硅酮,SILICONE,热界面材料,THERMAL POTTING COMPOUND,导热粘合剂,微软,散热膏,THERMAL GEL,蒲蒲,环氧树脂,热灌封胶,THERMALLY CONDUCTIVE MATERIALS,热凝胶,ACRYLATE,丙烯酸酯,THERMALLY CONDUCTIVE ADHESIVE,GAP FILLER,导热材料,N-SIL 8780,N-SIL 8516W,N-SIL 8762S,N-SIL 8762,N-SIL 8220L1,N-SIL 8620,EW 6628M,N-SIL 8220L2,N-SIL 8626LS,N-SIL 8745,N-SIL 8206,N-SIL 8742M,N-SIL 8628,N-SIL 8628LS,N-SIL 8745B,N-PU 5820,N-SIL 8608D,N-SIL 8650-2,N-SIL 8275,N-SIL 8210,N-SIL 8745NSL,N-SIL 8772,N-SIL GP8772,N-SIL 8518,N-SIL 8206N,N-SIL 8215L1,AW 2925,INDUSTRIES,SEMICONDUCTOR,电信,汽车,手持设备可穿戴设备,消费电子,个人计算机,电池模块,DRONE,ADAS,DATA CENTER,AUTOMOTIVE,IGBT,CHIP PACKAGING,车载充电器,功率转换器,MEMS,POWER CONVERTERS,行业,PHOTOVOLTAICS,半导体,POWER BATTERY,无人机,TELECOMMUNICATION,动力电池,HAND HELD DEVICESWEARABLES,LED,微机电系统,数据中心,CONSUMER ELECTRONICS,ONBOARD CHARGER,智能家居类,PC,BATTERY MODULES,发光二极管,SMART HOME,阿达斯,ECU,DCU,光伏学,芯片封装

2023/12/22 - 商品及供应商介绍代理服务技术支持采购服务

Choosing the Right Thermal Pad: Thermal Conductivity ＆ Hardness Explained

Selecting the right thermal pad is essential for effective thermal management in electronic devices. Two critical performance factors to consider are thermal conductivity and hardness. In this article, Sheen will explore how these properties influence thermal pad performance and device longevity.

2024-12-17 - 技术探讨代理服务技术支持采购服务

消费电子

该资料主要介绍了Boyd Corporation公司提供的多种元器件产品及其应用领域。涵盖消费电子、家庭办公与家庭影院、家电与智能家居、游戏与娱乐等领域的解决方案，包括密封件、热管理、保护产品等。同时，资料还展示了公司在质量管理体系和认证方面的优势。

BOYD - 层压胶带,VENTILATION GASKETS,定制软管,扬声器垫圈,SPEAKER GASKETS,传导空气-空气热交换器,贴纸,散热片,鼓风机,封装石墨片,冲压减振器,AIR BAFFLES,O型环,DOUBLE COATED TAPES,定制胶带,热模拟软件,液态冷板,热界面材料,AIR DUCTS GASKETS,振动支座,LABELS,风扇,FOAM TAPE,SEALING,保护膜,标籤,THERMOSIPHONS,PARTICULE FILTERS,CUSTOM TAPES,VIBRATION MOUNTS,散热器,热虹吸,OPTICALLY CLEAR ADHESIVES,KEYPAD,按钮盖,IP SEALS,显示组件,ENCAPSULATED GRAPHITE SHEETS,THERMAL INTERFACE MATERIALS,保护胶带,CONDUCTIVE AIR TO AIR HEAT EXCHANGER,柔性热管组件,定制O型圈,窗组件,门封条,压铸散热器,VIBRATION ISOLATORS,CABINETS,LIGHT ENHANCEMENT FILMS,VAPOR CHAMBERS,WINDOW ASSEMBLIES,POLYMERIC INSULATORS,钮扣,FLEXIBLE HEAT PIPE ASSEMBLIES,HEAT SHIELDING,散热膏,MOLDED MOUNT BUMPERS,GASKETS,超薄蒸汽室,电气绝缘,通风垫圈,SOLIMIDE FOAMS,STAMPED DAMPERS,换热器,标准软管,蒸汽室,PROTECTION FILMS,THERMALLY CONDUCTIVE INSULATORS DISPLAY GASKETS,封印,SHROUDS,ID TAGS,隔热板,橱柜,裹尸布,EMI/ RFI GASKETING,PARTICULE GUARDS,EMI/RFI垫圈,压敏胶带,风冷机箱,空气挡板,DOOR SEALS,CUSTOM MOLDINGS,RADIATOR,DISPLAY GASKETS,微粒防护装置,光增强膜,LAMINATING TAPES,ID标签,CUSTOM O-RINGS,风管垫片,导热绝缘体显示垫圈,STANDARD HOSES,HEAT SPREADERS,PRESSURE SENSITIVE ADHESIVE TAPE,O-RINGS,BLOWERS,RADIATORS,DISPLAY COMPONENTS,ULTRA THIN VAPOR CHAMBERS,光学透明粘合剂,双涂层胶带,HEAT SINKS,角帽,ELECTRICAL INSULATION,HEAT SHIELDS,ISOLATORS,钢丝网,散热器安装硬件,PROTECTIVE FILMS,THERMAL GREASE,隔热层,WIRE MESH,模制安装保险杠,仪表板密封件,钩扣件和环扣件,HEAT SINK MOUNTING HARDWARE,STICKERS,THERMAL MODELING SOFTWARE,小键盘,DIE CAST HEAT SINKS,显示器垫圈,CORNER CAPS,HOOK FASTENERS LOOP FASTENERS,HEAT EXCHANGERS,隔离器,PROTECTIVE TAPES,LIQUID COLD PLATES,聚酰亚胺泡沫,隔振器,泡棉胶带,微粒过滤器,FAN,AIR COOLED CHASSIS,聚合绝缘子,BUTTON COVERS,垫片,CUSTOM HOSES,BUTTONS,定制线脚,HOME THEATER,ENTERTAINMENT,手持式,器具,消费电子,SMART WEARABLES,家庭影院,AIR COOLING,LIQUID COOLING,磨损保护,液体冷却,CONSUMER ELECTRONICS,内政部,智能家居类,APPLIANCES,SMART HOME,WEAR PROTECTION,娱乐,HOME OFFICE,游戏,空气冷却,HANDHELD,GAMING,智能可穿戴设备

2021/11/17 - 商品及供应商介绍代理服务技术支持采购服务

Thermal Interface Solutions Laird（莱尔德） designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Laird公司专注于设计和制造针对无线和其他高级电子产品应用的定制化、高性能产品。其热接口解决方案包括填充材料、相变材料和导热膏等，旨在解决电子设备的热管理问题。这些产品广泛应用于电信、IT、汽车、公共安全、消费、医疗、铁路、采矿和工业市场。Laird提供多种性能的产品，以满足不同设计挑战，并支持各种制造场景。

LAIRD - DISPENSABLE GAP FILLERS,GAP FILLERS,ELECTRICAL INSULATORS,THERMAL INTERFACE MATERIALS,热界面材料,同频广播增力机,可分配的填隙材料,GRAPHITE MATERIALS,电绝缘体,垫片,THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARD,导热印刷电路板,石墨材料,GAP FILLER,TGREASE 980,TGARD 20,TFLEX HD400,TPCM HP105,TFLEX HD90000,TPCM 780SP,TPLI 200,TGARD 400,HTD04,HTD06,TGARD 3000,TFLEX300TG,HTD03,TPUTTY 502,TGARD TNC-4,TPUTTY 508,TGREASE 300X,TGARD 230,TGON 9070,TFLEX CR200,TFLEX 600,TGARD 5000NT1,TFLEX UT20000,TPCM 580SP,TGON 9100,TGON 9025,TPCM 580S,TGREASE 880,TGREASE 1500,TFLEX HD300,TPCM 900,TFLEXHD300,TFLEX HD700,TPCM 580,TFLEX P300,TFLEX P100,TFLEX SF600,TFLEX SF800,TPCM 780,TGARD 300,TGARD 220,TGARD 100,TGARD 500,1KA06,TGON 9017,1KA08,1KA04,TGARD 5000,TPCM 200SP,TGREASE 2500,TPCM 750,TPUTTY 403,TPUTTY 607,SLIM TIM 10000,TFLEX 300,TFLEX HR400,TGON 9040,TGARD 210,TGARD K521-2,TGARD K521-3,TMATE 2900,TGARD K521-1,TFLEX HR600,ABS制动系统,VOIP电话,打印机消费者,SWITCHING MODE POWER SUPPLIES,军事的,直流/直流变换器,LCD PDP TELEVISIONS,DISPLAYS,AUTOMOTIVE,电力发电机,ABS BRAKING SYSTEMS,LIGHTING BALLASTS,PORTABLE DEVICES,CONSUMER,基站,功率转换器,日间行车灯,MEMORY MODULES,STREET LIGHTING,IT,车大灯,LIGHTING,液晶等离子电视,MOTOR CONTROL SYSTEMS,LED LIGHTING,GAMING SYSTEMS,POWER SEMICONDUCTORS,动力转向模块,服务器,MEDICAL,大型电信交换硬件,停车照明,电信,DAYTIME RUNNING LIGHTS,INDUSTRIAL ELECTRONICS,INSTRUMENTATION,照明镇流器,POWER SUPPLIES,LCD LED背光单元,SOLID STATE DRIVES,建筑照明,控制器,移动计算,VIDEO COMPONENTS,AUDIO COMPONENTS,SIGNAL LIGHTING,音频组件,TELECOM,路灯,固态硬盘,VOIP PHONES,笔记本电脑,内存模块,RCHITECTURAL LIGHTING,POWER STEERING MODULES,DISPLAY,不间断电源装置,WIRELESS INFRASTRUCTURE,DC/DC CONVERTORS,INDUSTRIAL VOLTAGE REGULATORS,医学,汽车,刹车灯,照明,视频组件,AEROSPACE,HARD DISK DRIVES,CONTROLLERS,太阳能光伏发电,MILITARY,BRAKE LIGHTS,微波无线电,显示器,POWER SUPPLIES,路由器,信号照明,HEADLIGHTS,BASESTATIONS,PARKING LIGHTING,手持设备,功率转换设备,电机控制系统,显示,工业电子,仪表,NOTEBOOKS,SOLAR VOLTAIC,台式机,消费,汽车控制单元,CONSUMER ELECTRONICS,MOBILE COMPUTING,COMPUTERS,开关电源,游戏系统,工业稳压器,SCANNERS,INDUSTRIAL,消费电子,航空航天,功率半导体,MICROWAVE RADIO,硬盘驱动器,PRINTERS CONSUMER,SERVERS,便携式设备,LCD LED BACKLIGHTING UNITS,LIGHTING,POWER CONVERSION EQUIPMENT,ECTRICAL POWER GENERATORS,扫描仪,ROUTERS,HANDHELD DEVICES,工业,LARGE TELECOMMUNICATIONS SWITCHING HARDWARE,HIGHWAY LIGHTING,AUTOMOTIVE CONTROL UNITS,公路照明,UPS UNIT,LED照明,POWER CONVERTERS,DESKTOPS,电源,计算机,无线基础建设

2017/12/05 - 技术文档代理服务技术支持采购服务