What is the Difference between CPU and MCU?

2024-10-18 SLKOR Official Website
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Differences Between CPU and MCU


1. Definitions

CPU (Central Processing Unit): The CPU is the core component of a computer system, responsible for executing instructions and processing data. It is typically used in systems with high performance requirements, such as personal computers, servers, and high-performance computing devices.


MCU (Microcontroller Unit): An MCU is a single-chip system that integrates a processor core, memory, and peripherals, designed specifically for control applications. MCUs are commonly used in embedded systems such as home appliances, automotive electronics, and industrial control.

 

2. Structure and Composition

CPU:

Processing Core: Typically has one or more powerful processing cores capable of executing complex calculations.


Memory: CPUs usually rely on external memory, such as RAM and ROM. Their access to memory is fast but requires additional circuitry for connections.


Peripheral Interfaces: CPUs themselves do not contain many external interfaces and often require other components on the motherboard for peripheral connectivity.


MCU:

High Integration: MCUs typically integrate the processor core, RAM, ROM (or flash memory), timers, analog-to-digital converters (ADC), general-purpose input/output pins (GPIO), etc., on a single chip.


Low Power Consumption: MCU designs usually emphasize low power consumption, making them suitable for battery-powered devices.


Rich Peripherals: Due to the integration of various peripheral interfaces, MCUs can directly connect to sensors, displays, and other devices, simplifying circuit design.


3. Performance

CPU:

High Performance: CPUs generally have higher clock speeds and stronger computational capabilities, able to handle complex tasks and larger datasets.


Multitasking: Modern CPUs support multithreading and multi-core technologies, enabling simultaneous processing of multiple tasks and improving system responsiveness.


MCU:

Performance Meets Specific Needs: MCUs have relatively lower computational power, suitable for simple control tasks such as monitoring sensor data and controlling motors.


Real-time Capability: MCUs perform well in real-time control, quickly responding to external events.


4. Application Areas

CPU:

Personal Computers: CPUs are core components of desktop and laptop computers, running operating systems and various applications.


Servers: In data centers and cloud computing environments, CPUs handle large data requests and complex computational tasks.


MCU:

Embedded Systems: MCUs are widely used in home appliances, automotive, medical devices, and industrial automation, typically for executing specific control tasks.


Internet of Things (IoT) Devices: With the development of IoT technology, MCUs have become the core of many smart devices, responsible for data collection and control operations.


5. Development and Programming

CPU:

Complex Programming Environment: Developers often use high-level languages (such as C++ and Java) for programming, relying on complex operating systems (like Windows and Linux) to manage resources.


Large Software Ecosystem: Due to their use in general computing, CPUs have a relatively mature software ecosystem with numerous development tools and libraries.


MCU:

Simplified Programming Environment: MCUs are typically programmed using C or assembly language, and the development environment is relatively simple.


Embedded Development Tools: Developers can use specific IDEs (Integrated Development Environments) and debugging tools to focus on hardware control and real-time responses.


6. Cost

CPU:

Relatively High Cost: Due to complexity and performance, CPUs usually have a higher cost, especially in high-performance computing scenarios.


MCU:

Low Cost: The production cost of MCUs is generally lower, making them suitable for mass production and low-cost embedded applications.


Conclusion

In summary, there are significant differences between CPUs and MCUs in terms of structure, performance, application areas, development environment, and cost. CPUs are suitable for scenarios requiring high computational power and multitasking, while MCUs are better suited for low-power, specific function embedded applications. Choosing the appropriate type of processor based on specific needs is an important decision in electronic design and system development.

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本文由雪飘梦飞转载自SLKOR Official Website,原文标题为:Q123. What is the difference between CPU and MCU?,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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SERIES,RS-AFS60LB02,LU-46,LD-E,PMT-12V150W2CA,DVP-15MC,DOP-103WQ,LD-N,DVS-G928W01,PCI-DMC-B02,DPM-M,PCI-DMC-B01,DRS40L3SS1BN002,DMV-CL,PJ-24V100WBNA,ECM-PU212,PMT-48V100W2BA,LU-S,DMV-CC,DMV-CL12MGM008,DRP-24V240W2BN,AX-308E,DPA,ECM-PU211,R1-EC5614D0,DPB,DVW-ANT,DOP-100,AHCPU560-EN2,PMT-30V150W2BA,DVPDNET-SL,DOP-115WX,PMT2,PMT-36V200W2BM,DAH2000H,DVW-W02W2-E2,PMT-D1V75W2CA,DVP08XN211R,DVP08XN211T,DPM-C,DPM-D,DRC-24V10W1AZ,ESP-S,PMT-30V150W2CA,LU-26,VTSCADA,PCI-DMC-A02,DMV-CL12MGC008,DRP-24V480W1CAN,DRS60L3,ECM-PU433,ECM-PU432,PMT-12V50W2BA,PJ-24V5OWBNA,DRS60L6,ESP-E,ECM-PU435,PMT-12V200W2BM,PMT-D1V75W2BA,PJ-12V50WBNA,ECM-PU434,PMT-12V200W2BR,PMT-36V75W2BA,AMBD,ECML-S2504,IFD8540,LU-33,AS-E,ECML-S2508,DRS60LC,ECML-S2506,AS-B,DVP04AD-SL,PMT-24V200W2BR,ASDA-B3,PMT-24V200W2BM,ASDA-B2,PMT-36V150W2BR,PMT-48V350W2BM,DVP-EH3 SERIES,ASDA-A3,DRS,PMT-48V350W2BR,DVP-SV2,DRP024V240W1AA,PJB,DRV,PCI-L221 SERIES,PMT-24V100W2BA,PJH,PJL,PMT-36V150W2BA,DOP-107BV,R1-EC70F2D0,IFD9503,IFD9502,ECML-S3505,DRP024V060W1AA,PMT-48V200W2BM,ECML-S3506,PMT-12V350W2BM,PMT-12V350W2BR,PJU,IFD9506,ASDA-M SERIES,PJT,DVP-F422,ASDA-A2,DMV-CL20MGMO05,DTM-CT030,ECM-PFC8,DRP048V060W1BN,DRV90L7,DT3,PMT-24V75W2BA,MH300,ASDA-S,DVP-FEN01,DTA,IFD8520,DTC,DVP08XP211R,ASDA-M,DTB,DTE,LCP-1FE,DTK,ASDA-B2-F SERIES,DTM,DRP024V060W1AZ,PJ-12V15WBNA,DOP-107EG,DVPPF01-S,DTS,DTM-DOR,PMT-48V150W2BA,DTV,DRP012V060W1AA,RS-AFS60LA01,DTM-DOV,AS324MT-A,DVP08XP211T,RS-AFS60LA06,RS-AFS60LA05,RS-AFS60LA04,PMT-24V150W2CA,LA-S8,LA-S7,DOP-107DV,DVS-G112,DRC-24V30W1AZ,LA-S4,TP04G-AL2,LA-S6,PIC-DMC-B03,LA-S5,LA-S,RTU-ECAT,DTM-DOC,CSJ,DVS-G116,DRP048V240W1BN,PMT-24V150W2BA,DRP-24V120W2BN,DRP024V240W1BN,PJB-24V300WBNA,PMT-48V150W2CA,DRS80LCSS1BN002,DVP-SS2,PMC,PMF,DMV-CL5M0GCO23,DIASECS,LA-SB,LA-SA,ASD-SD3,PMT-30V75W2BA,PA,CTA,PMT-12V150W2BA,PMT-36V150W2CA,DIALINK MINI,DOP-107CV,PMR,DVP-EX2,MH2,PMT-48V35W2BA,R1-EC70E2D0,PMU,DVS-G106,PJ,DOP-112WX,DMV-CL20MGC005,DVP,DLAENERGIE,DRC-12V10W1AZ,PS,CLIQ M SERIES,DMCNET,AS516E,DRP024V120W3BN,DOP-105CQ,NC30EB,DMV-CL6M3GC016,TP04P,PMT-36V50W2BA,PJB-24V100WBNA,DMV-CL1M6GM060,DRS70L6SS1BN002,AH10SCM-5A,DOP-108IG,IFD8510A,PMT-24V350W2BM,ASDA-A3-E,PCI-DMC-F02,ASDA-A3-F,TRU-PD01,DRS6016SS1BN002,PMT-24V350W2BR,DTMR08,DOP-107EV,DTMR04,DVP16XP211R,DVP-F232,DVP16XP211T,DOP-H,DIAENERGIE,IED-S,DMV2000,DOP-107IV,DVP06PT-E2,ECML-S3206,ECM-PF802,ECM-PF803,ECML-S3208,PMT-48V75W2BA,ECM-PF801,DRS40L3,DVP-10MC,ASD-CNFS0808,ECML-S3204,ECM-PF804,DRP012V100W1AA,DVS-G005I00C,DVS-G005I00A,DVPPF02-H2,DVPDT02-H2,ASDA-A2-M,DMV-CC1M6GC075,ASDA-A2-F,DRV70L7,DIAVISION VGR,DVP02DA-E2,ASDA-A2-E,PMT-48V200W2BR,MS300,RTU-485,EA-CP16,RS60H6,DOP-110WS,DX-2100RW,DX-3001H9-V,DRP024V240W3BN,DVP-SX2,DRP024V480W3BN,ASDA-B3-F,ASDA-B3-E,AS524C,PJH-36V300WBBA,DMV-CC1M6GM075,ECM-PU381,ASD-CNSC0026,ECM-PU383,ECMA,ECM-PU382,ECM-PU384,DRP024V120W1BN,PJ-24V150WBNA,DMV-CC400GM290,DRP-24V120W1CAN,DVP01LC-SL,PMT-15V75W2BA,DOP-103BQ,DVP24XP200T,DVP24XP200R,PMT-36V35W2BA,AX-316E,DMV-CL6M3GM016,MH300-L,CFP2000,DMV-CL1M6GCO60,ECML-S2005,DVP32XP200T,DVS-G402,ECML-S2004,DRB-24V040ABN,DVS-G401,ECML-S2003,DVP32XP200R,PMT-48V50W2BA,DVP04DA-SL,AFE2000 SERIES,DVP06XA-E2,ASDA-B2-F,DRS70LCSS1BN002,DVPSCM52-SL,DMV-CC400GC290,DRASIMUCAD,PS-F,AX3,IFD8500A,DVP-F485,DVS-G512,AX8,DTME04,DIAEMS,ESP S,PJH-36V300WBCA,DVP-ES2 SERIES

选型指南  -  台达  - 20220420 PDF 英文 下载

Littelfuse NPI Summary

型号- 54100 SERIES,SZSMF4L SERIES,483A SERIES,SP3022-01ETG-NM,59001,IXYK85N,LS0502SCD33,501A,LS05006VPQ33 SERIES,527 SERIES,HWB12 SERIES,MIDI® 498 IL SERIES,SP0115-01UTG,WLTM,658 SERIES,PXXX0S3N-A,IXTY2P50PA,LQ05041QCS6,WLTC,483,SP0115-01ETG,RCM,CG8 SERIES,LQ05022QCS4,PXXX0S3N-A SERIES,LQ05041QCS6 SERIES,483 SERIES,MIDI® 498,59143,DCNLB SERIES,IXYN110N120C4H1,SZSMF4L,CG9,CG8,IXYN110N,LQ05041RCS6 SERIES,WSTC,QS8004XHX,59155,HWB12,59156,54140,LS0504EDD12,10EV SERIES,MEGA® FLEX,IXTY2P50PA SERIES,WSTM,828,407A,PICO® II 521,LQ05041RCS6,LS24062RQ23,WPB,440A,IXYH30N,WPC,59040,3425L,LS24062RQ23 SERIES,SMF4L-T1G SERIES,LS0504EDD12 SERIES,AQ27COM-02JTG,SC24COM-01ETG,RCM SERIES,PXXX0S3N SERIES,828 SERIES,441A,IXYH55N,DCNLM,TPSMC SERIES,DCNLJ,DCNLH,DCNLB,FDA117,PGB2 0201,LS12052BD33,LS2405IDD23 SERIES,PXXX0S3N,LQ05021QCS4 SERIES,IXYH40N,IXYK85N120C4H1,408 SERIES,656 SERIES,LQ05021RCS4 SERIES,QVXX12XHX SERIES,SZ3KASMC,SV8012DRP,EVCC-01,LS12052BD33 SERIES,EVCC,ZCASE® FHZ,MIDI® 498 SERIES,AQ24COM-01,AQ3130E-01ETG,150520 SERIES,10EV,MATE-12B,WPB-A,TPSMB SERIES,QVXX25XHX,54140 SERIES,SP4338,DCNHR,QS8004XHX SERIES,3425L SERIES,881,LTKAK2-L,885,656 & 658,IXYN85N,526,527,408,AQ24COM-02,LPF,QVXX25XHX SERIES,CG9 SERIES,IXYH55N120C4H1,MDMB,SV8012DRP SERIES,MIDI® FLEX,HWB6 SERIES,MDMA,WPC-A,57041 SERIES,422A,L4CA-A,656,SV8012D,PGB2 0201 SERIES,IXYH30N120C4H1,526 SERIES,DCNHR SERIES,WJC-A,Q6035NAH5RP SERIES,20EV,LQ05021RCS4,AQ3118E-01ETG,TPSMC300A,SPDN,MEGA® 298,SP0115-01UTG SEREIS,LTKAK2-L SERIES,MIDI® 498 IL,SZ3KASMC SERIES,SP4338-02WTG,HWB6,MITI-7L,DSR,IXYN85N120C4H1,SP0115-01ETG SERIES,MISM-7L,CPC3981Z SERIES,MEGA® SN,DCNLJ SERIES,K12,MIDI® 498IL,MEGA 298,437A,DSR SERIES,150520,CPC3981Z,LQ05022QCS4 SERIES,SPDN SERIES,TPSMD400CA-A,LPF SERIES,ZCASE® FHZ SERIES,Q6035NAH5RP,57041,438A,TTP,WJC,LQ05021QCS4,DCNLH SERIES,SC24COM-01ETG SERIES,SMF4L-T1G,SSA,DCNLM SERIES,L4CA,TPSMC,L4CL-A,TPSMB,QVXX12XHX,483A,L4CC,TPSMD,LS2405IDD23,SSA SERIES,TPSMD SERIES,PICO® II 521 SERIES,MXB12R600DPHFC,LS05006VPQ33,54100,L4CL,IXYH40N120C4H1

商品及供应商介绍  -  LITTELFUSE  - 2024/2/22 PDF 英文 下载

【应用】解析基于兆易创新GD32F130系列MCU设计冰箱压缩机变频板方案

本文萨科微(SLKOR)介绍变频板可用于冰箱压缩机变频控制,方案基于兆易创新GigaDevice的GD32F130系列MCU设计,MCU配备Cortex-M3内核,可软件实现PI控制,SVPWM生成器,电机状态观测器,变频板由6个Power MOSFET搭建成。

应用方案    发布时间 : 2021-10-24

【应用】SLKOR与国产MCU合作推出直流变频热水循环泵方案,多种运行模式支持500ms快速启动

采用SLKOR的MCU GD32E230C8T6设计的直流变频热水循环泵控制器系列方案,采用GD32E230C8T6芯片作为主控。提供110V和220V两种电源模式,采用正弦波矢量控制算法,具有启动快速平稳,少斩波高载频、噪音低、温升低、功率控制稳定的特点。

应用方案    发布时间 : 2021-10-20

Key Facts About Parker FY2019

型号- CHO-FORM 5550,SOFT SHIELD 4850,CHO-FORM 5552,CHO-BOND® 584-29,THERM-A-GAP GEL,CHO-FORM 5538,CHO-MUTE 9025,CHO-MUTE 9005,SOFT-SHIELD 3700,SOFT-SHIELD 4800,CHO-BOND® 1075,CHO-BOND® 580-208,SOFT-SHIELD 4850,CHO-FORM® 5528,CHO-SEAL 2557,CHO-SEAL 2532,SOFT-SHIELD 3500,CHO-BOND® 1038,CHO-SEAL 2542

商品及供应商介绍  -  PARKER CHOMERICS PDF 英文 下载

THERMAL INTERFACE SOLUTIONS

型号- TPLI™ 200,7000,TPUTTY™ 607,TGARD™ 500,P100,TFLEX™ HD80000,P300,TGARD™ 220,210B,TPUTTY™ 403,TFLEX™ HD7.5,TGREASE™ 300X,230,SF10,2500,910,TFLEX™ CR607,TFLEX™ P100,TPUTTY™ 910,TFLEX™ 300,TFLEX™ CR900,TGARD™ 230,TFLEX™ P300,TGARD™ 210B,B200,TPCM™ 7000,SF600,200,TNC-4,TGARD™ TNC-4,600,TFLEX™ SF10,SF800,403,CR607,TFLEX™ B200,607,SLIM TIM™ 10000,TPUTTY™ 508,5000,TPUTTY™ 502,HP34,HD80000,TFLEX™ HD700,TFLEX™ CR350,TGREASE™ 2500,300X,HD7.5,TFLEX™ HD300,TPCM™ 780,TPCM™ 580,208B,TFLEX™ HR600,TGARD™ 208B,HD300,TFLEX™ 600,CR350,TFLEX™ SF800,UT20000,HD700,TPCM™ 5000,580,TGARD™ K52-3,TFLEX™ SF600,780,HR600,220,TFLEX™ HP34,TGARD™ K52-2,300,TGARD™ K52-1,K52-2,K52-1,500,502,TFLEX™ UT20000,K52-3,10000,CR900,508,TGARD™ 5000

商品及供应商介绍  -  LAIRD  - FEB2023 PDF 英文 下载

【分享】本土MCU产业:RISC-V与Arm交锋的正面战场

要理解本土RISC-V快速发展的底层逻辑,先要了解MCU行业的造芯模式。

行业资讯    发布时间 : 2024-06-27

Thermal Grease 21-430H

型号- 21-430H,21-4XXH-YYY,21-430H-055M,21-430H-1000,21-430H-2000

数据手册  -  中石科技  - Version 2022 Jun.  - 2022 Jun. PDF 英文 下载

Summary of Chip Encapsulation Type-Is it Used with You?

Chip packaging function: The chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and it is also a bridge between the internal world of the chip and the external circuit-the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, packaging plays an important role in CPU and other LSI integrated circuits. There are too many types of chip packages in the world.

技术探讨    发布时间 : 2024-03-13

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高热流密度液冷板定制

定制液冷板尺寸5mm*5mm~3m*1.8m,厚度2mm-100mm,单相液冷板散热能力最高300W/cm²。

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线圈扼流圈定制

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