The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
Thermal gap filler pads or simply gap pads are designed to be used as an interface material between heat-generating components (CPUs, GPUS, memory modules, radar arrays, etc.) and heat-dissipating components (heat sinks, cold plates, heat pipes, vapor chambers, etc.). And as computing output has grown, so has the need to dissipate heat generated by these high-power electronics. The problem is that high thermal conductivity alone is no longer enough to drive the adoption of gap pads.
Thermal Performance isn't Enough
A decade ago, 4-5W/m-K was considered to be "high" thermal conductivity. Computing and processing units didn't really need thermal interface materials to be much more efficient than this to effectively dissipate heat and extend the life of electronics. Since then, thermal performance requirements have doubled and conductivity levels of 8+W/m-K are needed. The challenge for product designers and engineers though is that thermal performance is no longer the only factor to consider, with a handful of other key properties that must be addressed:
1. Low Compression Force or High Stress Relaxation – gap pads are meant to fill in gaps caused by assembly or manufacturing tolerances. A gap pad with a low compression force requirement means that less force is required to achieve effective heat transfer. This also means that designers have more design flexibility and minimize risk of damage to underlying components. Gap pads with a high degree of stress relaxation will dramatically reduce the stress on underlying components as the gaps are held in a compressed state.
2. Low Silicone Oil Bleed – a vast majority of gap pads are manufactured with a base polymer of silicone because of its physical properties, wide temperature range, foreign material compatibility, and ease of use in the manufacturing process. The drawback is that silicone-based gap pads may expel silicone oil. Using advanced processing, gap pads with minimal oil bleed have been designed to reduce oil bleed or oil migration.
3. Compatibility with Automated Assembly Processes – Modern electronics are manufactured in volumes of tens or hundreds of thousands or even millions, regardless of whether they are for the IT, Telecom, Consumer Electronics, Automotive, or Life Science markets. Modern gap pads need to be compatible with high volume manufacturing practices such as Pick-and-Place technology to keep up with demand.
The challenge with balancing these factors is that they are often competing. High thermal performance requires high levels of ceramic fillers, increasing the hardness of the pads and the stiffness. Low compression force pads can be too soft to use with pick and place robotics.
The Modern Solution
This is where THERM-A-GAP PAD 80LO from PARKER CHOMERICS answers the call. By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3W/m-K, PAD 80LO is designed for high heat-output components. "LO" in the product name stands for “Low Oil” and indicates measurably less silicone oil bleed compared to leading competitors. PAD 80LO is designed for high volume, robotic assembly processes and can be provided in sheets, cut to custom shapes and sizes, and packaged in tape and reel or application-specific packaging. This makes it compatible with Pick-and-Place technology for high throughput automation and manufacturing. Despite a hardness of 60 Shore 00 which is higher than some gap pads, it was formulated to exhibit a high degree of stress relaxation to reduce the compression forces on underlying components.
AI Processing Hardware. Telecommunications Infrastructure. Advanced Automotive Electronics. Mission Critical Avionics and Defense Electronics. IoT Modules. Wearable Medical Devices. PAD 80LO represents a modern solution to the next generation of electronics thermal management.
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本文由Vicky转载自PARKER CHOMERICS Official Website，原文标题为:The Next Generation of Thermal Gap Filler Pad，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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Parker Chomerics（派克固美丽）热界面材料（用于电子产品散热）选型指南
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型号- PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10
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描述- 本资料详细介绍了Parker Chomerics公司热界面材料的保质期数据。内容包括不同产品的原始保质期（以月为单位）和可用的保质期延长选项。资料还提供了如何重新认证热产品的流程，包括测试费用、材料提交要求、典型交货时间和认证结果的处理。
型号- CHO-THERM 1674 W/PSA,THERM-A-GAP HCS10A,THERMATTACH T405,THERMAL GREASE T650,THERM-A-GAP 8010,THERM-A-GAP HCS10G,THERMATTACH T404,CHO-THERM T609 W/PSA,THERM-A-GAP A580,THERM-A-GAP G570,THERM-A-GAP GEL 45,THERM-A-GAP G174,CHO-THERM 1680 W/PSA,THERM-A-GAP G569,THERMFLOW T725,CHO-THERM T500,CHO-THERM T500 W/PSA,CHO-THERM 1678 W/PSA,THERMFLOW T766,T-WING,THERMATTACH T418,THERM-A-GAP A579,THERMATTACH T412,THERM-A-GAP A574,THERM-A-GAP T174,THERMATTACH T414,THERM-A-GAP A174,THERM-A-GAP A570,CHO-THERM 1646,THERM-A-FORM CIP 35,CHO-THERM 1677 W/PSA,CHO-THERM 1671 W/PSA,CHO-THERM T441 W/PSA,THERMATTACH T410,THERMATTACH T411,THERMFLOW T777,THERM-A-GAP A569,THERMAL GREASE T670,CHO-THERM 1671,CHO-THERM 1674,CHO-THERM 1677,THERM-A-GAP G274,CHO-THERM 1678,CHO-THERM T444,CHO-THERM T441,THERM-A-GAP TC50,THERM-A-GAP 976,THERMFLOW PC07DM-7,CHO-THERM T609,THERMAL GREASE T660,THERM-A-GAP T630,THERM-A-FORM T644,THERM-A-GAP GEL 30,THERM-A-FORM T646,THERM-A-GAP 974,THERM-A-FORM T647,THERM-A-GAP T274,THERM-A-GAP A274,THERM-A-GAP T636,THERM-A-GAP G580,THERM-A-GAP T635,THERM-A-FORM 1641,THERM-A-FORM 1642,THERM-A-GAP G574,THERM-A-GAP G579,THERM-A-GAP G974,THERMFLOW T557,THERMFLOW T710,THERMFLOW T558,THERM-A-FORM T642
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请问固美丽569、570、579、580的主要区别和适用场景？
您好，固美丽导热垫片569，超柔软，适用于贴合性好的场景；570最适合成型复杂的零件和减振；579具备优异的散热性能和贴合性，热导率高达3 W/m-K，较低的挥发性；580最适合成型复杂的零件和减振，导热率达3.0W/mk，释气量低至0.18 % TML(0.05% CVCM) 。具体参数可见：THERM-A-GAPTM HCS10, 569, 570, 579, 580 Thermally Conductive Gap Filler Pads 数据手册
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THERM-A-GAPTM HCS10, 569, 570, 579, 580 Thermally Conductive Gap Filler Pads
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型号- HCS10,THERM-A-GAP™ 570,69-XX-20684-ZZZZ,69-XX-20687-ZZZZ,570,69-XX-21259-ZZZZ,THERM-A-GAP™ 579,69-XX-20698-ZZZZ,579,69-XX-20675-ZZZZ,69-XX-20672-ZZZZ,69-XX-27070-ZZZZ,THERM-A-GAP™ HCS10,69-XX-20991-ZZZZ,THERM-A-GAP™ 580,69-XX-20686-ZZZZ,69-12-XXXXX-A569,69-XX-27082-ZZZZ,580,62-20-0909-A579,61-07-0909-G570,THERM-A-GAP™ 569,69-XX-20685-ZZZZ,69-XX-27072-ZZZZ,569,69-XX-27083-ZZZZ
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