Building a Stickier Smart Home Business – 7 Facts ISP and Telecom Leaders Should Know about IoT

2024-11-08 SILICON LABS Official Website
multiprotocol wireless SoCs,multi-protocol chip,MG21,MG24 multiprotocol wireless SoCs,multi-protocol chip,MG21,MG24 multiprotocol wireless SoCs,multi-protocol chip,MG21,MG24 multiprotocol wireless SoCs,multi-protocol chip,MG21,MG24

Broadband internet subscriptions once seemed like a forever-growing cash generator for service providers. Unfortunately, the growth has plateaued in most developed markets, and the leading ISPs and telcos are now integrating new IoT capabilities on their Wi-Fi gateways in anticipation of the Smart Home transformation. However, simply putting a Thread 802.15.4 wireless chip in a CPE and rolling it out to millions of subscribers is not yet enough for a viable smart home business. In this blog, Christopher Ince from SILICON LABS explains seven aspects of IoT that ISP and telco leaders should consider in order to build a stickier smart home business.

The Broadband Plateau

In just two decades, the number of global fixed broadband connections increased nearly eight-fold from 200 million to 1.5 billion. This historical growth era, which really took off at the advent of the millennium, has churned fortunes for internet service providers (ISPs) and telcos worldwide. Great cash cow, you might think. Well, it had its moment. Today, the fixed broadband markets in most developed countries have saturated, according to the OECD Broadband Portal. This has led to intense competition, increasing customer acquisition costs, price erosion, and churn, hitting the service providers' bottom lines. In the USA alone, nearly 3,000 broadband ISPs are fighting for the dollars Americans pay every month to get the information highway flowing into their homes.

 

Smart Home Benefits to Internet Service Providers (ISPs)

The global ISP market was valued at USD 390 billion in 2022 and is projected to reach USD 566 billion by 2032, expanding at a CAGR of 3.9% during this period. Despite promising industry forecasts, the old broadband growth strategies do not apply anymore, and service providers need new ways to grow business.


Bundling new smart home services and IoT connectivity technologies into broadband subscriptions has quickly become one of the most promising ways for the leading ISPs and tTelcos to accelerate their business.


Smart home and IoT provide many clear benefits to service providers – they can become the complete provider of wireless IoT home connectivity alongside Wi-Fi, managing and optimizing connectivity for all types of IoT devices used in homes today and in the future. Owning the home IoT infrastructure, e.g., OpenThread Border Router (OTBR) capability, allows service providers to claim a strategic position in the greater smart home ecosystem and do meaningful and sustained business alongside global smart home brands such as Amazon, Apple, Google, and Samsung. Smart Home and IoT services also help service providers enable new revenue sources, improve customer value-add, and strengthen customer retention, thus improving subscription business and reducing churn.

Figure 1 Internet Service Providers are transforming their legacy Wi-Fi CPE base into a multi-protocol IoT home infrastructure by adding Thread 802.15.4 and other low-power wireless protocols to complement Wi-Fi.


Seven IoT Aspects ISP and Telco Leaders Should Consider

We are witnessing a trend of ISPs and telcos recognizing that it is their role to own the wireless IoT infrastructure of connected smart homes. However, simply integrating a Thread 802.15.4 wireless chip inside Wi-Fi home gateways and rolling them out to millions of subscribers is not yet enough. There are seven critical aspects of IoT that ISP and telecom leaders should consider before locking their smart home strategies:


1.IoT Infrastructure – The existing legacy CPEs typically support Wi-Fi connectivity only. However, the smart home IoT device market is proliferating rapidly, and Wi-Fi is not optimal for all device types. In fact, many emerging IoT devices will use a more energy-efficient and lightweight mesh connectivity technology such as Thread. So, building a scalable and future-proof IoT home infrastructure that supports Wi-Fi, Thread, and even other wireless IoT connectivity technologies such as Bluetooth Low Energy (LE), is the first step service providers should consider. How to choose the right set of IoT technologies that allow you to cover all home IoT connectivity needs today and in the future? Silicon Labs has years of experience in helping service providers and gateway manufacturers to enable optimized wireless multi-protocol IoT solutions such as OpenThread Border Router (OTBR) on gateways.


2.Matter Gateway – As described earlier, enabling wireless IoT infrastructure is the first step toward a scalable and future-proof smart home business. However, if you want to enhance your business from a mere IoT connectivity provider to offering value-added smart home applications to your customers, Silicon Labs’ multiprotocol wireless SoCsMG21 and MG24, enable the Matter Gateway capability on your CPE, allowing you to increase revenue through your own, branded Matter ecosystem, bundle devices of any manufacturer via the Matter protocol, and allow users to control them all via your App, Amazon, Apple, Google, and, Samsung.


3.Wireless Performance – Every home imposes a unique combination of wireless challenges to service providers – concrete walls, metal surfaces, windows, and other sources of interference can deteriorate user experience, burden your customer service centers, and increase operational costs. As a service provider, you must optimize IoT wireless performance on your gateways to enhance user experience, regardless of where the gateway sits in any given home environment. Silicon Labs IoT solutions are renowned for their superior wireless performance – such as the MG24 multi-protocol chip that offers the market-leading link budget and antenna diversity, delivering efficient connectivity in every corner of the home and beyond.


4.Wi-Fi Co-existence – With the legacy Wi-Fi-only home gateways, service providers didn’t have to worry about 2.4 GHz multi-radio/multi-protocol interference. However, with smart home gateways combining Wi-Fi and IoT radios such as Thread, you will face a new challenge: how to manage Wi-Fi co-existence? Silicon Labs can help you to design the most effective Wi-Fi co-existence solution on your gateway using, e.g., our advanced Packet Transmission Arbitration (PTA) and the patent-pending Signal Identifier capabilities.


5.Energy Consumption – Energy regulations such as the new, stricter EU Ecodesign Standby Regulation 2023/826 (HiNA) effective 2027, will limit the standby power consumption of consumer CPE down to ≤7W, forcing service providers to reduce the gateway power consumption radically. Silicon Labs provides you with many innovations for more energy-efficient gateway design – for example, you can allow users or network operators to turn the power-hungry Wi-Fi transceiver off and on remotely during nights, weekends, or vacations using our patent pending Thread solution, or Bluetooth LE.


6.Platform Integration – Building an IoT infrastructure that scales to millions of homes and supports new devices, services, and connectivity technologies for years to come requires seamless integration of dozens of building blocks. Managing them can become an integration nightmare. To make things easier for service providers, Silicon Labs offers an end-to-end one-stop-shop solution for building a scalable and future-proof IoT home infrastructure. This includes high-performance and ultra-low-power multiprotocol wireless processors, pre-verified wireless software stacks, tools, security, always up-to-date Matter implementation, online Matter Developer Journey, and a Connectivity Lab where you can test your gateways and devices in a friendly environment before taking the official certification tests.


7.Interoperability – A smart home solution without seamless interoperability between gateways, devices, protocols, and ecosystems is like a symphony orchestra without a conductor. If the devices are not playing the same tune, the user experience suffers, customers are frustrated, and vote with their feet. Silicon Labs has worked for decades to become the conductor of the smart home industry – we provide tested and verified wireless IoT and Matter solutions to both, gateway and device makers, allowing us to perfect our standards compliancy and system interoperability, ensuring that you can build a smart home experience where every component plays the same tune.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
  • +1 赞 0
  • 收藏
  • 评论 0

本文由飞猫警长转载自SILICON LABS Official Website,原文标题为:Building a Stickier Smart Home Business – 7 Facts ISP and Telecom Leaders Should Know about IoT,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

评论

   |   

提交评论

全部评论(0

暂无评论

相关推荐

Moving Machine Learning To The Tiny Edge

From unlocking mobile phone with facial recognition to setting spam filters to receiving product recommendations, we interact with machine learning (ML) every day. Manufacturers of a variety of products know this and are taking advantage or ML to introduce 1eature-rich, low-power products that stand out in the market.

行业资讯    发布时间 : 2023-11-28

Silicon Labs紧跟无线标准化浪潮,探讨2023年物联网市场关键趋势和技术发展态势

Silicon Labs首席技术官Daniel Cooley近期接受行业媒体专访,探讨2023年物联网市场关键趋势和技术发展态势。特别提到三个重点关注的细分市场:汽车、医疗健康和蓝牙定位,可望为整个行业带来巨大的机遇。

行业资讯    发布时间 : 2023-02-08

芯科科技MG24系列多协议SoC助力Centero工业网络,提升工业无线连接设备性能和安全性

SILICON LABS的合作伙伴Centero运用MG24多协议无线SoC提供了易于集成、兼容的端到端无线IEEE 802.15.4和802.11解决方案,从而满足严格的行业要求。其保证的延迟是安全、关键应用程序所必需的。Centero的解决方案还提供强大的数据存储和使用信息,以及预测性维护(predictive maintenance),从而提高运营效率和工厂安全性。

原厂动态    发布时间 : 2024-05-17

芯科科技为Matter设备选择最合适的开发套件,助力加速并简化工作

如果您正在为智能家居和其他生态系统连接的物联网设备开发软件和硬件,Matter协议可能是当今最令人兴奋的技术之一。对于开发人员希望使用高效的开发套件和工具来快速完成工作的需求,在这篇博客中,Silicon Labs将引导您为Matter项目评估并选用最佳的开发套件。

原厂动态    发布时间 : 2024-04-20

深圳物联网展观察:Matter&Zigbee双模参考设计助力提升市场采用率

在甫于上周圆满落幕的深圳物联网展中,Silicon Labs(亦称“芯科科技”)参与连接标准联盟(Connected Standard Alliance)的联合展台并展出基于MG26无线多协议SoC的Matter &Zigbee Concurrent参考设计,助力企业轻松应对市场变革,并持续拓展Matter标准在市场上的能见度和采用率。

原厂动态    发布时间 : 2024-10-21

芯科科技BG2x系列蓝牙SoC引领可穿戴设备创新,打造AI健康生活新纪元

随着人们对个人健康和智能生活的追求不断升温,可穿戴设备市场呈现出蓬勃发展的态势。在这个充满机遇与挑战的领域,Silicon Labs(亦称“芯科科技”)凭借其深厚的技术积累和敏锐的市场洞察,成为了行业的佼佼者。近日,芯科科技的家居和生活业务部可穿戴和生活业务经理Pranay Dixit参与了EEPW电子产品世界的访谈,就可穿戴设备市场的现状、公司战略以及技术创新等方面进行了深入探讨。

应用方案    发布时间 : 2024-04-30

芯科科技全新xG26系列记忆体容量和GPIO翻倍,扩展Matter开发支持

SILICON LABS宣布推出新的xG26系列无线片上系统(SoC)和微控制器(MCU),这是迄今为止物联网行业领先企业性能最高的系列产品。该新系列产品包括多协议MG26 SoC、低功耗蓝牙(Bluetooth LE)BG26 SoC和PG26 MCU。这三款产品的闪存和RAM容量都是芯科科技其他多协议产品的两倍,旨在满足未来物联网(IoT)的需求,以应对一些要求严苛的新兴应用,如Matter。

原厂动态    发布时间 : 2024-04-11

上海Works With大会前导,最新AI/ML和无线演示現正在深圳物联网展热映中

Works With大会 ‧ 上海站即将在10月24日展开,“芯科科技”正在8月28至30日举办的“2024年深圳物联网展(IOTE Shenzhen)”热闹展出最新的人工智能和机器学习(AI/ML)应用,以及丰富的物联网无线连接解决方案和参考设计。

原厂动态    发布时间 : 2024-09-30

【IC】芯科科技MG26多协议SoC功能全面提升,迎合Matter over Thread开发代码增长需求

SILICON LABS近期针对Matter开发的扩展需求发布了MG26多协议SoC新品,通过提升了两倍的闪存和RAM容量以及GPIO,同时添加了人工智能和机器学习(AI/ML)硬件加速器来帮助开发人员满足未来更严苛的Matter物联网应用需求,包括增加对新的设备类型和安全功能增强等的支持。

产品    发布时间 : 2024-04-25

Matter、LPWAN技术构建未来无线通信新生态

Silicon Labs(亦称“芯科科技”)作为物联网无线技术领域动化等领域提供高性能、低功耗、高安全的无线连接解决方案。近日,芯科科技主任现场应用工程师黄良军(Bruce Huang)接受EEPW无线通信专题采访,就芯科科技对未来无线通信市场的展望、新产品发布以及多协议无线通信趋势等话题进行了深入探讨。

原厂动态    发布时间 : 2024-07-23

AI融合物联网大势所趋,ML语音识别和手势控制应用分享

芯科科技作为智能、安全物联网无线连接领域的开拓者,正在致力于将AI/ML带到边缘。我们对创新的承诺导致了开创性的解决方案,它赋予资源受限的设备如MCU具备更丰富的智能功能。

原厂动态    发布时间 : 2024-09-30

芯科无线对照表

型号- NRF52840,FG23,K32W041,CC2674R10,FG25,FG28,NRF52833,NRF52832,KW45,CC1312R,TLSR922,CMT2380F29,NRF5340,CC2652R7,BG27,BG24,MG24,BG22,CC1310,MG27,MG21,CC2652,MG22

对照表  -  SILICON LABS  - 2023/12/7 PDF 中文 下载

使用EFR32开发板和OpenThread构建Thread网络

型号- BRD4304A,MGM12P,SLWSTK6000B,BRD4180A,SLWSTK6006A,BRD4166A,BRD4164A,BRD4161A,EFR32,MG21,SLTB004A,BRD4170A,MG12

用户指南  -  SILICON LABS  - v0.1  - 2021-03-31 PDF 中文 下载

Bluetooth PAwR in a Large-Scale Test Network

Bluetooth 5.4‘s Periodic Advertising with Responses (PAwR) feature addresses the need for large-scale networks, enabling efficient communication between thousands of nodes. Silicon Labs has created a test network in Finland to evaluate PAwR‘s performance, supporting up to 1500 nodes. This network helps optimize Bluetooth LE applications, particularly for electronic shelf labels, by simulating real-world conditions and analyzing node behavior under congestion.

设计经验    发布时间 : 2024-09-01

芯科科技Matter-over-Thread SoC芯片技术,优化实现“无钥匙进入”智能锁系统解决方案

Nuki和U-tec集成芯科科技(Silicon Labs)的Matter-over-Thread SoC芯片技术,优化实现了“无钥匙进入”智能锁系统解决方案。通过Matter-over-Thread,两款无线门锁系统都不需要额外的桥接或模块,即可达成在多个物联网或智能家居生态系统中运行。

应用方案    发布时间 : 2024-05-10

展开更多

电子商城

查看更多

品牌:SILICON LABS

品类:Wireless SoC

价格:¥31.7756

现货: 88,300

品牌:SILICON LABS

品类:Wireless Gecko SoC

价格:¥8.1764

现货: 104,128

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥12.9143

现货: 95,058

品牌:SILICON LABS

品类:Mighty Gecko Multi-Protocol Wireless SoC

价格:¥27.0929

现货: 90,767

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥3.5305

现货: 80,817

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥3.9026

现货: 76,305

品牌:SILICON LABS

品类:Wireless SoC

价格:¥35.3989

现货: 75,507

品牌:SILICON LABS

品类:8位MCU

价格:¥5.8534

现货: 73,121

品牌:SILICON LABS

品类:Wireless SoC

价格:¥19.9760

现货: 72,809

品牌:SILICON LABS

品类:Transceiver

价格:¥15.8878

现货: 64,259

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

现货市场

查看更多

品牌:SILICON LABS

品类:Wireless SoC

价格:¥15.1400

现货:1,455

品牌:SILICON LABS

品类:Switch Hall Effect Magnetic Position Sensor

价格:¥2.2924

现货:126,000

品牌:SILICON LABS

品类:Light Sensor

价格:¥20.3400

现货:28,003

品牌:SILICON LABS

品类:8位MCU

价格:¥4.9000

现货:12,000

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥10.1700

现货:10,000

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥3.7900

现货:3,451

品牌:SILICON LABS

品类:Mixed-Signal MCU

价格:¥11.1200

现货:1,201

品牌:SILICON LABS

品类:8 BIT MCU

价格:¥16.8500

现货:550

品牌:SILICON LABS

品类:8位MCU

价格:¥56.0000

现货:550

品牌:SILICON LABS

品类:8位MCU

价格:¥5.1900

现货:396

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

服务

查看更多

SMT贴片加工

可贴PCB板厚范围:0.6~2.0mm,也支持生产软硬接合板,拼板长宽:50*50mm~550*500mm,PCBA快速贴片支持01005CHIP元件。

最小起订量: 1片 提交需求>

SMT贴片加工/DIP插件加工

可贴片PCB尺寸50*50mm-580*610mm;PCB厚度0.3-8mm;贴装精度CHIP元件+0.03,BGA Pitch 大于0.25mm;元件尺寸0201-74*74BGA;元件高度:30mm。

最小起订量: 1 提交需求>

查看更多

授权代理品牌:接插件及结构件

查看更多

授权代理品牌:部件、组件及配件

查看更多

授权代理品牌:电源及模块

查看更多

授权代理品牌:电子材料

查看更多

授权代理品牌:仪器仪表及测试配组件

查看更多

授权代理品牌:电工工具及材料

查看更多

授权代理品牌:机械电子元件

查看更多

授权代理品牌:加工与定制

世强和原厂的技术专家将在一个工作日内解答,帮助您快速完成研发及采购。
我要提问

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

研发客服
商务客服
服务热线

联系我们

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

投诉与建议

E-mail:claim@sekorm.com

商务合作

E-mail:contact@sekorm.com

收藏
收藏当前页面